Abstract: Die handling systems and methods of use for preparing or processing dies from multiple types of pre-expanded wafer materials. The die handling systems are configured in a modular fashion, allowing for concurrent processes to expand the wafers, process the wafers, extract the dies, and inspect the extracted dies without forcing one of the processes of the system to remain idle. Embodiments of the wafer handler module include a mechanism, such as an expander capable of stretching or expanding wafers having one or more different sizes to a pre-expanded state without interrupting the die handler. The pre-expanded wafers are stored as a proprietary cartridge and delivered to the die handler, where a pick head of the die handler removes each die of the pre-expanded wafer and delivers the extracted dies to subsequent machinery, such as a pick and place machine, for further processing.

Abstract: Die handling systems and methods of use for preparing or processing dies from multiple types of pre-expanded wafer materials. The die handling systems are configured in a modular fashion, allowing for concurrent processes to expand the wafers, process the wafers, extract the dies, and inspect the extracted dies without forcing one of the processes of the system to remain idle. Embodiments of the wafer handler module include a mechanism, such as an expander capable of stretching or expanding wafers having one or more different sizes to a pre-expanded state without interrupting the die handler. The pre-expanded wafers are stored as a proprietary cartridge and delivered to the die handler, where a pick head of the die handler removes each die of the pre-expanded wafer and delivers the extracted dies to subsequent machinery, such as a pick and place machine, for further processing.

Abstract: Disclosed herein is a feeder that includes a receiver configured to receive a reel of carrier tape having media disposed thereon, a presentation location configured to present media from the reel for a subsequent picking process, a media straightener. The media straightener includes an inlet configured to receive the carrier tape and an outlet configured to expel the carrier tape to the presentation location. The media straightener includes a path located between the inlet and the outlet, the path including a first bend configured to permanently deform the media as the carrier tape moves through the first bend. Further disclosed is a media straightener and a method of straightening media.

Abstract: In a variable-pitch tape feeder for feeding parts to a pick and place machine used to produce electronic circuit boards, a switch assembly is provided which controls the limits of a shutter movement and the tape advance distance dependent upon the desired pitch. The tape feeder uses a carrier tape to deliver parts to the pick and place machine. The parts are inserted into depressions at regular intervals along the length of the tape. To accommodate tapes of varying pitches, i.e., distances between parts, the feeder uses an electronic control unit to drive the tape feed mechanism and actuate a shutter. The shutter prevents small parts from escaping their respective depressions prematurely. The switch provides a stop surface which limits the rearward travel of the shutter and a flag which is detected by optical sensors to determine the position of the switch and thus the pitch desired by the operator.