Abstract: Adhesive assemblies and microneedle injection apparatuses comprising same. The apparatus (100) can include a housing (102) having a base and an opening (115) formed in the base; and an applicator comprising a microneedle array (104), the microneedle array comprising a first major surface (111) and microneedles (105). The applicator can be movable between a first position, and a second position in which at least a portion of the microneedle array extends through the opening in the base. The apparatus can further include an adhesive assembly (118), which can be adhered to the base of the housing. The adhesive assembly can include an extension (125) that extends at least partially into the area defined by the opening, such that when the applicator is in the second position, at least a portion of the first major surface of the microneedle array is in contact with the extension of the adhesive assembly.

Abstract: In accordance with an embodiment, an electrical element includes a first portion of a first dielectric material between a first portion of a first electrical conductor and a first portion of a second electrical conductor and a second portion of the first dielectric material between a second portion of the first electrical conductor and a first portion of a third electrical conductor. In accordance with another embodiment, an electrical component has a plurality of dopant regions formed in a semiconductor material, where the dopant regions include a plurality of dopant regions formed in a dopant region of the same conductivity type. A plurality of dopant regions of an opposite conductivity type are formed in corresponding dopant regions of the first conductivity type. A metallization system is formed over the semiconductor material, where a portion of the metallization system contacts the semiconductor material.

Abstract: In accordance with an embodiment, a method of manufacturing an electrical component that may include a high voltage capacitor that includes providing a semiconductor material of a second conductivity type in which first doped region of a first conductivity type is formed. A plurality of doped regions of the first conductivity type and a plurality of doped regions of the second conductivity type are formed in the first doped region. A first p-n junction is formed between first doped regions of the first and second conductivity types and a second p-n junction is formed between second doped regions of the first and second conductivity types. A metallization system is formed above the doped regions so that capacitors are formed by a parallel connection of a first metal layer to a polysilicon layer and the first metal layer to a second metal layer.

Abstract: A microneedle injection apparatus comprising a dual cover. The apparatus can include a housing having a base and a cavity; a microneedle array comprising a first side comprising a plurality of microneedles; and a microneedle array holder configured to hold a microneedle array and located in the housing. The microneedle array holder can be movable between a retracted position, and an extended position. The apparatus can further include a cover configured to be positioned to cover the opening in the base of the housing. The cover can include (i) a first portion configured to cover at least a portion of the base of the housing adjacent the opening, and (ii) a second portion configured to be received in the cavity of the housing and further configured to cover the plurality of microneedles on the microneedle array when the microneedle array holder is in the retracted position.

Abstract: The present disclosure relates to apparatus, assemblies, combinations, and methods for infusing fluids by hollow microneedles.

Abstract: Systems and methods for delivering microneedles to a patient's skin are described. In one aspect, a system for delivering a microneedle array to a patient's skin surface is provided. The system includes a delivery apparatus with a housing, and an infusion device detachably received in the housing.

Abstract: Coupled resonators for galvanically isolated signaling between integrated circuit modules. An illustrative system embodiment includes first and second integrated circuits. The first integrated circuit includes: a transmitter that produces a modulated carrier signal on a primary conductor; a first transfer conductor connected to a first connection terminal; and a first floating loop electromagnetically coupled to the primary conductor and to the transfer conductor to convey the modulated carrier. The second integrated circuit includes: a second transfer conductor connected to a second connection terminal, the second connection terminal being electrically connected to the first connection terminal; a receiver that demodulates the modulated carrier signal; and a second floating loop electromagnetically coupled to the second transfer conductor and to the receiver to convey the modulated carrier signal to the receiver.

Abstract: The present disclosure relates to apparatus, assemblies, combinations, and methods for infusing fluids by hollow microneedles.

Abstract: Coupled resonators for galvanically isolated signaling between integrated circuit modules. An illustrative multi-module integrated circuit comprises: a transmitter in a first module, the transmitter providing a modulated carrier signal; a receiver in a second module demodulating the modulated carrier signal; and a galvanically isolated signaling path that includes: a first integrated resonator in the first module and a second integrated resonator in the second module, the first and second integrated resonators being resonantly coupled to convey the modulated carrier signal from the transmitter to the receiver.

Abstract: An automated method of manufacturing a decoupling underlayment membrane is provided, the method retrieving a membrane sheet, thermoforming a set of cavities into a top surface of the membrane sheet and pressing a set of through holes into the membrane sheet.

Abstract: A microneedle injection apparatus comprising a dual cover. The apparatus can include a housing having a base and a cavity; a microneedle array comprising a first side comprising a plurality of microneedles; and a microneedle array holder configured to hold a microneedle array and located in the housing. The microneedle array holder can be movable between a retracted position, and an extended position. The apparatus can further include a cover configured to be positioned to cover the opening in the base of the housing. The cover can include (i) a first portion configured to cover at least a portion of the base of the housing adjacent the opening, and (ii) a second portion configured to be received in the cavity of the housing and further configured to cover the plurality of microneedles on the microneedle array when the microneedle array holder is in the retracted position.

