Abstract: Various aspects of the present disclosure are directed toward apparatuses, systems, and methods that may include a connector port subassembly. The connector port subassembly may include one or more connector blocks configured to interference fit within a connector bore, one or more windows through the core subassembly to the one or more connector blocks, and one or more seal rings configured to interference fit within the connector bore and eliminate adulterant entry into the connector bore through the one or more windows.

Abstract: A rechargeable implantable neuro stimulator may include a neuro stimulation waveform generator configured to generate neuro stimulation signals. The neurostimulator may further include at least one electrode, at least one rechargeable battery configured to power the neurostimulator, and a coil for receiving power. The coil may be electrically connected to the circuitry for use in recharging the battery using the power received by the coil. The neurostimulator may further include two or more sensors configured for use in determining temperature and a controller.

Abstract: A connector apparatus for a medical device includes a cylindrical core of nonconductive material, a beam of conductive material, and a sleeve of conductive material. The cylindrical core includes an outside surface, an inside surface, a hollow center having a cross sectional area, and a slot opening in the cylindrical core extending from the outside surface to the inside surface. The beam is placed in the slot opening in the cylindrical core, wherein the beam reduces the cross-sectional area of the hollow center of the cylindrical core. The sleeve of conductive material is placed over the outside surface of the cylindrical core.

Abstract: Various aspects of the present disclosure are directed toward apparatuses, systems and methods for connecting a lead to an implantable medical device. The apparatuses, systems and methods may include a clamp arranged within a connector port configured to secure the lead with a header in response to frictional engagement between a portion of the implantable lead and the clamp.

Abstract: Various aspects of the present disclosure are directed toward apparatuses, systems and methods for connecting a lead to an implantable medical device. The apparatuses, systems and methods may include a clamp arranged within a connector port configured to secure the lead with a header in response to frictional engagement between a portion of the implantable lead and the clamp.

Abstract: A connector apparatus for a medical device includes a cylindrical core of nonconductive material, a beam of conductive material, and a sleeve of conductive material. The cylindrical core includes an outside surface, an inside surface, a hollow center having a cross sectional area, and a slot opening in the cylindrical core extending from the outside surface to the inside surface. The beam is placed in the slot opening in the cylindrical core, wherein the beam reduces the cross-sectional area of the hollow center of the cylindrical core. The sleeve of conductive material is placed over the outside surface of the cylindrical core.

Abstract: Various aspects of the present disclosure are directed toward apparatuses, systems, and methods that may include a connector port subassembly. The connector port subassembly may include one or more connector blocks configured to interference fit within a connector bore, one or more windows through the core subassembly to the one or more connector blocks, and one or more seal rings configured to interference fit within the connector bore and eliminate adulterant entry into the connector bore through the one or more windows.

Abstract: Various aspects of the present disclosure are directed toward apparatuses, systems and methods for connecting a lead to an implantable medical device. The apparatuses, systems and methods may include a clamp arranged within a connector port configured to secure the lead with a header in response to frictional engagement between a portion of the implantable lead and the clamp.

Abstract: This document discusses, among other things, systems and methods related to a flexible circuit buzzer apparatus, such as a buzzer apparatus for use in an implantable medical device. In an example, the buzzer apparatus can include a flexible circuit having a first dielectric layer. A conductive layer can be disposed on the first dielectric layer. A hole can be formed in the first dielectric layer, the conductive layer, or both. A buzzer including a first contact can be located proximate to the hole. A conductive via can be plated or deposited in the hole. At least the first contact can be electrically coupled to the conductive layer by the conductive via.

Abstract: An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.

Abstract: A modular header and method of fabricating same for making electrical connection between an array of feed-through pins extending through a wall of a hermetically sealed enclosure of an implantable medical device and lead connect or receptacles within the header in which the header is fabricated using a pre-formed molded header module, together with a set or harness of interconnected flexible conductors incorporated and sealed by an overlayer of medical grade polymer material. The assembled modular header is capable of complete pre-testing prior to assembly onto an implantable medical device.

Abstract: An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.

Abstract: This document discusses, among other things, systems and methods related to a flexible circuit buzzer apparatus, such as a buzzer apparatus for use in an implantable medical device. In an example, the buzzer apparatus can include a flexible circuit having a first dielectric layer. A conductive layer can be disposed on the first dielectric layer. A hole can be formed in the first dielectric layer, the conductive layer, or both. A buzzer including a first contact can be located proximate to the hole. A conductive via can be plated or deposited in the hole. At least the first contact can be electrically coupled to the conductive layer by the conductive via.

Abstract: An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.

Abstract: A modular header and method of fabricating same for making electrical connection between an array of feed-through pins extending through a wall of a hermetically sealed enclosure of an implantable medical device and lead connect or receptacles within the header in which the header is fabricated using a pre-formed molded header module, together with a set or harness of interconnected flexible conductors incorporated and sealed by an overlayer of medical grade polymer material. The assembled modular header is capable of complete pre-testing prior to assembly onto an implantable medical device.

Abstract: A modular header and method of fabricating same for making electrical connection between an array of feed-through pins extending through a wall of a hermetically sealed enclosure of an implantable medical device and lead connect or receptacles within the header in which the header is fabricated using a pre-formed molded header module, together with a set or harness of interconnected flexible conductors incorporated and sealed by an overlayer of medical grade polymer material. The assembled modular header is capable of complete pre-testing prior to assembly onto an implantable medical device.

Abstract: An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.

Abstract: A modular header and method of fabricating same for making electrical connection between an array of feed-through pins extending through a wall of a hermetically sealed enclosure of an implantable medical device and lead connect or receptacles within the header in which the header is fabricated using a pre-formed molded header module, together with a set or harness of interconnected flexible conductors incorporated and sealed by an overlayer of medical grade polymer material. The assembled modular header is capable of complete pre-testing prior to assembly onto an implantable medical device.

Abstract: A modular header and method of fabricating same for making electrical connection between an array of feed-through pins extending through a wall of a hermetically sealed enclosure of an implantable medical device and lead connect or receptacles within the header in which the header is fabricated using a pre-formed molded header module, together with a set or harness of interconnected flexible conductors incorporated and sealed by an overlayer of medical grade polymer material. The assembled modular header is capable of complete pre-testing prior to assembly onto an implantable medical device.

Abstract: A modular header and method of fabricating same for making electrical connection between an array of feed-through pins extending through a wall of a hermetically sealed enclosure of an implantable medical device and lead connect or receptacles within the header in which the header is fabricated using a pre-formed molded header module, together with a set or harness of interconnected flexible conductors incorporated and sealed by an overlayer of medical grade polymer material. The assembled modular header is capable of complete pre-testing prior to assembly onto an implantable medical device.