Abstract: An advanced plant production system comprises a robust and efficient network of lighting, instrumentation and control and data acquisition systems, which are integrated together to maximize plant health, crop production, while conserving resources. The system provides an advanced user interface that can be accessed both locally and remotely. In some embodiments, the lighting can be controlled to mimic the circadian rhythm of the crops or the Sun, and can be matched to a particular type and/or maturity of plant. A sensor node which can be used in the plant production system comprises internal sensors, and can also be connected to other external sensors, to provide detailed environmental information. Several methods are described that can optimize the efficiency of the system, and can be used to improve the yield, value, and/or quality of crops.

Abstract: This invention relates to computer-aided diagnostics using content-based retrieval of histopathological image features. Specifically, the invention relates to the extraction of image features from a histopathological image based on predetermined criteria and their analysis for malignancy determination.

Abstract: This invention relates to computer-aided diagnostics using content-based retrieval of histopathological image features. Specifically, the invention relates to the extraction of image features from a histopathological image based on predetermined criteria and their analysis for malignancy determination.

Abstract: A method for connecting circuit elements within an integrated circuit for reducing single-event upsets is disclosed. The integrated circuit includes a first and second circuit elements that are substantially identical to each other. In order to reduce the single-event upsets to the first and second circuit elements, each of the first and second circuit elements is divided into a first sub-element and a second sub-element. The first sub-element of the first circuit element is connected to the second sub-element of the second circuit element. The second sub-element of the first circuit element is connected to the first sub-element of the second circuit element. As a result, the nodal spacings between the sub-elements within the first and second circuit elements are effectively increased without demanding additional real estate.

Abstract: A method for connecting circuit elements within an integrated circuit for reducing single-event upsets is disclosed. The integrated circuit includes a first and second circuit elements that are substantially identical to each other. In order to reduce the single-event upsets to the first and second circuit elements, each of the first and second circuit elements is divided into a first sub-element and a second sub-element. The first sub-element of the first circuit element is connected to the second sub-element of the second circuit element. The second sub-element of the first circuit element is connected to the first sub-element of the second circuit element. As a result, the nodal spacings between the sub-elements within the first and second circuit elements are effectively increased without demanding additional real estate.

Abstract: A single-event upset tolerant random access memory cell is disclosed. The single-event upset tolerant memory cell includes a first and second sets of access transistors along with a first and second sets of dual-path inverters. The first set of access transistors is coupled to a first bitline, and the second set of access transistors is coupled to a second bitline that is complementary to the first bitline. The first set of dual-path inverters, which is coupled to the first set of access transistors, includes a first transistor connected to a second transistor in series and a third transistor connected to a fourth transistor in series. The second set of dual-path inverters, which is coupled to the second set of access transistors, includes a fifth transistor connected to a sixth transistor in series and a seventh transistor connected to an eighth transistor in series.

Abstract: A method for fabricating resistors within a semiconductor integrated circuit device is disclosed. A resistor is fabricated by first depositing a passivation layer on a semiconductor substrate having multiple transistors previously formed thereon. Next, a first contact window and a second contact window are formed through the first passivation layer at a first contact location and a second contact location, respectively. The first and second contact windows are then filled with metal, such as tungsten, and the metal at the first and second contact windows is planarized to form a first bottom contact and a second bottom contact, respectively. A resistive film, such as polysilicon, subsequently deposited over the first passivation layer. Next, a second passivation layer is formed over the resistive film. Finally, a first top contact and a second top contact are formed to respectively connect the first bottom contact and the second bottom contact to the resistive film.

Abstract: A memory device includes a plurality of memory cells arranged in rows and columns. The memory cells are divided into a plurality of sub-arrays. The memory cell further includes a plurality of word lines connecting rows of the memory cells, and a plurality of bit line pairs connecting columns of the memory cells. An address transition detect (ATD) circuit detects an address transition for a selected memory cell and generates an ATD pulse in response thereto. A respective bit line precharge circuit is associated with each of the plurality of sub-arrays. An ATD pulse distribution circuit distributes the ATD pulse to only a selected sub-array containing the selected memory cell to activate only the bit line precharge circuit of the selected sub-array and not activate precharge circuits of other non-selected sub-arrays.

Abstract: A memory device includes a plurality of address on-chip receivers (OCRs), an address decoder coupled to the address OCRs, a plurality of first delay circuits coupled between the address OCRs and the address decoder, and a plurality of chip select bypass circuits. Each chip select bypass circuit is respectively coupled to one of the plurality of first delay circuits for initially reducing a delay therein responsive to a control signal. The chip select bypass circuit includes a second delay circuit having a delay less than the first delay circuit, and a disable circuit. The disable circuit disables the first delay circuit and selectively couples the second delay circuit in place of the first delay circuit responsive to the control signal.