Abstract: An apparatus with a line card having a front panel including at least one input/output port. The apparatus further includes a line card interface assembly. The line card interface assembly includes at least one of an input and output line support, at least one guide vane cooperating with said line, and a front face providing an electrical coupling with said front panel sufficient to attenuate electromagnetic waves passing through the front panel.

Abstract: Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high or low temperature cofired ceramic layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package.