Abstract: Embodiments of interfaces are disclosed. One such interface has a plurality of connector assemblies, each connector assembly in a single opening of a plurality of openings passing completely through the interface. Each connector assembly has first and second connectors that are electrically and physically coupled to each other.

Abstract: Embodiments of interfaces are disclosed. One such interface has a plurality of connector assemblies, each connector assembly in a single opening of a plurality of openings passing completely through the interface. Each connector assembly has first and second connectors that are electrically and physically coupled to each other.

Abstract: Carriers comprising a carrier body having a plurality of openings holding a plurality of resilient contact probes are disclosed. A number of different embodiments for the resilient contact probes is also disclosed. The carriers of the present invention may be secured to an interface board (i.e., a printed circuit board (PCB)) and assembled with a substrate (e.g., a wafer having integrated circuitry thereon, a PCB, etc.). The resilient contact probes electrically contact the terminal pads of the interface board and the electrical contacts of the substrate to enable electrical testing of the substrate. The configuration of the resilient contact probes, in combination with the carrier body, enables preferential, high mechanical loading of the terminal pads with controlled, predictable loading of the electrical contacts. Methods of making and use are also disclosed, as are a plurality of embodiments of resilient contact probes.

Abstract: Carriers comprising a carrier body having a plurality of openings holding a plurality of resilient contact probes are disclosed. A number of different embodiments for the resilient contact probes is also disclosed. The carriers of the present invention may be secured to an interface board (i.e., a printed circuit board (PCB)) and assembled with a substrate (e.g., a wafer having integrated circuitry thereon, a PCB, etc.). The resilient contact probes electrically contact the terminal pads of the interface board and the electrical contacts of the substrate to enable electrical testing of the substrate. The configuration of the resilient contact probes, in combination with the carrier body, enables preferential, high mechanical loading of the terminal pads with controlled, predictable loading of the electrical contacts. Methods of making and use are also disclosed, as are a plurality of embodiments of resilient contact probes.

Abstract: Carriers comprising a carrier body having a plurality of openings holding a plurality of resilient contact probes are disclosed. A number of different embodiments for the resilient contact probes are also disclosed. The carriers of the present invention may be secured to an interface board (i.e., a printed circuit board (PCB)) and assembled with a substrate (e.g., a wafer having integrated circuitry thereon, a PCB, etc.). The resilient contact probes electrically contact the terminal pads of the interface board and the electrical contacts of the substrate to enable electrical testing of the substrate. The configuration of the resilient contact probes, in combination with the carrier body, enables preferential, high mechanical loading of the terminal pads with controlled, predictable loading of the electrical contacts. Methods of making and use are also disclosed, as are a plurality of embodiments of resilient contact probes.

Abstract: Carriers comprising a carrier body having a plurality of openings holding a plurality of resilient contact probes are disclosed. A number of different embodiments for the resilient contact probes are also disclosed. The carriers of the present invention may be secured to an interface board (i.e., a printed circuit board (PCB)) and assembled with a-substrate (e.g., a wafer having integrated circuitry thereon, a PCB, etc.). The resilient contact probes electrically contact the terminal pads of the interface board and the electrical contacts of the substrate to enable electrical testing of the substrate. The configuration of the resilient contact probes, in combination with the carrier body, enables preferential, high mechanical loading of the terminal pads with controlled, predictable loading of the electrical contacts. Methods of making and use are also disclosed, as are a plurality of embodiments of resilient contact probes.