Patents by Inventor Scott Edwin Hinnershitz

Scott Edwin Hinnershitz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220245255
    Abstract: A system for secure processor virtualization including a secure initialization memory and one or more processors coupled to the secure initialization memory is disclosed. The secure initialization memory includes initialization instructions for launching a security runtime environment before operating systems and cryptographic keying for security handoffs. The processors are configured to retrieve the initialization instructions from the secure initialization memory at startup, execute the initialization instructions to launch the security runtime environment and retrieve at least a portion of the cryptographic keying, and generate specific keying for chip-level resources the processors by combining instruction sets of the chip-level resources and the cryptographic keying.
    Type: Application
    Filed: June 8, 2020
    Publication date: August 4, 2022
    Applicant: Lockheed Martin Corporation
    Inventors: Scott Edwin HINNERSHITZ, David Jose LOPEZ, Jason Todd KAUL, Michael Lane SMITH
  • Patent number: 9392725
    Abstract: An electronics chassis comprises a frame including at least one fluid flow path along a side of the frame and that is sealed relative to an interior volume of the frame. A first opening to the fluid flow path is at a first end of the frame; and, a second opening to the fluid flow path at a second end of the frame. The first and second ends of the frame are configured to interchangeably receive components for forced air conduction cooling and components for liquid conduction cooling through the fluid flow paths.
    Type: Grant
    Filed: January 13, 2014
    Date of Patent: July 12, 2016
    Assignee: LOCKHEED MARTIN CORPORATION
    Inventors: Andrew O. Stringer, Bryan Christopher Baraclough, Scott Edwin Hinnershitz
  • Publication number: 20150201527
    Abstract: An electronics chassis comprises a frame including at least one fluid flow path along a side of the frame and that is sealed relative to an interior volume of the frame. A first opening to the fluid flow path is at a first end of the frame; and, a second opening to the fluid flow path at a second end of the frame. The first and second ends of the frame are configured to interchangeably receive components for forced air conduction cooling and components for liquid conduction cooling through the fluid flow paths.
    Type: Application
    Filed: January 13, 2014
    Publication date: July 16, 2015
    Applicant: LOCKHEED MARTIN CORPORATION
    Inventors: Andrew O. Stringer, Bryan Christopher Baraclough, Scott Edwin Hinnershitz