Patents by Inventor Scott Aldern

Scott Aldern has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8736397
    Abstract: A coaxial to microstrip transition is introduced in a multi layer mixed dielectric printed circuit board environment that provides a 50 Ohm impedance system between a coaxial antenna feed and a surface mount diplexer at Ku-band frequencies. The 50 Ohm transition from the coaxial antenna feed to the diplexer at microwave frequencies lossy FR-4 style laminate is provided by constructing a PCB internal coax using the center conductor of the antenna feed and a dual ring of plated through hole VIAs. The transition from the PCB internal coax to the microstrip section of the high frequency laminate PCB layer uses a ā€œDā€-style opening in the ground layer and a VIA ring arrangement between the layers to optimize or tune the performance of the transition. Additional features in the interface construction are implemented to guaranty that its microwave and mechanical performance does not degrade in extreme environmental conditions.
    Type: Grant
    Filed: August 31, 2007
    Date of Patent: May 27, 2014
    Assignee: Omnitracs, LLC
    Inventors: Jeff Devereux, Fritz Gerd Berger, William A. Johnston, Mohammad Ali Tassoudji, Scott Aldern
  • Patent number: 8471649
    Abstract: A compact Ku band microwave diplexer configured as a three port surface mount component on a miniature alumina substrate. Input signals occurring at a common port having frequencies within a first pass band are passed to a second port while being isolated from signals occurring at a third port. Signals occurring at the third port are passed to the common port while being isolated from the signals at the second port. A microstrip dual spur line filter is used combined with open circuit stubs to provide enhanced second harmonic suppression on the transmit side, while using a coupled line microstrip filter on the receive side. This approach allows for compact size and automated component assembly through pick and place and reflow manufacturing techniques.
    Type: Grant
    Filed: September 7, 2007
    Date of Patent: June 25, 2013
    Assignee: QUALCOMM Incorporated
    Inventors: Jeff Devereux, Fritz Gerd Berger, William A. Johnston, Mohammad Ali Tassoudji, Scott Aldern
  • Publication number: 20100265153
    Abstract: A coaxial to microstrip transition is introduced in a multi layer mixed dielectric printed circuit board environment that provides a 50 Ohm impedance system between a coaxial antenna feed and a surface mount diplexer at Ku-band frequencies. The 50 Ohm transition from the coaxial antenna feed to the diplexer at microwave frequencies lossy FR-4 style laminate is provided by constructing a PCB internal coax using the center conductor of the antenna feed and a dual ring of plated through hole VIAs. The transition from the PCB internal coax to the microstrip section of the high frequency laminate PCB layer uses a ā€œDā€-style opening in the ground layer and a VIA ring arrangement between the layers to optimize or tune the performance of the transition. Additional features in the interface construction are implemented to guaranty that its microwave and mechanical performance does not degrade in extreme environmental conditions.
    Type: Application
    Filed: August 31, 2007
    Publication date: October 21, 2010
    Inventors: Jeff Devereux, Fritz Gerd Berger, William A. Johnston, Mohammad Ali Tassoudji, Scott Aldern
  • Publication number: 20100188167
    Abstract: A compact Ku band microwave diplexer configured as a three port surface mount component on a miniature alumina substrate. Input signals occurring at a common port having frequencies within a first pass band are passed to a second port while being isolated from signals occurring at a third port. Signals occurring at the third port are passed to the common port while being isolated from the signals at the second port. A microstrip dual spur line filter is used combined with open circuit stubs to provide enhanced second harmonic suppression on the transmit side, while using a coupled line microstrip filter on the receive side. This approach allows for compact size and automated component assembly through pick and place and reflow manufacturing techniques.
    Type: Application
    Filed: September 7, 2007
    Publication date: July 29, 2010
    Applicant: Qualcomm Incorporated
    Inventors: Jeff Devereux, Fritz Gerd Berger, William A. Johnston, Mohammad Ali Tassoudji, Scott Aldern
  • Publication number: 20080103722
    Abstract: The specification and drawing figures describe and show an on-board temperature/humidity sensing device that includes an enclosure. The enclosure contains a circuit board. A sensor is mounted on the surface of the circuit board. The sensor is capable of monitoring environmental data within the enclosure. The sensor is operatively connected to a microprocessor with programmable sensor data acquisition capabilities capable of capable of establishing monitored threshold limits of environmental properties within the enclosure, monitoring, and transmitting environmental data to a remote data collector.
    Type: Application
    Filed: September 11, 2006
    Publication date: May 1, 2008
    Inventors: Scott Aldern, Eric Stephen Mattis, Darrell L. Krulce
  • Publication number: 20080064420
    Abstract: A method and apparatus for copying a message sent to a vehicle and routing the copied message to the vehicle driver's mobile phone. Through a driver notification application, the copied message can contain driver identification or driver phone number information that is evaluated and confirmed for forwarding the copied message. The copied message is formatted and is sent to the driver's mobile phone via short message service (SMS).
    Type: Application
    Filed: September 12, 2006
    Publication date: March 13, 2008
    Inventors: Scott Aldern, Eric Stephen Mattis, Darrell L. Krulce
  • Patent number: D439245
    Type: Grant
    Filed: September 9, 1999
    Date of Patent: March 20, 2001
    Assignee: Qualcomm Incorporated
    Inventors: Paul T. Repp, Scott Aldern, Kevin Simmons, Charles Curbbun