Patents by Inventor Scott Ageno

Scott Ageno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of preparing a flexible substrate assembly and flexible substrate assembly therefrom
    Patent number: 9155190
    Abstract: Some embodiments include a method of preparing a flexible substrate assembly. Other embodiments of related methods and structures are also disclosed.
    Type: Grant
    Filed: June 7, 2013
    Date of Patent: October 6, 2015
    Assignee: AZ Board of Regents, a body corporate of the State of AZ Acting for and on behalf of AZ State University
    Inventors: Jesmin Haq, Scott Ageno, Douglas E. Loy, Shawn O'Rourke, Robert Naujokaitis
  • Method of providing a flexible semiconductor device at high temperatures and flexible semiconductor device thereof
    Patent number: 8999778
    Abstract: Some embodiments include a method of providing a semiconductor device. The method can include: (a) providing a flexible substrate; (b) depositing at least one layer of material over the flexible substrate, wherein the deposition of the at least one layer of material over the flexible substrate occurs at a temperature of at least 180° C.; and (c) providing a diffusion barrier between a metal layer and an a-Si layer. Other embodiments are disclosed in this application.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: April 7, 2015
    Assignee: Arizona Board of Regents
    Inventors: Shawn O'Rourke, Curtis Moyer, Scott Ageno, Dirk Bottesch, Barry O'Brien, Michael Marrs
  • Method Of Preparing A Flexible Substrate Assembly And Flexible Substrate Assembly Therefrom
    Publication number: 20130271930
    Abstract: Some embodiments include a method of preparing a flexible substrate assembly. Other embodiments of related methods and structures are also disclosed.
    Type: Application
    Filed: June 7, 2013
    Publication date: October 17, 2013
    Applicant: Arizona Board of Regents, a body corporate of the State of Arizona Acting for and on behalf of Arizo
    Inventors: Jesmin Haq, Scott Ageno, Douglas E. Loy, Shawn O'Rourke, Robert Naujokaitis
  • Method of preparing a flexible substrate assembly and flexible substrate assembly therefrom
    Patent number: 8481859
    Abstract: Some embodiments teach a method of preparing a flexible substrate assembly. The method can include: (a) providing a carrier substrate; (b) providing a cross-linking adhesive; (c) providing a plastic substrate; and (d) coupling the carrier substrate to the plastic substrate using the cross-linking adhesive. Other embodiments are disclosed in this application.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: July 9, 2013
    Assignee: Arizona Board of Regents, a body corporate of the State of Arizona, Acting for and on behalf of Arizona State University
    Inventors: Jesmin Haq, Scott Ageno, Douglas E. Loy, Shawn O'Rourke, Robert Naujokaitis
  • METHOD OF PROVIDING A FLEXIBLE SEMICONDUCTOR DEVICE AT HIGH TEMPERATURES AND FLEXIBLE SEMICONDUCTOR DEVICE THEREOF
    Publication number: 20120061672
    Abstract: Some embodiments include a method of providing a semiconductor device. The method can include: (a) providing a flexible substrate; (b) depositing at least one layer of material over the flexible substrate, wherein the deposition of the at least one layer of material over the flexible substrate occurs at a temperature of at least 180° C.; and (c) providing a diffusion barrier between a metal layer and an a-Si layer. Other embodiments are disclosed in this application.
    Type: Application
    Filed: November 17, 2011
    Publication date: March 15, 2012
    Applicants: Arizona State University
    Inventors: Shawn O'Rourke, Curtis Moyer, Scott Ageno, Dirk Bottesch, Barry O'Brien, Michael Marrs
  • METHOD OF PREPARING A FLEXIBLE SUBSTRATE ASSEMBLY AND FLEXIBLE SUBSTRATE ASSEMBLY THEREFROM
    Publication number: 20110228492
    Abstract: Some embodiments teach a method of preparing a flexible substrate assembly. The method can include: (a) providing a carrier substrate; (b) providing a cross-linking adhesive; (c) providing a plastic substrate; and (d) coupling the carrier substrate to the plastic substrate using the cross-linking adhesive. Other embodiments are disclosed in this application.
    Type: Application
    Filed: May 27, 2011
    Publication date: September 22, 2011
    Applicant: Arizona Board of Regents, for and on behalf of Arizona State University
    Inventors: Jesmin Haq, Scott Ageno, Douglas E. Loy, Shawn O'Rourke, Robert Naujokaitis