Abstract: A magnetic write head for data recording having a magnetic write pole with a stepped magnetic shell structure that defines a secondary flare point. The secondary flare point defined by the magnetic shell portion can be more tightly controlled with respect to its distance from the air bearing surface (ABS) of the write head than can a traditional flare point that is photolithographically on the main pole structure. This allows the effective flare point of the write head to be moved much closer to the ABS than would otherwise be possible using currently available tooling and photolithography techniques. The write head also includes a non-magnetic spacer layer formed over the magnetic shell structure that is recessed from the ABS by a distance that is greater than that of the magnetic shell portion. A magnetic shield is formed over the magnetic shell and non-magnetic spacer.

Abstract: A magnetic write head for data recording having a magnetic write pole with a stepped magnetic shell structure that defines a secondary flare point. The secondary flare point defined by the magnetic shell portion can be more tightly controlled with respect to its distance from the air bearing surface (ABS) of the write head than can a traditional flare point that is photolithographically on the main pole structure. This allows the effective flare point of the write head to be moved much closer to the ABS than would otherwise be possible using currently available tooling and photolithography techniques. The write head may also include a magnetic trailing shield that wraps around the main pole portion. The trailing shield can have a hack edge defining a trailing shield throat height that is either between the secondary flare point or coincident or behind the secondary flare point, depending on design requirements.

Abstract: A method for forming a tapered, electroplated structure. The method involves forming a first mask structure having an opening. A shrink material is deposited into the opening, such that the thickness of the shrink material is less than the thickness of the first mask structure. The first mask structure and the shrink material are then heated causing the sides of the opening in the mask structure to bulge inward. The shrink material is then removed, and a first electrically conductive material can then be electroplated into the opening to a thickness that is much less than the thickness of the mask. The bulbous shaped of the deformed photoresist mask forms a taper on the first electrically conductive material. The first mask can then be removed and a second electrically conductive material can be electroplated over the first electrically conductive material.

Abstract: A method and structure for reducing corrosion during the manufacture of perpendicular write heads is disclosed. Auxiliary pole structures (otherwise known as trailing shields and wrap around shields) are susceptible to corrosion due to their iron containing composition and small dimensions. The impact of corrosion can be reduced by utilizing a gap material comprising an upper surface of noble metals, which extends from underneath the auxiliary pole and is exposed to the same corrosive environment during processing. The area of the exposed gap material is limited to optimize corrosion protection.

Abstract: A method for self aligning a lapping guide with a structure of a write pole. A write pole is formed over a substrate and an electrically conductive material lapping guide material is deposited in a location that is removed from the write pole. A mask is then formed over a portion of the write pole and a portion of the electrically conductive material. A material removal process such as reactive ion etching can then be performed to remove a portion of the magnetic material that is not protected by the mask structure. An magnetic material is then electroplated over the write pole with the write pole, with the mask still in place. In this way, the electroplated material has an edge that is self aligned with an edge of the electrically conductive lapping guide material, both being defined by the same mask structure.

Abstract: A magnetic write head for data recording having a magnetic write pole with a stepped magnetic shell structure that defines a secondary flare point. The secondary flare point defined by the magnetic shell portion can be more tightly controlled with respect to its distance from the air bearing surface (ABS) of the write head than can a traditional flare point that is photolithographically on the main pole structure. This allows the effective flare point of the write head to be moved much closer to the ABS than would otherwise be possible using currently available tooling and photolithography techniques. The write head also includes a non-magnetic spacer layer formed over the magnetic shell structure and a trailing magnetic shield, a portion of which is formed over the non-magnetic spacer.

Abstract: A magnetic write head for data recording having a magnetic write pole with a stepped magnetic shell structure that defines a secondary flare point. The secondary flare point defined by the magnetic shell portion can be more tightly controlled with respect to its distance from the air bearing surface (ABS) of the write head than can a traditional flare point that is photolithographically on the main pole structure. This allows the effective flare point of the write head to be moved much closer to the ABS than would otherwise be possible using currently available tooling and photolithography techniques. The write head also includes a non-magnetic spacer layer formed over the magnetic shell structure that is recessed from the ABS by a distance that is greater than that of the magnetic shell portion. A magnetic shield is formed over the magnetic shell and non-magnetic spacer.

Abstract: A method for forming a tapered, electroplated structure. The method involves forming a first mask structure having an opening. A shrink material is deposited into the opening, such that the thickness of the shrink material is less than the thickness of the first mask structure. The first mask structure and the shrink material are then heated causing the sides of the opening in the mask structure to bulge inward. The shrink material is then removed, and a first electrically conductive material can then be electroplated into the opening to a thickness that is much less than the thickness of the mask. The bulbous shaped of the deformed photoresist mask forms a taper on the first electrically conductive material. The first mask can then be removed and a second electrically conductive material can be electroplated over the first electrically conductive material.

