Abstract: Polishing media in the form of bristles made from a porous polymer-based material, apparatus and systems including the media, and methods of forming and using the media, apparatus, and systems are disclosed. A method of manufacturing bristles for use in polishing a workpiece which includes a non-planar surface includes the steps of combining a liquid polymer material and a foaming agent to form a foamed polymeric material, and separating the foamed polymeric material into a plurality of bristles. The foaming agent is configured to impart a porosity to the polymeric material, where the porosity is characterized by a density in the range of 0.3 to 1.2 g/cm3.

Abstract: Polishing media in the form of bristles made from a porous, non-porous, or minimally porous polymer-based material, apparatus and systems including the media, and methods of forming and using the media, apparatus, and systems are disclosed. An exemplary method of manufacturing bristles for use in polishing a workpiece which includes a non-planar surface includes the steps of combining a liquid polymer comprising a TDI polyester pre-polymer having an NCO content in the range of 5% with a curative to form a polymeric material, separating the foamed polymeric material into a plurality of bristles, and stitching the bristles onto a platen.

Abstract: Polishing media in the form of bristles made from a porous polymer-based material, apparatus and systems including the media, and methods of forming and using the media, apparatus, and systems are disclosed. A method of manufacturing bristles for use in polishing a workpiece which includes a non-planar surface includes the steps of combining a liquid polymer material and a foaming agent to form a foamed polymeric material, and separating the foamed polymeric material into a plurality of bristles. The foaming agent is configured to impart a porosity to the polymeric material, where the porosity is characterized by a density in the range of 0.3 to 1.2 g/cm3.

Abstract: A polymeric material suitable for use in lapping processes, media including the polymeric material, systems including the media, and methods of forming and using the polymeric material are disclosed. The polymeric material can be used to lap hard surfaces, such as sapphire surfaces. The lapping process can be performed after a grinding process and before a polishing process.

Abstract: Polishing media including a soft polymer-based material, apparatus and systems including the media, and methods of forming and using the media, apparatus, and systems are disclosed.

Abstract: Polishing materials suitable for polishing hard surfaces, media including the polishing material, and methods of forming and using the polishing materials and media are disclosed. Exemplary polishing materials have a relatively high hard segments:soft segments ratio and exhibit relatively high removal rates and/or relatively high process yields.

Abstract: A polymeric material suitable for use in lapping processes, media including the polymeric material, systems including the media, and methods of forming and using the polymeric material are disclosed. The polymeric material can be used to lap hard surfaces, such as sapphire surfaces. The lapping process can be performed after a grinding process and before a polishing process.

Abstract: Polishing materials suitable for polishing hard surfaces, media including the polishing material, and methods of forming and using the polishing materials and media are disclosed. Exemplary polishing materials have a relatively high hard segments:soft segments ratio and exhibit relatively high removal rates and/or relatively high process yields.

Abstract: Polyurea-based materials suitable for grinding media and polishing media, media including the polyurea-based material, and methods of forming and using the polyurea-based material and media are disclosed. The polyurea-based material is formed using one or more secondary polyamines, which allows for slower reaction rates and produces material having desired properties.

Abstract: A polishing pad comprising particles having an average diameter between 1 nanometer and 100 nanometers, wherein the total weight of the particles is greater than about 3% of the total weight of the pad. Also, a method of manufacturing a polishing pad comprises the steps of: mixing a pre-polymer and abrasive particles together; wherein the abrasive particles have an average diameter of between 1 nanometer and 100 nanometers in diameter, and wherein the abrasive particles comprise more than about 3% by weight of the polishing pad; mixing a curative with the mixed pre-polymer and particles; and pouring the mixture of pre-polymer, particles and curative into a mold. In one exemplary embodiment the particles are silica and the pre-polymer is a polyurethane pre-polymer.

Abstract: A polishing/lapping pad for use in CMP and other polishing and lapping operations is presented that comprises multiple channels designed to facilitate in the manipulation of slurry into specific locations on the wafer being planarized.