Abstract: Embodiments herein provide relatively permanent labeling of an imprint lithography template. The imprint lithography template generally has first and second sides, one side having a pattern to imprint a substrate and the other being optically smooth to unobstructably pass UV light. In one embodiment, a method of labeling the imprint lithography template includes placing a masking layer on a portion of the first side (e.g., the optically smooth side) of the template, forming a liftoff layer on the remainder of the first side of the template, removing the masking layer to expose the portion of the first side of the template, and placing a polymer mark on the exposed portion of the first side of the template. The method also includes depositing an opaque material on the first side of the template and removing the liftoff layer and the mark to form a label on the first side of the template with the deposited opaque material.

Abstract: There is described a method of a wireless communication device for managing status components for global call control. A selectable region is displayed at a display. A first user input is then detected at an input component associated with the display corresponding to selection of the selectable region. Next, an active call status component associated with a current call is displayed at the display in response to the first user input. A second user input is detected at the input component corresponding to selection of the current call status component. Thereafter, active call information associated with an active call is displayed at the display or an active call is terminated in response to detecting the second user input.

Abstract: Embodiments herein provide relatively permanent labeling of an imprint lithography template. The imprint lithography template generally has first and second sides, one side having a pattern to imprint a substrate and the other being optically smooth to unobstructably pass UV light. In one embodiment, a method of labeling the imprint lithography template includes placing a masking layer on a portion of the first side (e.g., the optically smooth side) of the template, forming a liftoff layer on the remainder of the first side of the template, removing the masking layer to expose the portion of the first side of the template, and placing a polymer mark on the exposed portion of the first side of the template. The method also includes depositing an opaque material on the first side of the template and removing the liftoff layer and the mark to form a label on the first side of the template with the deposited opaque material.

Abstract: One embodiment in accordance with the invention is a method comprising depositing a material above a disk substrate. The disk substrate is for a data storage device. The material above the disk substrate can be nanoimprinted. The material can be processed to transform it into a substantially solidified material. A magnetic material can be deposited on the substantially solidified material.

Abstract: A suspended resist bridge suitable for lithographically patterning MR sensors having trackwidths narrower than 0.2 micron is fabricated using the method of the present invention. First, PMGI is spun onto a substrate to form a first thin resist layer. Next, PMMA is spun onto the first resist layer to form a second resist layer. The PMMA layer is exposed to an electron beam to pattern the trackwidth of the MR sensors. E-beam exposed PMMA is then developed in an IPA solution. The resist structure is then placed in a basic solution for dissolving PMGI, which results in a fully undercut resist bridge that is used for patterning the MR sensors.

Abstract: A magnetic head including a dual layer induction coil fabricated by reactive ion etching (RIE) techniques. An etch stop layer and an etchable insulation material layer and an induction coil etching mask are fabricated on a first magnetic pole. Induction coil trenches are thereafter RIE etched into the insulation material to the etch stop layer, and the first induction coil is fabricated into the induction coil trenches. Following a chemical mechanical polishing (CMP) step, a second etch stop layer, a second layer of etchable insulation material and a second induction coil etching mask are fabricated. Second induction coil trenches are RIE etched into the second insulation material layer to the second etch stop layer, and a second induction coil is fabricated into the second induction coil trenches. A second CMP step is followed by an insulation layer and the fabrication of a second magnetic pole (P2) upon the insulation layer.

Abstract: A photoresist composition which includes hydroxycarborane either incorporated as a monomeric dissolution modifier or as pendent groups on a polymer backbone. The photoresist composition is particularly useful in a bilayer thin film imaging lithographic process in which ultraviolet radiation-imaging in a wavelength range of between about 365 nm and about 13 nm is employed.

Abstract: A suspended resist bridge suitable for lithographically patterning MR sensors having trackwidths narrower than 0.2 micron is fabricated using the method of the present invention. First, PMGI is spun onto a substrate to form a first thin resist layer. Next, PMMA is spun onto the first resist layer to form a second resist layer. The PMMA layer is exposed to an electron beam to pattern the trackwidth of the MR sensors. E-beam exposed PMMA is then developed in an IPA solution. The resist structure is then placed in a basic solution for dissolving PMGI, which results in a fully undercut resist bridge that is used for patterning the MR sensors.

Abstract: A floating pin joint is provided for coupling a linear potentiometer to a machine for measuring relative movement between first and second component parts of the machine. The potentiometer has an elongated housing securable to the first component part and a drive actuator slidably attached to the housing. In one embodiment, the floating pin joint includes a bushing, an actuator rod and a spring. The bushing can be positioned in a mounting hole on the drive actuator with an annular bearing surface disposed at one end of the bushing facing outwardly from the mounting hole. The actuator rod has a flange disposed between a first end and second end which contacts the bearing surface when the second end of the rod is extended through the bushing. The spring attaches to the second end of the rod for maintaining the flange in contact with the bearing surface.

