Abstract: Various aspects of the present disclosure are directed toward implantable medical devices, systems, and methods for cardiac assistance.

Abstract: A flow testing system and method are provided for facilitating the continuous flow testing of fluid flow systems and components. An exemplary flow testing system and method are suitably configured for direct implementation into the manufacturing processes for fluid flow systems and components or for stand-alone operation, and can facilitate increased flow testing throughput. An exemplary flow testing system comprises a flow amplifier subsystem, a piping subsystem, a venturi subsystem, and an output coupling subsystem. The flow amplifier subsystem is configured for coupling to an ambient air source, while the output coupling subsystem is configured for coupling to a fluid flow component for testing.

Abstract: A method of and an apparatus for the electroplating of material onto substrates, such as computer memory disks, by use of a plating cell comprising cathodes, anodes, passive shields, filters, an oscillation system and an electrical power supply. Anodes and magnets are attached to the inside side walls of the plating cell. The magnets have a coating of an electrically nonconducting material covering it. Shields, each having a filter attached to it, are also fixed to the inside side walls. A pallet, having openings for holding disk substrates during electroplating, is placed between the shields in the plating cell. The disk substrates function as cathodes during electrolytic plating. The anodes and cathodes when electrically energized results in deposition of desired material, having uniform thickness, across the entire surface area of the substrate.

Abstract: A method of and an apparatus for the electroplating of material onto substrates, such as computer memory disks, by use of a plating cell comprising cathodes, anodes, passive shields, filters, an oscillation system and an electrical power supply. Anodes and magnets are attached to the inside side walls of the plating cell. The magnets have a coating of an electrically non-conducting material covering it. Shields, each having a filter attached to it, are also fixed to the inside side walls. A pallet, having openings for holding disk substrates during electroplating, is placed between the shields in the plating cell. The disk substrates function as cathodes during electrolytic plating. The anodes and cathodes when electrically energized results in deposition of desired material, having uniform thickness, across the entire surface area of the substrate.