Abstract: An electronic device made from the method of providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, laser bending the shaped metallic interconnects; and transferring the shaped metallic interconnects onto a receiving substrate or device.

Abstract: An electronic device made from the method of providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, laser bending the shaped metallic interconnects; and transferring the shaped metallic interconnects onto a receiving substrate or device.

Abstract: A method of forming and transferring shaped metallic interconnects, comprising providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, and transferring the shaped metallic interconnect to an electrical device. An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, and directing the metal structures to an electronic device.

Abstract: A method of forming and transferring shaped metallic interconnects, comprising providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, and transferring the shaped metallic interconnect to an electrical device. An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, and directing the metal structures to an electronic device.

Abstract: A method of forming and transferring shaped metallic interconnects, comprising providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, and transferring the shaped metallic interconnect to an electrical device. An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, and directing the metal structures to an electronic device.

Abstract: A method of forming and transferring shaped metallic interconnects, comprising providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, and transferring the shaped metallic interconnect to an electrical device. An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, and directing the metal structures to an electronic device.

Abstract: Disclosed herein is a method of: depositing an actuating material onto a bendable component; and applying heat or an electromagnetic force to the actuating material, such that the volume of the actuating material changes, causing the component to bend.

Abstract: The multi-aperture system of the present invention provides a retinal oximetry apparatus for determining the level of oxygen saturation in retinal vessels using a lenslet array comprising at least seven lenses for the simultaneous measurement of reflected light with at least three wavelengths and at least four polarization states. The multi-aperture system of the present invention further provides an apparatus for determining the level of oxygen saturation in retinal vessels using a lenslet array comprising at least ten lenses for the simultaneous measurement of reflected light with at least three wavelengths for oxygen measurement, at least three wavelengths for melanin content, and at least four polarization states. Methods of operating the same are also provided.

Abstract: Disclosed herein is a method of: depositing an actuating material onto a bendable component; and applying heat or an electromagnetic force to the actuating material, such that the volume of the actuating material changes, causing the component to bend.

Abstract: A laser direct write method used to transfer entire single components such as semiconductor bare dies or surface mount passive and active components on a substrate or inside recess in a substrate for making embedded microelectronics is disclosed. This method laser-machine the pockets, laser-transfer the individual components inside those pockets, and then laser-print the interconnects required to “wire” the components, thus resulting in a fully assembled embedded circuit required to make a fully functional microelectronic system.

Abstract: The multi-aperture system of the present invention provides a retinal oximetry apparatus for determining the level of oxygen saturation in retinal vessels using a lenslet array comprising at least seven lenses for the simultaneous measurement of reflected light with at least three wavelengths and at least four polarization states. The multi-aperture system of the present invention further provides an apparatus for determining the level of oxygen saturation in retinal vessels using a lenslet array comprising at least ten lenses for the simultaneous measurement of reflected light with at least three wavelengths for oxygen measurement, at least three wavelengths for melanin content, and at least four polarization states. Methods of operating the same are also provided.

Abstract: The multi-aperture system of the present invention provides a retinal oximetry apparatus for determining the level of oxygen saturation in retinal vessels using a lenslet array comprising at least seven lenses for the simultaneous measurement of reflected light with at least three wavelengths and at least four polarization states. The multi-aperture system of the present invention further provides an apparatus for determining the level of oxygen saturation in retinal vessels using a lenslet array comprising at least ten lenses for the simultaneous measurement of reflected light with at least three wavelengths for oxygen measurement, at least three wavelengths for melanin content, and at least four polarization states. Methods of operating the same are also provided.

Abstract: The multi-aperture system of the present invention provides a retinal oximetry apparatus for determining the level of oxygen saturation in retinal vessels using a lenslet array comprising at least seven lenses for the simultaneous measurement of reflected light with at least three wavelengths and at least four polarization states. The multi-aperture system of the present invention further provides an apparatus for determining the level of oxygen saturation in retinal vessels using a lenslet array comprising at least ten lenses for the simultaneous measurement of reflected light with at least three wavelengths for oxygen measurement, at least three wavelengths for melanin content, and at least four polarization states. Methods of operating the same are also provided.

Abstract: A laser direct write method used to transfer entire single components such as semiconductor bare dies or surface mount passive and active components on a substrate or inside recess in a substrate for making embedded microelectronics is disclosed. This method laser-machine the pockets, laser-transfer the individual components inside those pockets, and then laser-print the interconnects required to “wire” the components, thus resulting in a fully assembled embedded circuit required to make a fully functional microelectronic system.

Abstract: A method of creating microstructures by contact transfer process includes the step of positioning a material covered ribbon in proximity with the surface of the substrate, directing a laser beam onto the material covered ribbon, so that the laser beam releases a portion of the material layer and transfers the released material onto the surface of the substrate. The material covered ribbon includes a transparent support and a material layer of the thickness in the range of 2-15 microns of highly homogeneous and uniformly distributed material, which includes a powder of very small particles the dimensions of which do not exceed 10 microns bound by a binder which provides a needed degree of viscosity to the material, which, being released from the material layer, is transferred to the surface of the substrate as a single piece. In order to create a microstructure, several repetitions of releasing the material and transferring the released material to the substrate is needed.