Abstract: An electronic cartridge which includes a cover that is electrically coupled to a substrate by a clip. An integrated circuit package is mounted to the substrate and at least partially enclosed by the cover. The clips and cover may be connected to a ground plane of the substrate. The cover and substrate may create a “shield” about the integrated circuit package so that any electromagnetic field that flows from the package is grounded to the substrate.

Abstract: An electronic cartridge which includes a cover that is electrically coupled to a substrate by a clip. An integrated circuit package is mounted to the substrate and at least partially enclosed by the cover. The clips and cover may be connected to a ground plane of the substrate. The cover and substrate may create a "shield" about the integrated circuit package so that any electro-magnetic field that flows from the package is grounded to the substrate.

Abstract: An improved lead-free glass or glass plus alumina ceramic sealing material composition for making compression glass sealed electrical leads in semiconductor device packages is described wherein the improved sealing material consists essentially of the following range of ingredients, by weight percent:______________________________________ Pb-Free Glass Element Composition Range Glass Plus Alumina ______________________________________ SiO.sub.2 40-50 34-50 Al.sub.2 O.sub.3 2-12 2-25 K.sub.2 O 2-6 2-6 Na.sub.2 O 5-9 4-9 Li.sub.2 O 2-6 2-6 CaO 0-4 0-4 ZnO 5-12 4-12 BaO 1-5 1-5 TiO.sub.2 2-6 2-6 B.sub.2 O.sub.

Abstract: An improved lead-free glass or glass plus alumina ceramic sealing material for making compression glass sealed electrical leads in semiconductor device packages is described wherein the improved sealing material consists essentially of the following range of ingredients, by weight percent:______________________________________ Composition Range Element Pb-free Glass (Glass plus alumina) ______________________________________ SiO.sub.2 40-50 34-50 Al.sub.2 O.sub.3 2-12 2-25 K.sub.2 O 2-6 2-6 Na.sub.2 O 5-9 4-9 Li.sub.2 O 2-6 2-6 CaO 0-4 0-4 ZnO 5-12 4-12 BaO 1-5 1-5 TiO.sub.2 2-6 2-6 B.sub.2 O.sub.

Abstract: An inexpensive glass capacitive pressure sensor. Conductive capacitor electrodes are disposed on two flat glass plates, one serving as a diaphragm, the other as a substrate. The electrodes are positioned in a spaced apart, substantially parallel relationship to form the plates of a parallel plate capacitor. The glass plates are sealed together with a sealing glass mixture to bound a volume between the conductors. The volume is at a reference pressure, preferably a substantial vacuum. Differences between the pressure to be measured and this reference pressure cause a flexing of the glass diaphragm which is detected by measuring the capacitance between the two electrodes. A suitable sealing glass mixture which provides a hermetic seal between the glass plates is comprised of, in weight percent, 8-10 SiO.sub.2, 1-2 Al.sub.2 O.sub.3, 55-60 PbO, 7-9 PbF.sub.2, 7-10 ZnO, 4-6 CdO, and 10-15 B.sub.2 O.sub.3. The sealing glass mixture must be vacuum fined to permit hermetic sealing within a vacuum.