Patents by Inventor Scott A. Gilbert

Scott A. Gilbert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210324724
    Abstract: A system and method of directionally steering a bottom hole assembly (“BHA”) from a drilling rig to a target location including by receiving data indicative of a directional trend of the BHA and a projection to bit depth; determining a location of the BHA based on a directional trend and the projection; identifying an amount of deviation from a drilling path; automatically creating a modified drilling path that intersects the planned drilling path based on the amount of deviation exceeding a first threshold amount of deviation and being less than a second threshold amount of deviation, automatically creating a modified drilling path that does not intersect the planned drilling path in response to the amount of deviation exceeding the second threshold amount of deviation, and determining a curve profile of the modified drilling path having the smallest rate of curvature to avoid drilling overshoot; and steering the BHA.
    Type: Application
    Filed: June 28, 2021
    Publication date: October 21, 2021
    Inventors: Scott Gilbert BOONE, Brian ELLIS, Colin GILLAN, Beat KÜTTEL
  • Patent number: 11143011
    Abstract: A method of modifying a slide drill segment while implementing the slide drill segment includes receiving downhole data from a BHA during slide drilling of a slide drill segment. The method also includes calculating, based on the downhole data, a build rate and altering, while performing the slide drill segment, sliding instructions based on the build rate and the downhole data. The method also includes implementing the altered sliding instructions.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: October 12, 2021
    Assignee: NABORS DRILLING TECHNOLOGIES USA, INC.
    Inventors: Scott Gilbert Boone, Christopher Papouras, Colin Gillan
  • Patent number: 11111770
    Abstract: An apparatus and method of automatically altering proposed sliding instructions to comply with operating parameters is described.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: September 7, 2021
    Assignee: NABORS DRILLING TECHNOLOGIES USA, INC.
    Inventors: Brian Ellis, Scott Gilbert Boone, Christopher Papouras, Colin Gillan
  • Publication number: 20210185830
    Abstract: A BGA structure having larger solder balls in high stress regions of the array is disclosed. The larger solder balls have higher solder joint reliability (SJR) and as such may be designated critical to function (CTF), whereby the larger solder balls in high stress regions carry input/output signals between a circuit board and a package mounted thereon. The larger solder balls are accommodated by recessing each ball in the package substrate, the circuit board, or both the package substrate and the circuit board. Additionally, a ball attach method for mounting a plurality of solder balls having different average diameters is disclosed.
    Type: Application
    Filed: February 26, 2021
    Publication date: June 17, 2021
    Inventors: MD Altaf HOSSAIN, Scott A. GILBERT
  • Patent number: 10980134
    Abstract: A BGA structure having larger solder balls in high stress regions of the array is disclosed. The larger solder balls have higher solder joint reliability (SJR) and as such may be designated critical to function (CTF), whereby the larger solder balls in high stress regions carry input/output signals between a circuit board and a package mounted thereon. The larger solder balls are accommodated by recessing each ball in the package substrate, the circuit board, or both the package substrate and the circuit board. Additionally, a ball attach method for mounting a plurality of solder balls having different average diameters is disclosed.
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: April 13, 2021
    Assignee: Intel Corporation
    Inventors: MD Altaf Hossain, Scott A. Gilbert
  • Patent number: 10950537
    Abstract: A package structure including a capacitor mounted within a cavity in the package substrate is disclosed. The package structure may additionally include a die mounted to a die side surface of the package substrate, and the opposing land side surface of the package substrate may be mounted to a printed circuit board (PCB). The capacitor may be mounted within a cavity formed in the die side surface of the package substrate or the land side surface of the package substrate. Mounting a capacitor within a cavity may reduce the form factor of the package. The die may be mounted within a cavity formed in the die side surface of the package substrate. Solder balls connecting the package to the PCB may be mounted within one or more cavities formed in one or both of the package substrate and the PCB.
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: March 16, 2021
    Assignee: Intel Corporation
    Inventors: Md Altaf Hossain, Scott Gilbert
  • Patent number: 10672154
    Abstract: Systems, devices, and methods for producing a three-dimensional visualization of a drill plan and drilling motor with a toolface are provided for drill steering purposes. A drilling motor with a toolface in communication with a sensor system is provided. A controller in communication with the sensor system is operable to generate a depiction of the drill plan and a depiction of the drilling motor, and to combine these depictions in a three-dimensional visualization of the downhole environment. This visualization is used by a user to steer the drill.
    Type: Grant
    Filed: February 24, 2016
    Date of Patent: June 2, 2020
    Assignee: Nabors Drilling Technologies USA, Inc.
