Patents by Inventor Scott Andrew Merritt

Scott Andrew Merritt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020167703
    Abstract: An optical fiber communication system is described that includes a data source that generates electrical data. A transmission filter filters the electrical data generated by the data source and passes a transmission spectrum. The transmitter filter has a transfer function that reduces adjacent symbol interference in a transmission spectrum. The bandwidth of the transmitter filter may be substantially optimized bandwidth. A modulator modulates the transmission spectrum on an optical signal. The modulator may be a substantially chirp-free modulator. A detector detects the modulated optical signal transmitted across an optical channel and converts the detected modulated optical signal to a received electrical data signal. A receiver filter filters the received electrical data signal. The receiver filter has a transfer function that reduces adjacent symbol interference in the received electrical data signal.
    Type: Application
    Filed: May 3, 2001
    Publication date: November 14, 2002
    Inventor: Scott Andrew Merritt
  • Patent number: 6027957
    Abstract: A method and a resulting device for mounting a semiconductor to a submount by depositing a first layer of a first metal solder having a selected first melting point and corresponding thickness onto a surface of the semiconductor. Depositing a second layer of a second metal solder having a selected second melting point higher than the first melting point and a corresponding selected thickness onto a surface of the submount. Disposing the semiconductor surface and submount surface in confronting intimate contact and heating the submount and semiconductor to a temperature greater than the first temperature and lower that the second temperature for initiating and promoting liquid interdiffusion between the first and second solders.
    Type: Grant
    Filed: June 27, 1996
    Date of Patent: February 22, 2000
    Assignee: University of Maryland
    Inventors: Scott Andrew Merritt, Peter John Schultz Heim, Mario Dagenais