Abstract: An ion implanter is provided, including an ion source and extraction system, arranged to generate a continuous ion beam at a first ion energy, and a linear accelerator, arranged to generate a bunched ion beam from the continuous ion beam, and to accelerate the bunched ion beam to a second ion energy, greater than the first ion energy. As such, the linear accelerator may include a plurality of acceleration stages, where a given acceleration stage of the linear accelerator includes a drift tube assembly, arranged to accelerate the bunched ion beam through a plurality of acceleration gaps. The given acceleration stage may also include a resonator, arranged to deliver an RF voltage signal to the drift tube assembly, and a resonance control circuit, having a variable capacitor that is arranged to adjust a resonator capacitance of the resonator, in order to maintain a resonant frequency of the resonator circuit.

Abstract: An ion implanter. The ion implanter may include an ion source, to generate a continuous ion beam. The ion implanter may further include a linear accelerator, comprising a buncher, to receive the continuous ion beam and generate a bunched ion beam, and further comprising a plurality of acceleration stages, arranged to receive the bunched ion beam and accelerate the bunched ion beam. The ion implanter may also include a plurality of quadrupoles, arranged in alternating fashion with the plurality of acceleration stages; and a plurality of quadrupole switch assemblies, coupled to the plurality of plurality of quadrupoles, respectively, wherein a given quadrupole switch assembly comprises a polarity switching circuit.

Abstract: A method to operate an ion implanter. The method may include conducting an ion beam into an acceleration stage of a linear accelerator in the ion implanter, where the ion beam is a bunched ion beam. The method may also include applying an RF signal to the acceleration stage while the ion beam passes through the acceleration stage, the RF signal comprising a determined frequency and a determined amplitude, and performing a phase scan using the RF signal. The phase scan may include varying a phase of the RF signal at the acceleration stage over a plurality of phase values; and recording a plurality of arrival times at a monitor, situated downstream of the acceleration stage, the plurality of arrival times corresponding to the plurality of phase values, respectively.

Abstract: A system and method for controlling electrostatic clamping of multiple platens on a spinning disk is disclosed. The system comprises a semiconductor processing system, such as a high energy implantation system. The semiconductor processing system produces a spot ion beam, which is directed to a plurality of workpieces, which are disposed on a spinning disk. The spinning disk comprises a rotating central hub with a plurality of platens. The plurality of platens may extend outward from the central hub and workpieces are electrostatically clamped to the platens. The central hub provides the electrostatic clamping voltages to each of the plurality of platens. Further, the plurality of platens may also be capable of rotation about an axis orthogonal to the rotation axis of the central hub. The central hub controls the rotation of each of the platens. Power connections and communications are provided to the central hub via the spindle assembly.

Abstract: A system and method for controlling electrostatic clamping of multiple platens on a spinning disk is disclosed. The system comprises a semiconductor processing system, such as a high energy implantation system. The semiconductor processing system produces a spot ion beam, which is directed to a plurality of workpieces, which are disposed on a spinning disk. The spinning disk comprises a rotating central hub with a plurality of platens. The plurality of platens may extend outward from the central hub and workpieces are electrostatically clamped to the platens. The central hub provides the electrostatic clamping voltages to each of the plurality of platens. Further, the plurality of platens may also be capable of rotation about an axis orthogonal to the rotation axis of the central hub. The central hub controls the rotation of each of the platens. Power connections and communications are provided to the central hub via the spindle assembly.

Abstract: Provided herein are approaches for reducing particles in an ion implanter. In some embodiments, an electrostatic filter of the ion implanter may include a housing and a plurality of conductive beam optics within the housing, the plurality of conductive beam optics arranged around an ion beam-line. At least one conductive beam optic of the plurality of conductive beam optics may include a conductive core element, a resistive material disposed around the conductive core, and a conductive layer disposed around the resistive material.

Abstract: Provided herein are approaches for reducing particles in an ion implanter. In some embodiments, an electrostatic filter of the ion implanter may include a housing and a plurality of conductive beam optics within the housing, the plurality of conductive beam optics arranged around an ion beam-line. At least one conductive beam optic of the plurality of conductive beam optics may include a conductive core element, a resistive material disposed around the conductive core, and a conductive layer disposed around the resistive material.

