Patents by Inventor Scott C. Perzanoski

Scott C. Perzanoski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • AUDIO DEVICE WITH ELECTROSTATIC DISCHARGE PROTECTION
    Publication number: 20240179462
    Abstract: Various implementations include audio devices configured to mitigate electrostatic discharge (ESD) events, or strikes. In certain implementations, an audio device includes: a microphone mounted on a first side of a printed wiring board (PWB); and an electrostatic discharge (ESD) protection element coupled to a second side of the PWB directly opposite the microphone, wherein the ESD protection element is positioned to divert an ESD strike away from the microphone.
    Type: Application
    Filed: April 1, 2022
    Publication date: May 30, 2024
    Inventors: Donna Marie SULLIVAN, Thomas Aquinas NILSEN, James Joung-Mo KANG, Scott C. PERZANOSKI, Mark MCCAULEY, Richmond Andrew REAL
  • Flexible printed circuit
    Patent number: 9560748
    Abstract: A flexible printed circuit includes a first insulating substrate layer and a first electrically conductive layer located adjacent to a first side of the insulating substrate layer. The first conductive layer has a first portion that is substantially solid and a second portion having a multiplicity of voids in the first conductive layer in a pattern for providing a lower stiffness in the second portion relative to the first portion, thereby providing more flexibility in the second portion relative to the first portion.
    Type: Grant
    Filed: January 4, 2013
    Date of Patent: January 31, 2017
    Assignee: Bose Corporation
    Inventors: Drew Stone Briggs, Scott C. Perzanoski
  • Flexible Printed Circuit
    Publication number: 20140190729
    Abstract: A flexible printed circuit includes a first insulating substrate layer and a first electrically conductive layer located adjacent to a first side of the insulating substrate layer. The first conductive layer has a first portion that is substantially solid and a second portion having a multiplicity of voids in the first conductive layer in a pattern for providing a lower stiffness in the second portion relative to the first portion, thereby providing more flexibility in the second portion relative to the first portion.
    Type: Application
    Filed: January 4, 2013
    Publication date: July 10, 2014
    Inventors: Drew Stone Briggs, Scott C. Perzanoski