Patents by Inventor Scott Cogan

Scott Cogan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ULTRASOUND TRANSDUCER ARRAYS
    Publication number: 20150087988
    Abstract: An ultrasound transducer array for an ultrasound probe is presented. The ultrasound transducer array includes a support structure. Further, the ultrasound transducer array includes a plurality of electro-acoustic modules coupled to the support structure, wherein each of the plurality of electro-acoustic modules comprises at least one matrix acoustic array and an interconnect element, wherein each of the plurality of electro-acoustic modules is interchangeable on the support structure so as to adapt to one or more shapes of the ultrasound probe, and wherein each of the plurality of electro-acoustic modules operates in a manner substantially identical to each other of the plurality of electro-acoustic modules.
    Type: Application
    Filed: September 20, 2013
    Publication date: March 26, 2015
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Warren Lee, Bruno Hans Haider, Stephen Dodge Edwardsen, Geir Ultveit Haugen, Scott Cogan, Chester Saj, Christopher Yetter, Bjornar Sten-Nilsen, Shinichi Amemiya, Charles Edward Baumgartner
  • Modular sensor assembly and methods of fabricating the same
    Patent number: 7451651
    Abstract: A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor sub-arrays. The electronics array comprises a plurality of integrated circuit modules, each comprising a plurality of integrated circuit chips. The sensor modules may be coupled to the electronics modules via flip chip technology.
    Type: Grant
    Filed: December 11, 2006
    Date of Patent: November 18, 2008
    Assignee: General Electric Company
    Inventors: Charles Gerard Woychik, Rayette Ann Fisher, David Martin Mills, Scott Cogan, David Richard Esler, Robert Gideon Wodnicki, Jeffrey Scott Erlbaum
  • Modular sensor assembly and methods of fabricating the same
    Publication number: 20080134793
    Abstract: A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor sub-arrays. The electronics array comprises a plurality of integrated circuit modules, each comprising a plurality of integrated circuit chips. The sensor modules may be coupled to the electronics modules via flip chip technology.
    Type: Application
    Filed: December 11, 2006
    Publication date: June 12, 2008
    Inventors: Charles Gerard Woychik, Rayette Ann Fisher, David Martin Mills, Scott Cogan, David Richard Esler, Robert Gideon Wodnicki, Jeffrey Scott Erlbaum