Abstract: A system and method for minimizing the damage to the backside of a workpiece disposed on a platen during thermal transitions is disclosed. The system includes a controller that modulates the clamping voltage and backside gas pressure during the thermal transition. By modulating the clamping voltage, the workpiece may not be as tightly held to the platen at certain times, thus minimizing damage that may be caused by particles resident on the top surface of the platen. Furthermore, the modulation of the backside gas pressure still permits good thermal conductivity between the platen and the workpiece.

Abstract: A system and method for minimizing the damage to the backside of a workpiece disposed on a platen during thermal transitions is disclosed. The system includes a controller that modulates the clamping voltage and backside gas pressure during the thermal transition. By modulating the clamping voltage, the workpiece may not be as tightly held to the platen at certain times, thus minimizing damage that may be caused by particles resident on the top surface of the platen. Furthermore, the modulation of the backside gas pressure still permits good thermal conductivity between the platen and the workpiece.

Abstract: A system, instructions and a method of determining when an impending failure is likely to occur absent corrective action are disclosed. The system samples the output of a power supply which powers an electrostatic chuck, and determines when that output is outside acceptable limits. The output is sampled at a sufficiently high frequency so as to detect transient anomalies, which are not detectable at lower sampling rates. In some embodiments, the output is converted to a frequency spectrum. The empirical model is compared to known good reference models and, in some embodiments, failure reference models of known failure modes to determine whether an impending failure will occur, and which type of failure.

Abstract: A system and method for monitoring forces on a substrate lifting apparatus. The system includes a platen cartridge with a platen and a movable lifting portion. The movable lifting portion includes a plurality of lifting arms coupled to a plurality of lift pins. A plurality of force sensing elements are associated with respective ones of the plurality of lifting arms and the plurality of lift pins. A controller receives signals from the plurality of force sensing elements, correlates the signals to respective forces applied to said plurality of lift pins. The correlated forces may indicate to the controller that an error condition exists, such as a stuck wafer, a broken wafer, a mis-positioned wafer, or a mechanical malfunction.

Abstract: A system, instructions and a method of determining when an impending failure is likely to occur absent corrective action are disclosed. The system samples the output of a power supply which powers an electrostatic chuck, and determines when that output is outside acceptable limits. The output is sampled at a sufficiently high frequency so as to detect transient anomalies, which are not detectable at lower sampling rates. In some embodiments, the output is converted to a frequency spectrum. The empirical model is compared to known good reference models and, in some embodiments, failure reference models of known failure modes to determine whether an impending failure will occur, and which type of failure.

Abstract: A system and method for monitoring forces on a substrate lifting apparatus. The system includes a platen cartridge with a platen and a movable lifting portion. The movable lifting portion includes a plurality of lifting arms coupled to a plurality of lift pins. A plurality of force sensing elements are associated with respective ones of the plurality of lifting arms and the plurality of lift pins. A controller receives signals from the plurality of force sensing elements, correlates the signals to respective forces applied to said plurality of lift pins. The correlated forces may indicate to the controller that an error condition exists, such as a stuck wafer, a broken wafer, a mis-positioned wafer, or a mechanical malfunction.

Abstract: An electrode pattern and layered assembly is disclosed. This assembly utilizes multiple-piece construction, including at least two electrically conductive layers and at least three electrically insulating layers. By incorporating a second electrically conductive layer, each electrode can be divided into two or more separate portions on the top layer, and joined together using the second conductive layer. Connections between the two conductive layers can be made using any suitable technique, including through-hole vias, conductive rods and the like. The use of a second electrically conductive layer also allows for a different gas distribution strategy. The use of multiple conductive layers allows the use of one or more concentric channels to be used through which the gas can be injected.

Abstract: An electrode pattern and layered assembly is disclosed. This assembly utilizes multiple-piece construction, including at least two electrically conductive layers and at least three electrically insulating layers. By incorporating a second electrically conductive layer, each electrode can be divided into two or more separate portions on the top layer, and joined together using the second conductive layer. Connections between the two conductive layers can be made using any suitable technique, including through-hole vias, conductive rods and the like. The use of a second electrically conductive layer also allows for a different gas distribution strategy. The use of multiple conductive layers allows the use of one or more concentric channels to be used through which the gas can be injected.