Abstract: A method can include simulating, by at least one hardware processor, operation of an embedded device under a variety of conditions including a variety of electromagnetic interference (EMI) conditions and a variety of weather conditions, determining proper operation characteristics of the components based on the simulating, the proper operation characteristics of the components determined based on simulations that result in the embedded device operating properly, determining which components of the embedded device impact proper operation of the embedded device by a threshold amount, and programming the at least one hardware processor to implement a safeguard that ensures proper operation of a component of the components.

Abstract: A method can include simulating, by at least one hardware processor, operation of an embedded device under a variety of conditions including a variety of electromagnetic interference (EMI) conditions and a variety of weather conditions, determining proper operation characteristics of the components based on the simulating, the proper operation characteristics of the components determined based on simulations that result in the embedded device operating properly, determining which components of the embedded device impact proper operation of the embedded device by a threshold amount, and programming the at least one hardware processor to implement a safeguard that ensures proper operation of a component of the components.

Abstract: The present invention provides thermally conductive, electrically insulating composites that can be used to help conduct heat away from a heat source such as from microelectronic structures that generate heat during use. In one aspect, the present invention relates to an electronic system comprising a microelectronic device and a thermally conductive, composite in thermal contact with the microelectronic device. The composite is derived from ingredients comprising a macrocyclic oligomer; and a thermally conductive filler.

Abstract: A method for limiting access to content-sensitive electronics is disclosed. The method involves monitoring an active barrier partition surrounding the content-sensitive electronics independent of normal operating activity and generating a tamper signal upon separation of an outer layer from an active sensing layer that comprise the active barrier partition. The method further involves responding to an unauthorized attempt to tamper with the active barrier partition.

Abstract: An optical anti-tamper system that includes at least one array of light sources located within a chassis and at least one array of photosensitive elements located within the chassis. The array of photosensitive elements are in communication with an alarm. The alarm is operable to transmit a tamper-event warning signal if an increased light level is detected by at least one array of photosensitive elements.

Abstract: An optical anti-tamper system including a light emitting layer located within a chassis, a light detecting layer located within the chassis and one or more detectors optically coupled to the light detecting layer. The one or more detectors are in communication with an alarm. The alarm is operable to transmit a tamper-event warning signal if an increased light level is detected by at least one detector.

Abstract: A passive optical anti-tamper system including one or more light pipes, one or more light detectors and an alarm. The light pipes each include an input end and an output end and are located within a chassis with the one or more light detectors. The one or more light detectors are optically coupled to the output ends of the one or more light pipes. The alarm is operable to transmit a tamper-event-warning signal if an increased light level is detected by at least one detector.

Abstract: The present invention provides thermally conductive, electrically insulating composites that can be used to help conduct heat away from a heat source such as from microelectronic structures that generate heat during use. In one aspect, the present invention relates to an electronic system comprising a microelectronic device and a thermally conductive, composite in thermal contact with the microelectronic device. The composite is derived from ingredients comprising a macrocyclic oligomer; and a thermally conductive filler comprising diamond.

Abstract: An adaptor for dispensing a liquid into a container is provided. The adaptor includes a sleeve having an outer surface and an inner surface. The adapter also includes an opening passing through the outer surface and inner surface of the sleeve. The adapter further includes a pipe having a first and a second end, the first end attached to the opening. The adapter also includes a sealing lid removably disposed over the second end of the pipe.