Patents by Inventor Scott Hetherton
Scott Hetherton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9650194Abstract: A tamper evident label flap positioned to cover an opening in a package. The label flap includes a base layer having a top surface and a bottom surface. A top layer is attached to the base layer by an adhesive layer. A tamper evident structure is located in at least one designated area between the base layer and the top layer. The tamper evident structure includes a first ink layer applied to the base layer and a second ink layer applied to the first ink layer. The first ink layer and the second ink layer are held together in a weaker bond than a bond between the top layer and the base layer. When the label flap is initially pulled from the package, the first ink layer and the second ink layer separate and define a visible permanent de-lamination which signifies the package has been opened.Type: GrantFiled: December 2, 2014Date of Patent: May 16, 2017Assignee: HFM Packaging, LTD.Inventor: Scott Hetherton
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Publication number: 20160152393Abstract: A tamper evident label flap positioned to cover an opening in a package. The label flap includes a base layer having a top surface and a bottom surface. A top layer is attached to the base layer by an adhesive layer. A tamper evident structure is located in at least one designated area between the base layer and the top layer. The tamper evident structure includes a first ink layer applied to the base layer and a second ink layer applied to the first ink layer. The first ink layer and the second ink layer are held together in a weaker bond than a bond between the top layer and the base layer. When the label flap is initially pulled from the package, the first ink layer and the second ink layer separate and define a visible permanent de-lamination which signifies the package has been opened.Type: ApplicationFiled: December 2, 2014Publication date: June 2, 2016Applicant: HFM PACKAGING, LTD.Inventor: Scott Hetherton
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Patent number: 7343671Abstract: A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices. The assembly is made by providing first and second laminates, each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface of the stack, and making a plurality of electrical connections between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.Type: GrantFiled: November 4, 2003Date of Patent: March 18, 2008Assignee: Tyco Electronics CorporationInventors: Scott Hetherton, Wayne Montoya, Thomas Bruguier, Randy Daering
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Publication number: 20060132277Abstract: A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices (2). The assembly is made by providing first and second laminates (7,8), each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack (1) in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface (3) of the stack, and making a plurality of electrical connections (31,51) between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.Type: ApplicationFiled: December 22, 2004Publication date: June 22, 2006Applicant: Tyco Electronics CorporationInventors: Scott Hetherton, Wayne Montoya, Thomas Bruguier, Randy Daering
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Patent number: 6854176Abstract: A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices (2). The assembly is made by providing first and second laminates (7,8), each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack (1) in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface (3) of the stack, and making a plurality of electrical connections (31,51) between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior. Additional electrical components may be attached directly to the surface of the device or assembly.Type: GrantFiled: December 12, 2001Date of Patent: February 15, 2005Assignee: Tyco Electronics CorporationInventors: Scott Hetherton, Wayne Montoya, Thomas Bruguier, Randy Daering, James Toth, Daniel A. Chandler, Matthew P. Galla
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Publication number: 20040090304Abstract: A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices. The assembly is made by providing first and second laminates, each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface of the stack, and making a plurality of electrical connections between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.Type: ApplicationFiled: November 4, 2003Publication date: May 13, 2004Inventors: Scott Hetherton, Wayne Montoya, Thomas Bruguier, Randy Daering
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Patent number: 6640420Abstract: A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices. The assembly is made by providing first and second laminates, each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface of the stack, and making a plurality of electrical connections between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.Type: GrantFiled: September 14, 1999Date of Patent: November 4, 2003Assignee: Tyco Electronics CorporationInventors: Scott Hetherton, Wayne Montoya, Thomas Bruguier, Randy Daering
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Publication number: 20020162214Abstract: A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices (2). The assembly is made by providing first and second laminates (7,8), each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack (1) in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface (3) of the stack, and making a plurality of electrical connections (31,51) between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior. Additional electrical components may be attached directly to the surface of the device or assembly.Type: ApplicationFiled: December 12, 2001Publication date: November 7, 2002Inventors: Scott Hetherton, Wayne Montoya, Thomas Bruguier, Randy Daering, James Toth, Daniel A. Chandler, Matthew P. Galla