Patents by Inventor Scott C. Wackerman

Scott C. Wackerman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Environment exchange control for material on a wafer surface
    Patent number: 6911091
    Abstract: Systems and methods are described for environmental exchange control for a polymer on a wafer surface. An apparatus for controlling an exchange between an environment and a polymer on a surface of a wafer located in the environment includes: a chamber adapted to hold the wafer, define the environment, and maintain the polymer in an adjacent relationship with the environment; and a heater coupled to the chamber. A method for improving performance of a spin-on material includes: forming the spin-on material on a surface of a wafer; then locating the spin-on material in an environment so that said environment is adjacent said spin-on material; and then controlling an exchange between the spin-on material and said environment. The systems and methods provide advantages because inappropriate deprotection is mitigated by careful control of the environmental temperature and environmental species partial pressures (e.g. relative humidity).
    Type: Grant
    Filed: June 3, 2002
    Date of Patent: June 28, 2005
    Assignee: ASML Netherlands B.V.
    Inventors: Emir Gurer, Ed C. Lee, Tom Zhong, Kevin Golden, John W. Lewellen, Scott C. Wackerman, Reese Reynolds
  • Environment exchange control for material on a wafer surface
    Patent number: 6844027
    Abstract: Systems and methods are described for environmental exchange control for a polymer on a wafer surface. An apparatus for controlling an exchange between an environment and a polymer on a surface of a wafer located in the environment includes: a chamber adapted to hold the wafer, define the environment, and maintain the polymer in an adjacent relationship with the environment; and a heater coupled to the chamber. A method for improving performance of a spin-on material includes: forming the spin-on material on a surface of a wafer; then locating the spin-on material in an environment so that said environment is adjacent said spin-on material; and then controlling an exchange between the spin-on material and said environment. The systems and methods provide advantages because inappropriate deprotection is mitigated by careful control of the environmental temperature and environmental species partial pressures (e.g. relative humidity).
    Type: Grant
    Filed: May 2, 2000
    Date of Patent: January 18, 2005
    Assignee: ASML Holding N.V.
    Inventors: Emir Gurer, Ed C. Lee, Tom Zhong, Kevin Golden, John W. Lewellen, Scott C. Wackerman, Reese Reynolds
  • Environment exchange control for material on a wafer surface
    Patent number: 6780461
    Abstract: Systems and methods are described for environmental exchange control for a polymer on a wafer surface. An apparatus for controlling an exchange between an environment and a polymer on a surface of a wafer located in the environment includes: a chamber adapted to hold the wafer, define the environment, and maintain the polymer in an adjacent relationship with the environment; and a heater coupled to the chamber. A method for improving performance of a spin-on material includes: forming the spin-on material on a surface of a wafer; then locating the spin-on material in an environment so that said environment is adjacent said spin-on material; and then controlling an exchange between the spin-on material and said environment. The systems and methods provide advantages because inappropriate deprotection is mitigated by careful control of the environmental temperature and environmental species partial pressures (e.g. relative humidity).
    Type: Grant
    Filed: March 1, 2001
    Date of Patent: August 24, 2004
    Assignee: ASML Holding N.V.
    Inventors: Emir Gurer, Ed C. Lee, Tom Zhong, Kevin Golden, John W. Lewellen, Scott C. Wackerman, Reese Reynolds
  • Environment exchange control for material on a wafer surface
    Publication number: 20030010289
    Abstract: Systems and methods are described for environmental exchange control for a polymer on a wafer surface. An apparatus for controlling an exchange between an environment and a polymer on a surface of a wafer located in the environment includes: a chamber adapted to hold the wafer, define the environment, and maintain the polymer in an adjacent relationship with the environment; and a heater coupled to the chamber.
    Type: Application
    Filed: June 3, 2002
    Publication date: January 16, 2003
    Inventors: Emir Gurer, Ed C. Lee, Tom Zhong, Kevin Golden, John W. Lewellen, Scott C. Wackerman, Reese Reynolds
  • Environment exchange control for material on a wafer surface
    Patent number: 6468586
    Abstract: Systems and methods are described for environmental exchange control for a polymer on a wafer surface. An apparatus for controlling an exchange between an environment and a polymer on a surface of a wafer located in the environment includes: a chamber adapted to hold the wafer, define the environment, and maintain the polymer in an adjacent relationship with the environment; and a heater coupled to the chamber. A method for improving performance of a spin-on material includes: forming the spin-on material on a surface of a wafer; then locating the spin-on material in an environment so that said environment is adjacent said spin-on material; and then controlling an exchange between the spin-on material and said environment. The systems and methods provide advantages because inappropriate deprotection is mitigated by careful control of the environmental temperature and environmental species partial pressures (e.g. relative humidity).
    Type: Grant
    Filed: May 8, 2000
    Date of Patent: October 22, 2002
    Assignee: Silicon Valley Group, Inc.
    Inventors: Emir Gurer, Ed C. Lee, Tom Zhong, Kevin Golden, John W. Lewellen, Scott C. Wackerman, Reese Reynolds
  • Environment exchange control for material on a wafer surface
    Patent number: 6254936
    Abstract: Systems and methods are described for environmental exchange control for a polymer on a wafer surface. An apparatus for controlling an exchange between an environment and a polymer on a surface of a wafer located in the environment includes: a chamber adapted to hold the wafer, define the environment, and maintain the polymer in an adjacent relationship with the environment; and a heater coupled to the chamber. A method for improving performance of a spin-on material includes: forming the spin-on material on a surface of a wafer; then locating the spin-on material in an environment so that said environment is adjacent said spin-on material; and then controlling an exchange between the spin-on material and said environment. The systems and methods provide advantages because inappropriate deprotection is mitigated by careful control of the environmental temperature and environmental species partial pressures (e.g. relative humidity).
    Type: Grant
    Filed: December 29, 1998
    Date of Patent: July 3, 2001
    Assignee: Silicon Valley Group, Inc.
    Inventors: Emir Gurer, Ed C. Lee, Tom Zhong, Kevin Golden, John W. Lewellen, Reese Reynolds, Scott C. Wackerman