Abstract: Systems, methods, and media for synchronization of independent sensors and recording devices are provided. A method includes recording, through a synchronizing sensor, sensor data detected from an event. The method may further output from the synchronizing sensor, the sensor data from the event and a periodic synchronizing signal. The method also generates, from a recorder, recorded event data comprising the periodic synchronizing signal and first additional data recorded from the event. The method outputs the recorded event data from the recorder. The method receives the sensor data from the event and the recorded event data. The method synchronizes according to the periodic synchronizing signal, at the computing device, the recorded event data and the sensor data from the event.

Abstract: A method for processing a wafer with a wafer bevel that surrounds a central region is provided. The wafer is placed in a bevel plasma processing chamber. A protective layer is deposited on the wafer bevel without depositing the protective layer over the central region. The wafer is removed from the bevel plasma processing chamber. The wafer is further processed.

Abstract: A method for preventing formation of metal silicide material on a wafer bevel is provided, where the wafer bevel surrounds a central region of the wafer. The wafer is placed in bevel plasma processing chamber. A protective layer is deposited on the wafer bevel. The wafer is removed from the bevel plasma processing chamber. A metal layer is deposited over at least part of the central region of the wafer, wherein part of the metal layer is deposited over the protective layer. Semiconductor devices are formed while preventing metal silicide formation on the wafer bevel.

Abstract: A method for processing a wafer with a wafer bevel that surrounds a central region is provided. The wafer is placed in a bevel plasma processing chamber. A protective layer is deposited on the wafer bevel without depositing the protective layer over the central region. The wafer is removed from the bevel plasma processing chamber. The wafer is further processed.

Abstract: A method for preventing formation of metal silicide material on a wafer bevel is provided, where the wafer bevel surrounds a central region of the wafer. The wafer is placed in bevel plasma processing chamber. A protective layer is deposited on the wafer bevel. The wafer is removed from the bevel plasma processing chamber. A metal layer is deposited over at least part of the central region of the wafer, wherein part of the metal layer is deposited over the protective layer. Semiconductor devices are formed while preventing metal silicide formation on the wafer bevel.

Abstract: A method is provided for fabricating a semiconductor device having a gate electrode overlying a gate insulator. The method, in accordance with one embodiment, comprises depositing a layer of spin on glass overlying the gate electrode, the layer of spin on glass comprising a substantially UV opaque material. The layer of spin on glass is heated to a temperature less than about 450° C., and all subsequent process steps in the fabrication of the device are limited to temperatures less than about 450° C.

Abstract: Methods and systems for offering debt recovery products to customers having delinquent accounts are disclosed. A debt recovery service retrieves delinquent account information corresponding to a customer. Based on the retrieved delinquent account information, the debt recovery service determines a set of debt recovery offers for the customer. The customer sends customer selection information to the debt recovery service. Customer selection information customizes a debt recovery product that corresponds to one of the set of debt recovery offers. The debt recovery service then creates a debt recovery account for the customized debt recovery product.

Abstract: Information concerning at least one potential customer is received and then a plurality of addresses for the at least one potential customer are generated. A determination is then made as to whether the number of generated addresses for the at least one potential customer is equal to or below a threshold number. If the number of generated addresses for the potential customer is equal to or below the threshold number, then the potential customer is solicited at each of the generated addresses. If the number of generated addresses for the potential customer is above the threshold number, then using an address selection model a set of addresses equal to the threshold number is selected from the generated addresses and the potential customer is solicited at the selected addresses.

Abstract: Methods and systems for offering debt recovery products to customers having delinquent accounts are disclosed. A debt recovery service retrieves delinquent account information corresponding to a customer. Based on the retrieved delinquent account information, the debt recovery service determines a set of debt recovery offers for the customer. The customer sends customer selection information to the debt recovery service. Customer selection information customizes a debt recovery product that corresponds to one of the set of debt recovery offers. The debt recovery service then creates a debt recovery account for the customized debt recovery product.

Abstract: A blank for closing an input/output slot in the rear panel of a personal computer has an elongated body with a tab on one end and a flange on an opposite end. The body also has a large elliptical dome that protrudes rearward. A set of spring fingers extend along each side of the dome. The blank is installed in one of the input/output slots by first inserting the tab into a pocket below the slot. The dome is then pivoted into the slot until the fingers snap onto a pair of upright edges that define the slot. The blank is removed from the slot by pushing the dome in the opposite direction out of slot to overcome the flexible retention force provided by the fingers.

Abstract: A method of fabricating integrated circuits utilizing dual damascene processing when a soft insulative material, such as a polymer, is used. Vertical and horizontal edges of via and conductive line openings are protected from degradation during a second etching step by, prior to the second etching, depositing a hard mask material on each insulative material layer to protect the horizontal edges and depositing a spacer material to protect the vertical edges.

Abstract: A portable electronic component transport and interconnection assembly 2 includes a removable console 50 that can be mounted in a host or vehicle and connected to a permanently mounted output connector 10 by simple linear longitudinal movement followed by linear lateral movement. The removable console 50 includes input contact members 62, 64 and 66 for connecting the console to a source of power, ground and electrical signals. The input contact members are L-shaped with a contact interface 72 located on the rear of the input contact member. The output connector includes a curved resilient contact 12 that is located on the inside of a connector front wall adjacent to one of several openings 30, 32, 34. A spring loaded door 40 normally closes these openings, but the input contact members push this door 40 during initial longitudinal movement. The input contact members are then moved laterally so that the contact interfaces 72 engage corresponding resilient contacts 12.