Abstract: An interconnection element for coupling a component with a circuit board having a top side and a bottom side has a planar portion configured to be surface mounted on the top side of the circuit board to overlie an opening in the circuit board. An opening is formed in the planar portion to coincide with the circuit board opening. Opposing spring fingers are coupled to the planar portion, and each spring finger has a gripping leg extending downwardly toward the planar portion. The gripping legs are positioned on opposite sides of the opening in the planar portion and extend through the opening in the planar portion to extend into the board opening and capture a component lead that extends in the board opening from the bottom side of the circuit board.

Abstract: A printed wiring board assembly is formed by mounting an insert having a pocket containing one or more standoffs in the cavity of a pallet. The pallet and the insert are both coupled to the bottom of a printed wiring board. A device having tinned leads and a tinned casing is positioned in the pocket of the insert above the standoffs. A solder preform is positioned in the pocket of insert, beneath the casing of the device. The assembly is placed in a soldering oven and heated to a at least a reflow temperature of the solder preform, whereby the device casing is joined to the insert and the device leads are coupled to solder pads on the printed wiring board.