Abstract: The present invention relates to an improved lithographic photoresist composition comprising a photosensitive base generator. The composition is useful in the manufacture of integrated circuits.

Abstract: An optical data storage device having a substrate has guide ridges, or reverse grooves, in a concentric or spiral shape formed thereon, and disposed in a plane parallel to and disposed from the substrate surface. The device further has pits formed approximately midway between the guide ridges and disposed in the substrate and having bottoms below the plane of the substrate surface. A method for manufacturing the optical data storage device having both address pits and guide ridges is disclosed. A dual tone photosensitive material is applied to a substrate, exposed with a laser light source comprising two distinct wavelengths, and developed to provide a desired bipolar geometry thereon.

Abstract: Dry developable top surface imageable photoresist compositions which comprise, in admixture, a film-forming aromatic polymer resin activated to electrophilic substitution, an acid catalyzable agent capable of being inserted into the aromatic polymer resin, and a radiation degradable acid generating compound and processes for generating positive tone resist images on substrates therewith.

Abstract: A method for transferring a pattern through a photoresist layer in the fabrication of submicron semiconductor devices structures is disclosed. A photoresist is provided on a substrate and the same is imagewise exposed with a desired pattern to form exposed and unexposed patterned areas in the top surface of the photoresist. The photoresist is then baked to form cross-linked regions in the exposed pattern areas of the photoresist. Silylation is then performed to incorporate silicon into the unexposed patterned areas of the photoresist, wherein some incorporation of silicon occurs in the exposed patterned crosslinked areas of the photoresist. The patterned photoresist is subsequently etched using a high density, low pressure, anisotropic O.sub.2 plasma alone to produce residue-free images with vertical wall profiles in the photoresist. This method is particularly advantageous with RFI reactive ion etch systems.

Abstract: The present invention relates to a process for negative tone imaging of photoresist to improve resolution of lithographic patterns.

Abstract: A detachable belt cartridge for an envelope feeder includes a housing having spaced apart side walls, first and second end walls, and a top. The top has a plurality of lengthwise slots formed therein. A first and second shaft is rotatively mounted in spaced apart relationship in the housing. A plurality of wheels are drivenly mounted on the first and second shafts by a plurality of endless belts respectively extending around a respective one of the wheels of the first and second shafts such that a portion of said belt extends in a respective slot slightly above said top.

Abstract: A method is provided for creating multilayer patterned films wherein at least one layer is an etch-resistant patterned layer, and wherein either positive or negative tone patterns can be obtained.The etch-resistant patterned layer is obtained by reacting a patterned polymeric film containing reactive functional groups with an organometallic reagent such as a silicon-containing compound. The pattern is subsequently transferred through adjacent polymeric layers using an oxygen plasma or equivalent dry-etch method.

Abstract: The present invention is concerned with methods of converting a single resist layer into a multilayered resist.The upper portion of the single resist layer can be converted into a dry-etch resistant form. The conversion can be a blanket conversion of the upper portion of the resist layer or can be a patterned conversion of areas within the upper portion of the layer. A patternwise-converted resist can be oxygen plasma developed.The upper portion of the single resist layer can be patternwise converted into a chemically different composition or structure having altered absorptivity toward radiation. The difference in radiation absorptivity within the patterned upper portion of the resist enables subsequent use of blanket irradiation of the resist surface to create differences in chemical solubility between areas having the altered absorptivity toward radiation and non-altered areas. The difference in chemical solubility enables wet development of the patterned resist.

Abstract: The reactive ion etching and thermal flow resistance of a resist image is enhanced by contacting the resist image with an alkyl metal compound of magnesium or aluminum.

Abstract: A positive tone photoresist is obtained without a solvent development step. The resist is a polymer containing masked reactive functionality which is imagewise exposed to unmask the functionality then treated with a non-organometallic reagent to remask that functionality. Following flood exposure, the resist is treated with an organometallic reagent containing an element which forms a non-volatile oxide. It is then developed by means of oxygen reactive ion etching.

Abstract: A negative tone resist image is achieved by (1) coating a substrate with a film of a polymer containing a masked, reactive functionality; (2) imagewise exposing the film to radiation in a fashion such that the masked functionality is liberated; (3) contacting the film with an organometallic reagent; (4) developing the relief image by the oxygen plasma etching.