Patents by Inventor Scott Butler

Scott Butler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050067975
    Abstract: A discharge lamp system and method of operating a discharge lamp system in which vertical segregation of vapor phase species is reduced. Lamp power is modulated with an arc-straightening frequency and with a frequency that excites a combination radial plus longitudinal acoustic mode of the lamp. The combination radial plus longitudinal acoustic mode may be a combination first radial mode and nth longitudinal acoustic mode and may be excited with a single power frequency or a swept power frequency range. The two frequencies may be provided at the same time, or separately where the modulation at the arc-straightening frequency is 2 to 16 times longer than a subsequent modulation at the combination radial plus longitudinal acoustic mode.
    Type: Application
    Filed: September 25, 2003
    Publication date: March 31, 2005
    Inventors: Nancy Chen, Scott Butler, Joseph Olsen
  • Patent number: 6391468
    Abstract: Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: May 21, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Richard Regner, Scott Butler, Carey Blue
  • Publication number: 20010011676
    Abstract: Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.
    Type: Application
    Filed: March 30, 2001
    Publication date: August 9, 2001
    Inventors: Richard Regner, Scott Butler, Carey Blue
  • Patent number: 6248452
    Abstract: Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.
    Type: Grant
    Filed: April 17, 2000
    Date of Patent: June 19, 2001
    Assignee: Micron Technology, Inc.
    Inventors: Richard Regner, Scott Butler, Carey Blue
  • Patent number: 6094832
    Abstract: Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.
    Type: Grant
    Filed: March 17, 1999
    Date of Patent: August 1, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Richard Regner, Scott Butler, Carey Blue
  • Patent number: 6012231
    Abstract: Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.
    Type: Grant
    Filed: December 8, 1997
    Date of Patent: January 11, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Richard Regner, Scott Butler, Carey Blue
  • Patent number: 5344815
    Abstract: A method for producing a superconducting copper oxide based helical resonator coil exhibiting improved quality factor, Q. A copper oxide based superconductor powder is mixed with a binder melt at about 45-65% solids by volume. The binder is an RCOOR' ester wax with R and R' each a long chain hydrocarbon group of at least 6 carbons. The ester wax has a melting point of about 40.degree.-100.degree. C. and a viscosity of about 94-2000 centipoise at its melting point. The binder/powder mixture is extruded and wrapped around a mandrel to form a helical coil. The coil is embedded in a setter powder and heated in an oxidizing atmosphere at up to about 2.degree. C./min to about 450.degree.-650.degree. C., and held for a time sufficient to remove the binder. The coil is then heated in the oxidizing atmosphere at up to about 3.degree. C./min to at least about 920.degree. C., and held at about 920.degree.-990.degree. C. for a time sufficient to achieve a density of at least about 93% of theoretical density.
    Type: Grant
    Filed: April 29, 1992
    Date of Patent: September 6, 1994
    Assignee: GTE Laboratories Incorporated
    Inventors: Sophia R. Su, Margaret O'Connor, Scott Butler
  • Patent number: D500569
    Type: Grant
    Filed: February 3, 2004
    Date of Patent: January 4, 2005
    Assignee: Acuity Brands, Inc.
    Inventor: Doyle Scott Butler
  • Patent number: D447590
    Type: Grant
    Filed: October 31, 2000
    Date of Patent: September 4, 2001
    Assignee: NSI Enterprises, Inc.
    Inventors: Sayed A. Raouf, Doyle Scott Butler