Patents by Inventor Scott D. Brandenburg

Scott D. Brandenburg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5562498
    Abstract: A flexible capacitor is provided which is suitable for use in conjunction with a magnetic core for forming a CLC or pi filter, such as the type used for electrical connectors in the engine control hardware for an automobile. The flexible capacitor is generally composed of a flexible substrate having a surface on which interleaved conductor layers are supported. The interleaved conductor layers include at least two conductor layers, a first of which is composed of a plurality of islands of electrically conductive material which are electrically isolated from each other, while a second layer is composed of an electrically conductive material. A dielectric layer is disposed intermediate each adjacent pair of conductor layers so as to form a capacitive structure. The first conductor layer serves as the signal capacitor plate, while the second conductor layer serves as the ground capacitor plate.
    Type: Grant
    Filed: December 21, 1994
    Date of Patent: October 8, 1996
    Assignee: Delco Electronics Corp.
    Inventors: Scott D. Brandenburg, William S. Murphy, David A. King
  • Patent number: 5491364
    Abstract: A terminal pattern is provided for an integrated circuit device, such as a ball grid array package or an integrated circuit flip chip. The terminal pattern is composed of a number of terminals arranged in concentric arrays, each array having a substantially circular shape and being composed of a number of terminals. The terminal pattern is composed of at least two arrays, and more typically three or more arrays. When the integrated circuit device is mounted to its intended substrate, the individual terminals of the terminal pattern each register with and are soldered to a corresponding conductor of a conductor pattern formed on the substrate. A significant advantage is that, due to the terminals of the terminal pattern being arranged in concentric arrays, a smaller maximum width for the terminal pattern is achieved than possible with a conventional rectangular terminal pattern having the same number of terminals.
    Type: Grant
    Filed: August 31, 1994
    Date of Patent: February 13, 1996
    Assignee: Delco Electronics Corporation
    Inventors: Scott D. Brandenburg, William S. Murphy, Ahmer R. Syed, David A. King, Shing Yeh