Abstract: An inkjet printhead die includes a first endmost black nozzle of which is disposed proximate the first end of a substrate, and an opposite second endmost black nozzle of which is disposed a distance D1 from the first endmost black nozzle; a first endmost nozzle of which is disposed proximate the first end of the substrate, and an opposite second endmost nozzle of which is disposed a distance D2 from the first endmost cyan nozzle; a first endmost nozzle of which is disposed proximate the first end of the substrate, and an opposite second endmost nozzle of which is disposed a distance D3 from the first endmost nozzle;, wherein D2 and D3 substantially equal to each other, and wherein D1 is greater than D2.

Abstract: A method of printing an image with an inkjet printhead includes a) advancing a sheet of print medium along the array direction; b) stopping the sheet of print medium such that a first portion of the sheet is proximate the first group of arrays of the inkjet printhead; c) moving the inkjet printhead in a first sense along the scan direction while printing on the first portion of the sheet using the first group of arrays; d) advancing the sheet of print medium along the array direction; e) stopping the sheet of print medium such that a second portion of the sheet is proximate the second group of arrays of the inkjet printhead; f) moving the inkjet printhead in a second sense opposite the first sense along the scan direction while printing on the second portion of the sheet using the second group of arrays.

Abstract: An inkjet printhead die includes a first endmost black nozzle of which is disposed proximate the first end of a substrate, and an opposite second endmost black nozzle of which is disposed a distance D1 from the first endmost black nozzle; a first endmost nozzle of which is disposed proximate the first end of the substrate, and an opposite second endmost nozzle of which is disposed a distance D2 from the first endmost cyan nozzle; a first endmost nozzle of which is disposed proximate the first end of the substrate, and an opposite second endmost nozzle of which is disposed a distance D3 from the first endmost nozzle; wherein D2 and D3 substantially equal to each other, and wherein D1 is greater than D2.

Abstract: A method of making micro-structure devices by coating a first layer of resist (12) on a substrate (10). A pattern is created on the substrate by radiation induced thermal removal of the resist.

Abstract: A method of making micro-structure devices by coating a first layer of resist (12) on a substrate (10). A pattern is created on the substrate by radiation induced thermal removal of the resist.

Abstract: A method for forming a resist pattern on a substrate (18) places a donor element (12) having a layer of thermoresist material proximate the substrate. A gap is maintained such that the surface of the layer of thermoresist material is spaced apart from the surface of the substrate by a number of spacing elements. Thermal energy is directed toward the donor element (12) according to the resist pattern, whereby a portion of thermoresist material is transferred from the donor element (12) across the gap by ablative transfer and is deposited onto the substrate (18) forming the resist pattern.