Patents by Inventor Scott Hinaga

Scott Hinaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATING GRAPHENE INTO THE SKIN DEPTH REGION OF HIGH SPEED COMMUNICATIONS SIGNALS FOR A PRINTED CIRCUIT BOARD
    Publication number: 20230354505
    Abstract: A conductive signal transmission structure for a printed circuit includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps and/or a Nyquist frequency that is at least about 14 gigahertz (GHz).
    Type: Application
    Filed: June 20, 2023
    Publication date: November 2, 2023
    Inventors: Joel Goergen, Scott Hinaga, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir, David Nozadze, Amendra Koul, Mehmet Onder Cap, Madeline Marie Roemer
  • Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board
    Patent number: 11751322
    Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps.
    Type: Grant
    Filed: March 24, 2022
    Date of Patent: September 5, 2023
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Joel Goergen, Scott Hinaga, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir, David Nozadze, Amendra Koul, Mehmet Onder Cap, Madeline Marie Roemer
  • PROVIDING ONE OR MORE CARBON LAYERS TO A COPPER CONDUCTIVE MATERIAL TO REDUCE POWER LOSS IN A POWER PLANE
    Publication number: 20230269873
    Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.
    Type: Application
    Filed: April 24, 2023
    Publication date: August 24, 2023
    Inventors: Joel Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, Kameron Rose Hurst, D. Brice Achkir, Amendra Koul, Scott Hinaga, David Nozadze
  • Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane
    Patent number: 11706870
    Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: July 18, 2023
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Joel Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, Kameron Rose Hurst, D. Brice Achkir, Amendra Koul, Scott Hinaga, David Nozadze
  • INTEGRATING GRAPHENE INTO THE SKIN DEPTH REGION OF HIGH SPEED COMMUNICATIONS SIGNALS FOR A PRINTED CIRCUIT BOARD
    Publication number: 20220217837
    Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps.
    Type: Application
    Filed: March 24, 2022
    Publication date: July 7, 2022
    Inventors: Joel Goergen, Scott Hinaga, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir, David Nozadze, Amendra Koul, Mehmet Onder Cap, Madeline Marie Roemer
  • Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board
    Patent number: 11330702
    Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal is applied to the structure that is in the GHz frequency range.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: May 10, 2022
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Joel Goergen, Scott Hinaga, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir, David Nozadze, Amendra Koul, Mehmet Onder Cap, Madeline Marie Roemer
  • PROVIDING ONE OR MORE CARBON LAYERS TO A COPPER CONDUCTIVE MATERIAL TO REDUCE POWER LOSS IN A POWER PLANE
    Publication number: 20220039257
    Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.
    Type: Application
    Filed: October 18, 2021
    Publication date: February 3, 2022
    Inventors: Joel Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, Kameron Rose Hurst, D. Brice Achkir, Amendra Koul, Scott Hinaga, David Nozadze
  • Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane
    Patent number: 11202368
    Abstract: A power plane structure for a printed circuit board includes a copper layer, and a carbon layer applied directly to a surface of the copper layer. The carbon layer can include graphite or graphene. In additional embodiments, a duplicate power plane structure for a printed circuit board includes two power planes separated by an insulating core, each power plane including a copper layer and a carbon layer applied directly to a surface of the copper layer.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: December 14, 2021
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Joel Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, Kameron Rose Hurst, D. Brice Achkir, Amendra Koul, Scott Hinaga, David Nozadze
  • INTEGRATING GRAPHENE INTO THE SKIN DEPTH REGION OF HIGH SPEED COMMUNICATIONS SIGNALS FOR A PRINTED CIRCUIT BOARD
    Publication number: 20210337657
    Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal is applied to the structure that is in the GHz frequency range.
    Type: Application
    Filed: October 26, 2020
    Publication date: October 28, 2021
    Inventors: Joel Goergen, Scott Hinaga, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir, David Nozadze, Amendra Koul, Mehmet Onder Cap, Madeline Marie Roemer
  • PROVIDING ONE OR MORE CARBON LAYERS TO A COPPER CONDUCTIVE MATERIAL TO REDUCE POWER LOSS IN A POWER PLANE
    Publication number: 20210337666
    Abstract: A power plane structure for a printed circuit board includes a copper layer, and a carbon layer applied directly to a surface of the copper layer. The carbon layer can include graphite or graphene. In additional embodiments, a duplicate power plane structure for a printed circuit board includes two power planes separated by an insulating core, each power plane including a copper layer and a carbon layer applied directly to a surface of the copper layer.
    Type: Application
    Filed: August 28, 2020
    Publication date: October 28, 2021
    Inventors: Joel Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, Kameron Rose Hurst, D. Brice Achkir, Amendra Koul, Scott Hinaga, David Nozadze
  • Printed Circuit Board Comprising Both Conductive Metal and Optical Elements
    Publication number: 20140119703
    Abstract: A printed circuit board (PCB) may be provided. The PCB may comprise a first electrically conductive layer comprising a first signal layer. Also, the PCB may comprise a second electrically conductive layer comprising a second signal layer or a plane layer associated with the first signal layer. The PCB may further comprise a waveguide layer disposed between the first electrically conductive layer and adjacent the second electrically conductive layer. The waveguide layer may transmit optical signals and function as a dielectric between the first electrically conductive layer and the second electrically conductive layer.
    Type: Application
    Filed: October 26, 2012
    Publication date: May 1, 2014
    Applicant: CISCO TECHNOLOGY, INC.
    Inventors: Scott Hinaga, David Senk, Brice Achkir