Abstract: A non-hermetic, three-dimensional, microwave semiconductor device carrier with integral waveguide couplers is disclosed. A molded plastic substrate having a suitable dielectric constant and varying thicknesses comprises plated conductors and locations for receiving GaAs MMIC's. MMIC's are mounted to a metal backplate and die bonded to the plated conductors. The waveguide couplers are integrally molded as part of the carrier substrate, and comprise plated through cylindrical members. Signals from a waveguide cavity are coupled to the MMIC's by inserting the waveguide couplers into a waveguide port. The carrier and integral waveguide coupler together with a plated molded cover forms a non-hermetic package providing pseudo-shielding cavities about the resident multiple semiconductor GaAs die. Transmission line impedance control is enhanced varying the substrate thickness on a per conductor basis. Frequency of operation exceeds 12 gigahertz.

Abstract: An antenna is disclosed for increasing the gain of, or shaping the pattern of, a radiated radio frequency signal. The antenna includes a waveguide for directing the radio frequency signal or for receiving directively the radio signal, a first conductive reflector disposed beneath the waveguide and extending beyond the aperture of the waveguide for reflecting certain of the waves emanating from or entering the aperture of the waveguide, and a second reflector, which may be the mounting surface, disposed beneath the first reflector and extending beyond the first reflector for reflecting other of the waves emanating from or entering the aperture of the waveguide.