Abstract: An apparatus includes a solid immersion mirror with opposing, reflective, inner sidewalls having inner surfaces facing a focal region and outer surfaces opposite the inner surfaces. The solid immersion mirror also include opposing outer sidewalls spaced apart from and facing the outer surfaces of the inner sidewalls, and a fill material between the inner sidewalls and outer sidewalls. The apparatus also includes a near-field transducer located in the focal region proximate a media-facing surface.

Abstract: An apparatus includes a solid immersion mirror with opposing, reflective, inner sidewalls having inner surfaces facing a focal region and outer surfaces opposite the inner surfaces. The solid immersion mirror also include opposing outer sidewalls spaced apart from and facing the outer surfaces of the inner sidewalls, and a fill material between the inner sidewalls and outer sidewalls. The apparatus also includes a near-field transducer located in the focal region proximate a media-facing surface.

Abstract: An apparatus includes a solid immersion mirror with opposing, reflective, inner sidewalls having inner surfaces facing a focal region and outer surfaces opposite the inner surfaces. The solid immersion mirror also include opposing outer sidewalls spaced apart from and facing the outer surfaces of the inner sidewalls, and a fill material between the inner sidewalls and outer sidewalls. The apparatus also includes a near-field transducer located in the focal region proximate a media-facing surface.

Abstract: An apparatus includes a solid immersion mirror with opposing, reflective, inner sidewalls having inner surfaces facing a focal region and outer surfaces opposite the inner surfaces. The solid immersion mirror also include opposing outer sidewalls spaced apart from and facing the outer surfaces of the inner sidewalls, and a fill material between the inner sidewalls and outer sidewalls. The apparatus also includes a near-field transducer located in the focal region proximate a media-facing surface.

Abstract: An apparatus includes a slider structure having a top surface and a bottom surface opposite from the top surface. The apparatus includes a waveguide with an input facet at the top surface and an output proximate the bottom surface. A laser having an output facet is positioned proximate the input facet of the waveguide and include a second plurality of pads facing a first plurality of pads on the top surface of the slider. A bonding material is disposed between individual ones of the first and second plurality of pads such that a reflow of the bonding material induces relative movement between the laser and the top surface to align the input and output facets.

Abstract: An apparatus includes a crystalline substrate. A cleaving guide on the substrate is positioned over a cleave plane of the crystalline substrate and positioned in a known location with respect to a feature of an electronic device on the substrate. Cleaving of the substrate along the cleave plane changes a physical characteristic of the cleaving guide and measurement of the physical characteristic provides a parameter representative of the relative position of the cleave plane and the cleaving guide.

Abstract: A laser diode includes a junction surface configured to interface with an integrated optics slider. Cathode and anode electrical junctions are disposed on the junction surface. The cathode and anode electrical junctions are configured for electrical and mechanical coupling to the integrated optics slider. At least one test pad is disposed on the junction surface that is physically separate from and electrically coupled to one of the cathode and anode electrical junctions. The test pad is configured to be contacted by a test probe and is not configured for electrical or mechanical coupling to the integrated optics slider.

Abstract: An apparatus includes a crystalline substrate. A cleaving guide on the substrate is positioned over a cleave plane of the crystalline substrate and positioned in a known location with respect to a feature of an electronic device on the substrate. Cleaving of the substrate along the cleave plane changes a physical characteristic of the cleaving guide and measurement of the physical characteristic provides a parameter representative of the relative position of the cleave plane and the cleaving guide.