Abstract: Disclosed herein are systems and methods for sensor systems. In one embodiment, a system may include an implantable component and an external component. The implantable component may comprise a housing and an electrode array configured to receive a plurality of biopotential signals. The housing may comprise a wireless power receiver and a wireless data transmitter to transmit representations of the biopotential signals. The external component may comprise a wireless data receiver configured to receive the plurality of digital representations of the biopotential signals and a wireless power transmitter configured to provide power to the internal component. A shielding component may separate the wireless power transmitter from the wireless data receiver. An interface may be configured to communicate with a prosthesis and configured to cause the prosthesis to implement a voluntary motion based on the plurality of digital presentations of the biopotential signals.

Abstract: Disclosed herein are systems and methods for sensor systems. In one embodiment, a system may include an implantable component and an external component. The implantable component may comprise a housing and an electrode array configured to receive a plurality of biopotential signals. The housing may comprise a wireless power receiver and a wireless data transmitter to transmit representations of the biopotential signals. The external component may comprise a wireless data receiver configured to receive the plurality of digital representations of the biopotential signals and a wireless power transmitter configured to provide power to the internal component. A shielding component may separate the wireless power transmitter from the wireless data receiver. An interface may be configured to communicate with a prosthesis and configured to cause the prosthesis to implement a voluntary motion based on the plurality of digital presentations of the biopotential signals.

Abstract: Disclosed herein are systems and methods for sensor systems. In one embodiment, a system may include an implantable component and an external component. The implantable component may comprise a housing and an electrode array configured to receive a plurality of biopotential signals. The housing may comprise a wireless power receiver and a wireless data transmitter to transmit representations of the biopotential signals. The external component may comprise a wireless data receiver configured to receive the plurality of digital representations of the biopotential signals and a wireless power transmitter configured to provide power to the internal component. A shielding component may separate the wireless power transmitter from the wireless data receiver. An interface may be configured to communicate with a prosthesis and configured to cause the prosthesis to implement a voluntary motion based on the plurality of digital presentations of the biopotential signals.

Abstract: Disclosed herein are systems and methods for sensor systems. In one embodiment, a system may include an implantable component and an external component. The implantable component may comprise a housing and an electrode array configured to receive a plurality of biopotential signals. The housing may comprise a wireless power receiver and a wireless data transmitter to transmit representations of the biopotential signals. The external component may comprise a wireless data receiver configured to receive the plurality of digital representations of the biopotential signals and a wireless power transmitter configured to provide power to the internal component. A shielding component may separate the wireless power transmitter from the wireless data receiver. An interface may be configured to communicate with a prosthesis and configured to cause the prosthesis to implement a voluntary motion based on the plurality of digital presentations of the biopotential signals.

Abstract: Modular dies and modular masks for the manufacture of semiconductor devices are described. The modular mask can be used repeatedly to make multiple, substantially-similar modular dies. The modular die contains a substrate with an integrated circuit and a conductive layer containing a source metal and a gate metal connected respectively to the source and gate of the integrated circuit. The gate metal is located in an outer portion of the modular die. The modular die can be made by providing the integrated circuit in first and second portions of the substrate, providing the conductive layer on both first and second portions, making a first modular die by patterning the conductive layer on the first portion using the modular mask, moving the mask to the second portion and using it to make a second modular die by patterning the conductive layer on the second portion. Other embodiments are described.

Abstract: Modular dies and modular masks that can be used during the manufacture of semiconductor devices are described. The modular mask can be used repeatedly to make multiple, substantially-similar modular dies. The modular die contains a substrate with an integrated circuit as well as a conductive layer containing a source metal and a gate metal connected respectively to the source and gate of the integrated circuit. The gate metal of the conductive layer is located only in an outer portion of the modular die. The modular die can be made by providing the integrated circuit in a first and second portion of the substrate, providing the conductive layer on both the first and second portions, making a first modular die by patterning the conductive layer on the first portion using the modular mask; moving the modular mask to the second portion and using it to make a second modular die by patterning the conductive layer on the second portion. Thus, fewer mask sets need to be made, improving efficiency and reducing costs.

Abstract: Modular dies and modular masks that can be used during the manufacture of semiconductor devices are described. The modular mask can be used repeatedly to make multiple, substantially-similar modular dies. The modular die contains a substrate with an integrated circuit as well as a conductive layer containing a source metal and a gate metal connected respectively to the source and gate of the integrated circuit. The gate metal of the conductive layer is located only in an outer portion of the modular die. The modular die can be made by providing the integrated circuit in a first and second portion of the substrate, providing the conductive layer on both the first and second portions, making a first modular die by patterning the conductive layer on the first portion using the modular mask; moving the modular mask to the second portion and using it to make a second modular die by patterning the conductive layer on the second portion. Thus, fewer mask sets need to be made, improving efficiency and reducing costs.