Abstract: A microneedle injection and infusion apparatus, and a method of using same. The apparatus can include a housing, a microneedle array holder for holding a microneedle array, and a shuttle that holds a cartridge (e.g., that contains an active agent). The microneedle array holder can be movable between a retracted position and an extended position. The shuttle can be movable between a first position in which the cartridge is not in fluid communication with a fluid path and a second position in which the cartridge is in fluid communication with the fluid path. The apparatus can further include an actuator movable between a first position and a second position. The method can include moving the actuator to its second position to allow the shuttle to move toward its second position, wherein movement of the shuttle toward its second position allows the microneedle array holder to move to its extended position.

Abstract: An illustrative integrated circuit configured for galvanically isolated signaling includes a receiver having: a detector module coupled to receive a differential signal from terminals of a transformer secondary, the detector module responsively presenting an impedance that varies based on a magnitude of the differential signal; a biasing module that converts the detector module impedance to a response signal; and a comparator module that compares the response signal to a reference signal to obtain a detection signal indicative of oscillation in the differential signal.

Abstract: Coupled resonators for galvanically isolated signaling between integrated circuit modules. An illustrative multi-module integrated circuit comprises: a transmitter in a first module, the transmitter providing a modulated carrier signal; a receiver in a second module demodulating the modulated carrier signal; and a galvanically isolated signaling path that includes: a first integrated resonator in the first module and a second integrated resonator in the second module, the first and second integrated resonators being resonantly coupled to convey the modulated carrier signal from the transmitter to the receiver.

Abstract: An illustrative integrated circuit configured for galvanically isolated signaling includes a receiver having: a detector module coupled to receive a differential signal from terminals of a transformer secondary, the detector module responsively presenting an impedance that varies based on a magnitude of the differential signal; a biasing module that converts the detector module impedance to a response signal; and a comparator module that compares the response signal to a reference signal to obtain a detection signal indicative of oscillation in the differential signal.

Abstract: An illustrative embodiment of an integrated circuit configured for galvanically isolated signaling includes a transfer conductor carrying a modulated carrier signal. A floating transfer loop is electromagnetically coupled to the transfer conductor to receive the modulated carrier signal. The floating transfer loop includes a primary of a step-up transformer. A receiver is coupled to a secondary of the step-up transformer to receive the modulated carrier signal in an amplified, differential fashion, and to demodulate the modulated carrier signal to obtain a digital receive signal.

Abstract: A decoupling underlayment membrane is described. The decoupling underlayment membrane includes: a set of mortar cavities; a set of through holes; and an adhesive layer coupled to an exterior surface of each mortar cavity in the set of cavities. A method of manufacturing a decoupling underlayment membrane includes: retrieving a membrane sheet; thermoforming a set of cavities into a top surface of the membrane sheet; pressing a set of through holes into the membrane sheet. A decoupling underlayment membrane includes: a set of starfish-shaped cavities arranged in a first repeating pattern and formed into a top surface of the membrane; a set of through holes arranged in a second repeating pattern; and a peel and stick adhesive layer coupled to a bottom surface of the membrane.

Abstract: A microneedle injection apparatus comprising a dual cover. The apparatus can include a housing having a base and a cavity; a microneedle array comprising a first side comprising a plurality of microneedles; and a microneedle array holder configured to hold a microneedle array and located in the housing. The microneedle array holder can be movable between a retracted position, and an extended position. The apparatus can further include a cover (113) configured to be positioned to cover the opening (115) in the base (112) of the housing. The cover can include (i) a first portion (140) configured to cover at least a portion of the base of the housing adjacent the opening, and (ii) a second portion (142) configured to be received in the cavity of the housing and further configured to cover the plurality of microneedles on the microneedle array when the microneedle array holder is in the retracted position.

Abstract: A microneedle injection and infusion apparatus, and a method of using same. The apparatus (100) can include a housing (102), a microneedle array holder (106) for holding a microneedle array (107), and a shuttle (125) that holds a cartridge (e.g., that contains an active agent). The microneedle array holder can be movable between a retracted position and an extended position. The shuttle can be movable between a first position in which the cartridge is not in fluid communication with a fluid path and a second position in which the cartridge is in fluid communication with the fluid path. The apparatus can further include an actuator (104) movable between a first position and a second position. The method can include moving the actuator to its second position to allow the shuttle to move toward its second position, wherein movement of the shuttle toward its second position allows the microneedle array holder to move to its extended position.

Abstract: A microneedle injection apparatus comprising an inverted actuator. The apparatus can include a housing having a base and a cavity, and a microneedle array holder configured to hold a microneedle array within the cavity of the housing. The microneedle array holder can be movable between a retracted position, and an extended position. The apparatus can further include an actuator movable with respect to the housing and the microneedle array holder between a first position and a second position to cause the microneedle array holder to move from the retracted position to the extended position. At least a portion of the actuator can be located on a skin-facing side of the apparatus (e.g., adjacent the base of the housing) and can be configured to be moved from the first position to the second position in response to the apparatus being pressed toward the skin surface.