Abstract: A magnetic write head for data recording having a magnetic write pole with a stepped magnetic shell structure that defines a secondary flare point. The secondary flare point defined by the magnetic shell portion can be more tightly controlled with respect to its distance from the air bearing surface (ABS) of the write head than can a traditional flare point that is photolithographically on the main pole structure. This allows the effective flare point of the write head to be moved much closer to the ABS than would otherwise be possible using currently available tooling and photolithography techniques. The write head may also include a magnetic trailing shield that wraps around the main pole portion.

Abstract: A method for making a magnetoresistive read head so that the pinned ferromagnetic layer is wider than the stripe height of the free ferromagnetic layer uses ion milling with the ion beam aligned at an angle to the substrate supporting the stack of layers making up the read head. The stack is patterned with photoresist to define a rectangular region with front and back long edges aligned parallel to the read head track width. After ion milling in two opposite directions orthogonal to the front and back long edges, the pinned layer width has an extension. The extension makes the width of the pinned layer greater than the stripe height of the free layer after the substrate and stack of layers are lapped. The length of the extension is determined by the angle between the substrate and the ion beam and the thickness of the photoresist.

Abstract: A method of making a read sensor while protecting it from electrostatic discharge (ESD) damage involves forming a severable shunt during the formation of the read sensor. The method may include forming a resist layer over a plurality of read sensor layers; performing lithography with use of a mask to form the resist layer into a patterned resist which exposes left and right side regions over the read sensor layers as well as a shunt region; etching, with the patterned resist in place, to remove materials in the left and right side regions and in the shunt region; and depositing, with the patterned resist in place, left and right hard bias and lead layers in the left and right side regions, respectively, and in the shunt region for forming a severable shunt which electrically couples the left and right hard bias and lead layers together for ESD protection.

Abstract: A method for forming a perpendicular magnetic recording head using an air-bearing surface damascene process and perpendicular magnetic recording head formed thereby is disclosed. The perpendicular head is formed by depositing a pseudo trailing shield layer over a pole layer and selectively etching the pseudo trailing shield layer to a depth equal to a desired trailing shield throat height. Then, a magnetic material is deposited in the resulting void.

Abstract: An in-line lapping guide uses a contiguous resistor in a cavity to separate a lithographically-defined sensor from the in-line lapping guide. As lapping proceeds through the cavity toward the sensor, the resistance across the sensor leads increases to a specific target, thereby indicating proximity to the sensor itself. The contiguous resistor is fabricated electrically in parallel to the sensor and the in-line lapping guide. The total resistance across the sensor leads show resistance change even when lapping through the cavity portion. One method to produce the contiguous resistor is to partial mill the cavity between the sensor and the in-line lapping guide so that a film of metal is left. Total resistance across leads is the parallel resistance of the sensor, the contiguous resistor, and the in-line lapping guide.

Abstract: A read head has a bottom lead made of material that is relatively polish resistant and a top lead layer that polishes down more easily than the bottom layer. With this structure, when the layers are deposited and then polished down, the top layer recesses away from the sensor (and bottom lead layer) in a controlled fashion, providing an acceptable lead structure that reduces the mismatch between the read head physical read width and magnetic read width.

Abstract: A bilayer mask employed for lift off has a top strip which bridges between first and second bilayer portions and is completely undercut so that when one or more materials is sputter deposited the materials do not form fences abutting recessed edges of a bottom layer in undercuts below a top layer. Sacrificial protective layers are formed on a sensor and lead layers for protecting these components while overlapping portions of these materials on the top of the sensor formed during deposition can be removed by ion beam sputtering, after which the sacrificial protective layers can be removed by ion milling or reactive ion etching.

Abstract: A bilayer mask employed for lift off has a top strip which bridges between first and second bilayer portions and is completely undercut so that when one or more materials is sputter deposited the materials do not form fences abutting recessed edges of a bottom layer in undercuts below a top layer. Sacrificial protective layers are formed on a sensor and lead layers for protecting these components while overlapping portions of these materials on the top of the sensor formed during deposition can be removed by ion beam sputtering, after which the sacrificial protective layers can be removed by ion milling or reactive ion etching.

Abstract: The present invention relates to an improved lithographic imaging process for use in the manufacture of integrated circuits. The process provides protection to the photoresist film from airborne chemical contaminants.