Patents by Inventor Scott A. Macomber

Scott A. Macomber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5715274
    Abstract: Serial high speed interconnect devices are integrated with semiconductor devices for simple and reliable communications and control between a plurality of semiconductor devices. The serial high speed interconnect devices transfer the data serially at a rate fast enough to replace large parallel data and address buses that require one conductive path per bit of data. Eliminating large parallel data and address buses allows the integrated circuit containing the semiconductor device to be smaller, simpler and lower in cost. The subsequent reduction in the size of the integrated circuits improves the layout density of electronic systems and reduces crosstalk and other undesirable signal transfer anomalies. The serial high speed interconnection devices are implemented with a low cost serial interface circuit technology that may be easily implemented on a semiconductor die in conjunction with the main circuits.
    Type: Grant
    Filed: January 9, 1995
    Date of Patent: February 3, 1998
    Assignee: LSI Logic Corporation
    Inventors: Michael D. Rostoker, Scott A. Macomber
  • Patent number: 5625563
    Abstract: Serial high speed interconnect devices are integrated with semiconductor devices to reduce the number of input-output pins required for communications and control between a plurality of semiconductor devices. The serial high speed interconnect devices transfer the data serially at a rate fast enough to replace large parallel data and address buses that require one conductive path per bit of data. Eliminating large parallel data and address buses allows the integrated circuit assembly containing the semiconductor device to be smaller, simpler and lower in cost. The subsequent reduction in the size of the integrated circuits improves the layout density of electronic systems and reduces crosstalk and other undesirable signal transfer anomalies. The serial high speed interconnection devices are implemented with a low cost serial interface logic technology that may be easily implemented on a semiconductor die in conjunction with the main logic circuits.
    Type: Grant
    Filed: January 9, 1995
    Date of Patent: April 29, 1997
    Assignee: LSI Logic Corporation
    Inventors: Michael D. Rostoker, Scott A. Macomber