Patents by Inventor Scott A. Leavitt

Scott A. Leavitt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Socket apparatus particularly adapted for LGA type semiconductor devices
    Patent number: 6570398
    Abstract: A socket (10) has a cover (14) pivotably mounted to a base (12). The base is formed with a seat (12a) for mounting a semiconductor device on a contact mounting plate (18). A locking mechanism (20) for locking the cover in the closed position includes an over center linkage mechanism interacting with a locking pin (20a). In a modified embodiment, the locking mechanism is provided with a pivotable locking member (27) to provide either manual or automated operation. The cover (14) of socket (10) also comprises an integrally formed heat sink. In another embodiment (10′), a separate heat sink (30) is independently mounted on the cover (28) provided with an aperture through the cover in which the heat sink is slidably mounted.
    Type: Grant
    Filed: September 24, 2001
    Date of Patent: May 27, 2003
    Assignee: Texas Instruments Incorporated
    Inventors: Raymond F. Murphy, Scott A. Leavitt, James A. Forster
  • Socket apparatus particularly adapted for land grid array type semiconductor devices
    Patent number: 6547580
    Abstract: A socket (10) has a cover (14) pivotably mounted to a base (12). The base is formed with a seat (12a) for mounting a semiconductor device on a contact mounting plate (18). A locking mechanism (20) for locking the cover in the closed position includes an over center linkage mechanism interacting with a locking pin (20a). In a modified embodiment, the locking mechanism is provided with a pivotable locking member (27) to provide either manual or automated operation. The cover (14) of socket (10) also comprises an integrally formed heat sink. In another embodiment (10′), a separate heat sink (30) is independently mounted on the cover (28) provided with an aperture through the cover in which the heat sink is slidably mounted.
    Type: Grant
    Filed: September 24, 2001
    Date of Patent: April 15, 2003
    Assignee: Texas Instruments Incorporated
    Inventors: Scott A. Leavitt, Andrew K. Houbre, James A. Forster
  • SOCKET APPARATUS PARTICULARLY ADAPTED FOR LGA TYPE SEMICONDUCTOR DEVICES
    Publication number: 20030057980
    Abstract: A socket (10) has a cover (14) pivotably mounted to a base (12). The base is formed with a seat (12a) for mounting a semiconductor device on a contact mounting plate (18). A locking mechanism (20) for locking the cover in the closed position includes an over center linkage mechanism interacting with a locking pin (20a). In a modified embodiment, the locking mechanism is provided with a pivotable locking member (27) to provide either manual or automated operation. The cover (14) of socket (10) also comprises an integrally formed heat sink. In another embodiment (10′), a separate heat sink (30) is independently mounted on the cover (28) provided with an aperture through the cover in which the heat sink is slidably mounted.
    Type: Application
    Filed: September 24, 2001
    Publication date: March 27, 2003
    Inventors: Raymond F. Murphy, Scott A. Leavitt, James A. Forster
  • SOCKET APPARATUS PARTICULARLY ADAPTED FOR LAND GRID ARRAY TYPE SEMICONDUCTOR DEVICES
    Publication number: 20030060073
    Abstract: A socket (10) has a cover (14) pivotably mounted to a base (12). The base is formed with a seat (12a) for mounting a semiconductor device on a contact mounting plate (18). A locking mechanism (20) for locking the cover in the closed position includes an over center linkage mechanism interacting with a locking pin (20a). In a modified embodiment, the locking mechanism is provided with a pivotable locking member (27) to provide either manual or automated operation. The cover (14) of socket (10) also comprises an integrally formed heat sink. In another embodiment (10′), a separate heat sink (30) is independently mounted on the cover (28) provided with an aperture through the cover in which the heat sink is slidably mounted.
    Type: Application
    Filed: September 24, 2001
    Publication date: March 27, 2003
    Inventors: Scott A. Leavitt, Andrew K. Houbre, James A. Forster