Abstract: An electronic device made from the method of providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, laser bending the shaped metallic interconnects; and transferring the shaped metallic interconnects onto a receiving substrate or device.

Abstract: An electronic device made from the method of providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, laser bending the shaped metallic interconnects; and transferring the shaped metallic interconnects onto a receiving substrate or device.

Abstract: A method of forming and transferring shaped metallic interconnects, comprising providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, and transferring the shaped metallic interconnect to an electrical device. An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, and directing the metal structures to an electronic device.

Abstract: A method of forming and transferring shaped metallic interconnects, comprising providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, and transferring the shaped metallic interconnect to an electrical device. An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, and directing the metal structures to an electronic device.

Abstract: A method of forming and transferring shaped metallic interconnects, comprising providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, and transferring the shaped metallic interconnect to an electrical device. An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, and directing the metal structures to an electronic device.

Abstract: A method of forming and transferring shaped metallic interconnects, comprising providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, and transferring the shaped metallic interconnect to an electrical device. An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, and directing the metal structures to an electronic device.

Abstract: A method of bonding a polymer film to a mating part, including: placing a mating part in a nest; contacting the polymer film and the mating part; heating a die including a thermally conductive silicone to a temperature at or above a glass transition temperature of the polymer film, the mating part, or both; actuating the die onto the polymer film, wherein the thermally conductive silicone contacts the polymer film and bonds the polymer film to the mating part to form a bonded article; and actuating the die away from the polymer film.

Abstract: Disclosed herein is a method of: depositing an actuating material onto a bendable component; and applying heat or an electromagnetic force to the actuating material, such that the volume of the actuating material changes, causing the component to bend.

Abstract: The multi-aperture system of the present invention provides a retinal oximetry apparatus for determining the level of oxygen saturation in retinal vessels using a lenslet array comprising at least seven lenses for the simultaneous measurement of reflected light with at least three wavelengths and at least four polarization states. The multi-aperture system of the present invention further provides an apparatus for determining the level of oxygen saturation in retinal vessels using a lenslet array comprising at least ten lenses for the simultaneous measurement of reflected light with at least three wavelengths for oxygen measurement, at least three wavelengths for melanin content, and at least four polarization states. Methods of operating the same are also provided.

Abstract: Disclosed herein is a method of: depositing an actuating material onto a bendable component; and applying heat or an electromagnetic force to the actuating material, such that the volume of the actuating material changes, causing the component to bend.

Abstract: The present invention relates generally to a multi-layer system for containing cells in culture, and a system for visualizing cells cultured in the multi-layered system. More specifically, the present invention relates to a multi-layer cell culture device having a specialized bottom plate and a microscope adaptor which can accommodate a microscope to allow microscopic visualization of cells cultured in the device.

Abstract: A method of bonding a polymer film to a mating part, including: placing a mating part in a nest; contacting the polymer film and the mating part; heating a die including a thermally conductive silicone to a temperature at or above a glass transition temperature of the polymer film, the mating part, or both; actuating the die onto the polymer film, wherein the thermally conductive silicone contacts the polymer film and bonds the polymer film to the mating part to form a bonded article; and actuating the die away from the polymer film.

Abstract: A laser direct write method used to transfer entire single components such as semiconductor bare dies or surface mount passive and active components on a substrate or inside recess in a substrate for making embedded microelectronics is disclosed. This method laser-machine the pockets, laser-transfer the individual components inside those pockets, and then laser-print the interconnects required to “wire” the components, thus resulting in a fully assembled embedded circuit required to make a fully functional microelectronic system.

Abstract: The multi-aperture system of the present invention provides a retinal oximetry apparatus for determining the level of oxygen saturation in retinal vessels using a lenslet array comprising at least seven lenses for the simultaneous measurement of reflected light with at least three wavelengths and at least four polarization states. The multi-aperture system of the present invention further provides an apparatus for determining the level of oxygen saturation in retinal vessels using a lenslet array comprising at least ten lenses for the simultaneous measurement of reflected light with at least three wavelengths for oxygen measurement, at least three wavelengths for melanin content, and at least four polarization states. Methods of operating the same are also provided.

Abstract: The multi-aperture system of the present invention provides a retinal oximetry apparatus for determining the level of oxygen saturation in retinal vessels using a lenslet array comprising at least seven lenses for the simultaneous measurement of reflected light with at least three wavelengths and at least four polarization states. The multi-aperture system of the present invention further provides an apparatus for determining the level of oxygen saturation in retinal vessels using a lenslet array comprising at least ten lenses for the simultaneous measurement of reflected light with at least three wavelengths for oxygen measurement, at least three wavelengths for melanin content, and at least four polarization states. Methods of operating the same are also provided.

Abstract: The multi-aperture system of the present invention provides a retinal oximetry apparatus for determining the level of oxygen saturation in retinal vessels using a lenslet array comprising at least seven lenses for the simultaneous measurement of reflected light with at least three wavelengths and at least four polarization states. The multi-aperture system of the present invention further provides an apparatus for determining the level of oxygen saturation in retinal vessels using a lenslet array comprising at least ten lenses for the simultaneous measurement of reflected light with at least three wavelengths for oxygen measurement, at least three wavelengths for melanin content, and at least four polarization states. Methods of operating the same are also provided.

Abstract: A laser direct write method used to transfer entire single components such as semiconductor bare dies or surface mount passive and active components on a substrate or inside recess in a substrate for making embedded microelectronics is disclosed. This method laser-machine the pockets, laser-transfer the individual components inside those pockets, and then laser-print the interconnects required to “wire” the components, thus resulting in a fully assembled embedded circuit required to make a fully functional microelectronic system.

Abstract: A system and method for forming high resolution electronic circuits on a substrate is provided. The system (10) includes a substrate (12), a source of radiant energy (34) and a focusing means (16). The source of radiant energy (34) directs an energy beam (14) through the focusing means (16) in order to direct a focused energy beam (18) onto the surface of the substrate (12). The focused energy beam (18) creates a plurality of channels (20) in the surface of the substrate (12). A paste applicator (22) fills the channels (20) with an electrically conductive paste (24). Once heated and cured, the electrically conductive paste (24) makes up the electrically conductive pathways of the electronic circuit.

Abstract: A system, method and computer program product are provided for determining a minimum future benefits value for exercising a contingent claim of an option. The method may include determining a present value distribution of contingent future benefits at an expiration exercise point, and present values of respective exercise price(s) at the expiration exercise point and one or more decision points before that point, including discounting a respective distribution and values according to first and second discount rates, respectively. The method may also include defining a value as a function of a variable asset value at a selected decision point, the value being determinable based upon the present value distribution and present values, where the present value distribution may be correlated with the asset value. The function may then be solved for a root thereof, the root being selected as a minimum asset value.

Abstract: A system, method and computer program product are provided for determining a minimum asset value for exercising a contingent claim of an option. The method may include determining a present value conditional distribution of contingent future benefits attributable to the exercise of a contingent claim, including conditioning a distribution of contingent future benefits on an estimated minimum asset value, and discounting the distribution according to a first discount rate. Similarly, the method may include determining present values of respective exercise prices required to exercise one or more contingent claims, including discounting respective exercise prices according to a second discount rate.