    Inventors: Colin Gillen, Scott Gilbert Boone
  • Patent number: 10626713
    Abstract: Apparatus, systems, and methods for controlling activities on a drilling rig are described. The methods include installing a control system operably coupled to the drilling rig and having a user interface, receiving operational guidelines from the user interface that include a plurality of control limits associated with operational parameters of the rig, monitoring current values of the operational parameters, and automatically applying the control limits to the operational parameters during operation of the rig.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: April 21, 2020
    Assignee: NABORS DRILLING TECHNOLOGIES USA, INC.
    Inventor: Scott Gilbert Boone
  • Patent number: 10570683
    Abstract: A rig control apparatus, system, and method according to which a mud pump is ramped up toward a full-operational pumping pressure to circulate drilling mud via a drill string between a surface location and a downhole tool, the downhole tool being connected to the drill string and positioned within a wellbore, the flow of the drilling mud between the surface location and the downhole tool is stabilized prior to the mud pump reaching the full-operational pumping pressure, data is transmitted via mud-pulse telemetry from the downhole tool to the surface location when the flow of the drilling mud between the surface location and the downhole tool is stabilized, and the mud pumps are ramped up further to the full-operational pumping pressure.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: February 25, 2020
    Assignee: Nabors Drilling Technologies USA
    Inventor: Scott Gilbert Boone
  • Publication number: 20200051901
    Abstract: A package structure including a capacitor mounted within a cavity in the package substrate is disclosed. The package structure may additionally include a die mounted to a die side surface of the package substrate, and the opposing land side surface of the package substrate may be mounted to a printed circuit board (PCB). The capacitor may be mounted within a cavity formed in the die side surface of the package substrate or the land side surface of the package substrate. Mounting a capacitor within a cavity may reduce the form factor of the package. The die may be mounted within a cavity formed in the die side surface of the package substrate. Solder balls connecting the package to the PCB may be mounted within one or more cavities formed in one or both of the package substrate and the PCB.
    Type: Application
    Filed: May 20, 2019
    Publication date: February 13, 2020
    Inventors: MD Altaf Hossain, Scott Gilbert
  • Publication number: 20190333854
    Abstract: An electronic chip, system, and method includes a power block including a power source configured to provide power to components of the electronic chip and a relay circuit coupled to the power source and a ground plane. The electronic chip further includes chip package having a first major side and a second major side, the power block secured to the second major side, the chip package comprising electrical connections, disposed on the second major side, to be secured with respect to a circuit board, and interconnect circuitry, electrically coupling the power block to ground, comprising a plurality of conductive layers, a conductive through hole, electrically connecting a first pair of the plurality of conductive layers, having a first width, and a via, electrically connecting a second pair of the plurality of conductive layers, having a second width less than the first width.
    Type: Application
    Filed: December 30, 2016
    Publication date: October 31, 2019
    Inventors: MD Altaf Hossain, Ankireddy Nalamalpu, Scott Gilbert, Jin Zhao
  • Publication number: 20190330968
    Abstract: A method of modifying a slide drill segment while implementing the slide drill segment is described. The method includes receiving downhole data from a BHA during a rotary drilling segment; identifying, based on the downhole data, a first build rate and sliding instructions for performing a slide drill segment; implementing at least a portion of the sliding instructions to perform at least a portion of the slide drill segment; receiving additional downhole data from the BHA during the slide drill segment; calculating, based on the additional downhole data, a second build rate that is different from the first build rate; altering, while performing the slide drill segment, the sliding instructions based on the second build rate and the additional downhole data; and implementing the altered sliding instructions to perform at least another portion of the slide drill segment.
    Type: Application
    Filed: April 26, 2018
    Publication date: October 31, 2019
    Inventors: Scott Gilbert BOONE, Christopher PAPOURAS, Colin GILLAN
  • Publication number: 20190323334
    Abstract: Apparatus, systems, and methods for controlling activities on a drilling rig are described. The methods include installing a control system operably coupled to the drilling rig and having a user interface, receiving operational guidelines from the user interface that include a plurality of control limits associated with operational parameters of the rig, monitoring current values of the operational parameters, and automatically applying the control limits to the operational parameters during operation of the rig.
    Type: Application
    Filed: July 1, 2019
    Publication date: October 24, 2019
    Inventor: Scott Gilbert BOONE
  • Publication number: 20190323333
    Abstract: An apparatus and method of automatically altering proposed sliding instructions to comply with operating parameters is described.
