Abstract: A sprinkler system includes a sprinkler and a release assembly. The sprinkler includes a base defining an inlet and an outlet, at least one arm extending from the base, a deflector coupled with the at least one arm, a button that seals the outlet, and a bulb coupled with the button between the button and the deflector. The bulb includes a resistive trace made of an electrically conductive material to fracture the bulb responsive to an electrical current to release the button from the outlet. The release assembly is coupled with the sprinkler and provides the electrical current to the bulb to cause the bulb to fracture responsive to a fire condition.

Abstract: Serial high speed interconnect devices are integrated with semiconductor devices for simple and reliable communications and control between a plurality of semiconductor devices. The serial high speed interconnect devices transfer the data serially at a rate fast enough to replace large parallel data and address buses that require one conductive path per bit of data. Eliminating large parallel data and address buses allows the integrated circuit containing the semiconductor device to be smaller, simpler and lower in cost. The subsequent reduction in the size of the integrated circuits improves the layout density of electronic systems and reduces crosstalk and other undesirable signal transfer anomalies. The serial high speed interconnection devices are implemented with a low cost serial interface circuit technology that may be easily implemented on a semiconductor die in conjunction with the main circuits.

Abstract: Serial high speed interconnect devices are integrated with semiconductor devices to reduce the number of input-output pins required for communications and control between a plurality of semiconductor devices. The serial high speed interconnect devices transfer the data serially at a rate fast enough to replace large parallel data and address buses that require one conductive path per bit of data. Eliminating large parallel data and address buses allows the integrated circuit assembly containing the semiconductor device to be smaller, simpler and lower in cost. The subsequent reduction in the size of the integrated circuits improves the layout density of electronic systems and reduces crosstalk and other undesirable signal transfer anomalies. The serial high speed interconnection devices are implemented with a low cost serial interface logic technology that may be easily implemented on a semiconductor die in conjunction with the main logic circuits.