Abstract: Apparatuses and methods for repairing a memory are disclosed. In some examples, the memory may be a stacked memory that includes multiple die and at least one spare die. In some examples, a die may determine it is defective and provide signals causing the defective die to be disabled and a spare die to be enabled. In some examples, a component external to the memory, such as a memory controller, may determine a die is defective and provide signals causing the defective die to be disabled and a spare die to be enabled. In some examples, die may be enabled or disabled by fuses/antifuses.

Abstract: In some examples, a master die may receive data from one or more slave die. The master die may provide data from the master die and the data from the one or more slave die to a plurality of output terminals. Data from the master die may be provided for a portion of a data burst and data from the slave die may be provided for another portion of the data burst. In some examples, a master die may provide data to one or more slave die. The master die may provide data to the master die and the data to the one or more slave die from a plurality of input terminals. Data from the input terminals may be provided to the slave die for a portion of a data burst and data may be provided from the master die for another portion of the data burst.

Abstract: Apparatuses and methods for providing data from stacked memory are described. The stacked memory may include multiple die. In some examples, a master die may receive data from one or more slave die. The master die may provide data from the master die and the data from the one or more slave die to a plurality of output terminals. Different ones of the output terminals may provide data from a different die of the stacked memory. In some examples, the data may be retrieved from the multiple die concurrently.

Abstract: Apparatuses and methods for providing data from stacked memory are described. The stacked memory may include multiple die. In some examples, a master die may receive data from one or more slave die. The master die may provide data from the master die and the data from the one or more slave die to a plurality of output terminals. Different ones of the output terminals may provide data from a different die of the stacked memory. In some examples, the data may be retrieved from the multiple die concurrently.

Abstract: In some examples, a master die may receive data from one or more slave die. The master die may provide data from the master die and the data from the one or more slave die to a plurality of output terminals. Data from the master die may be provided for a portion of a data burst and data from the slave die may be provided for another portion of the data burst. In some examples, a master die may provide data to one or more slave die. The master die may provide data to the master die and the data to the one or more slave die from a plurality of input terminals. Data from the input terminals may be provided to the slave die for a portion of a data burst and data may be provided from the master die for another portion of the data burst.

Abstract: Apparatuses and methods for repairing a memory are disclosed. In some examples, the memory may be a stacked memory that includes multiple die and at least one spare die. In some examples, a die may determine it is defective and provide signals causing the defective die to be disabled and a spare die to be enabled. In some examples, a component external to the memory, such as a memory controller, may determine a die is defective and provide signals causing the defective die to be disabled and a spare die to be enabled. In some examples, die may be enabled or disabled by fuses/antifuses.