    Type: Application
    Filed: April 24, 2018
    Publication date: October 24, 2019
    Inventors: Brian ELLIS, Scott Gilbert BOONE, Christopher PAPOURAS, Colin GILLAN
  • Patent number: 10415366
    Abstract: A rig control system according to which an automated sequence engine includes a sequence template module configured to provide a template that includes a plurality of data fields outlining operational steps and associated parameters to perform a drilling process, and a recipe learning module configured to generate a recipe for entry into the data fields. The recipe learning module is configured to retrieve a data set related to a drilling rig's performance of the drilling process to drill a wellbore segment, and to score the data set based on a result of the drilling rig's performance of the drilling process and/or a characteristic of the wellbore segment. In some embodiments, the recipe learning module is further configured to categorize the data set based on a characteristic of the drilling rig and/or the wellbore segment. The recipe is based on the data set, the scoring, the categorizing, or any combination thereof.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: September 17, 2019
    Assignee: Nabors Drilling Technologies USA, Inc.
    Inventor: Scott Gilbert Boone
  • Patent number: 10378329
    Abstract: Apparatus, systems, and methods for controlling activities on a drilling rig are described. The methods include installing a control system operably coupled to the drilling rig and having a user interface, receiving operational guidelines from the user interface that include a plurality of control limits associated with operational parameters of the rig, monitoring current values of the operational parameters, and automatically applying the control limits to the operational parameters during operation of the rig.
    Type: Grant
    Filed: August 20, 2013
    Date of Patent: August 13, 2019
    Assignee: NABORS DRILLING TECHNOLOGIES USA, INC.
    Inventor: Scott Gilbert Boone
  • Publication number: 20190230795
    Abstract: A BGA structure having larger solder balls in high stress regions of the array is disclosed. The larger solder balls have higher solder joint reliability (SJR) and as such may be designated critical to function (CTF), whereby the larger solder balls in high stress regions carry input/output signals between a circuit board and a package mounted thereon. The larger solder balls are accommodated by recessing each ball in the package substrate, the circuit board, or both the package substrate and the circuit board. Additionally, a ball attach method for mounting a plurality of solder balls having different average diameters is disclosed.
    Type: Application
    Filed: April 1, 2019
    Publication date: July 25, 2019
    Inventors: MD Altaf HOSSAIN, Scott A. GILBERT
  • Publication number: 20190178043
    Abstract: A rig control apparatus, system, and method according to which a mud pump is ramped up toward a full-operational pumping pressure to circulate drilling mud via a drill string between a surface location and a downhole tool, the downhole tool being connected to the drill string and positioned within a wellbore, the flow of the drilling mud between the surface location and the downhole tool is stabilized prior to the mud pump reaching the full-operational pumping pressure, data is transmitted via mud-pulse telemetry from the downhole tool to the surface location when the flow of the drilling mud between the surface location and the downhole tool is stabilized, and the mud pumps are ramped up further to the full-operational pumping pressure.
    Type: Application
    Filed: December 7, 2017
    Publication date: June 13, 2019
    Inventor: Scott Gilbert Boone
  • Publication number: 20190178073
    Abstract: A rig control system according to which an automated sequence engine includes a sequence template module configured to provide a template that includes a plurality of data fields outlining operational steps and associated parameters to perform a drilling process, and a recipe learning module configured to generate a recipe for entry into the data fields. The recipe learning module is configured to retrieve a data set related to a drilling rig's performance of the drilling process to drill a wellbore segment, and to score the data set based on a result of the drilling rig's performance of the drilling process and/or a characteristic of the wellbore segment. In some embodiments, the recipe learning module is further configured to categorize the data set based on a characteristic of the drilling rig and/or the wellbore segment. The recipe is based on the data set, the scoring, the categorizing, or any combination thereof.
    Type: Application
    Filed: December 7, 2017
    Publication date: June 13, 2019
    Inventor: Scott Gilbert Boone
  • Patent number: 10297542
    Abstract: A package structure including a capacitor mounted within a cavity in the package substrate is disclosed. The package structure may additionally include a die mounted to a die side surface of the package substrate, and the opposing land side surface of the package substrate may be mounted to a printed circuit board (PCB). The capacitor may be mounted within a cavity formed in the die side surface of the package substrate or the land side surface of the package substrate. Mounting a capacitor within a cavity may reduce the form factor of the package. The die may be mounted within a cavity formed in the die side surface of the package substrate. Solder balls connecting the package to the PCB may be mounted within one or more cavities formed in one or both of the package substrate and the PCB.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: May 21, 2019
    Assignee: Intel Corporation
    Inventors: MD Altaf Hossain, Scott A. Gilbert