Abstract: A method of forming a semiconductor device is provided. The method includes encapsulating with an encapsulant at least a portion of a semiconductor die and a package substrate, the encapsulant including an additive selectively activated by way of a laser. A first opening is formed in the encapsulant, the first opening exposing a predetermined first portion of the package substrate. The additive is activated at the sidewalls of the first opening. A second opening is formed in the encapsulant, the second opening encircling the first opening and exposing a predetermined second portion of the package substrate. The additive is activated at the sidewalls the second opening. A conductive material is plated on the additive activated portions of the encapsulant.

Abstract: A system may include a database configured to store information including characteristics of a plurality of components. The system may further include a server in communication with the database and configured to: receive design parameters indicative of a plurality of power supply loads to be powered; determine a plurality of power supply architectures that may be used to provide power supply solutions satisfying the plurality of loads, each power supply architecture including at least one position requiring a component configured to satisfy a load requirement; for each one of at least a subset of the plurality of power supply architectures, determine, based on the characteristics of the plurality of components, at least one component configured to satisfy the corresponding load requirement for each position of the one of the power supply architectures; and generate at least one power supply design in accordance with the power supply architectures and the determined components.

Abstract: A system may include a database configured to store information including characteristics of a plurality of components. The system may further include a server in communication with the database and configured to: receive design parameters indicative of a plurality of power supply loads to be powered; determine a plurality of power supply architectures that may be used to provide power supply solutions satisfying the plurality of loads, each power supply architecture including at least one position requiring a component configured to satisfy a load requirement; for each one of at least a subset of the plurality of power supply architectures, determine, based on the characteristics of the plurality of components, at least one component configured to satisfy the corresponding load requirement for each position of the one of the power supply architectures; and generate at least one power supply design in accordance with the power supply architectures and the determined components.

Abstract: A rotating and swinging exerciser includes a base, a housing rotatably attached onto an axle of the base, a frame disposed on the base and having an inclined peripheral surface, and a lever pivotally secured to the housing with a pivot pin and having two foot pedals pivotally attached to two end portions. The lever is slidably engaged onto and movable along the inclined peripheral surface of the frame, and to cause the housing to rotate relative to the base. One of the foot pedals may be forced to move upwardly along the inclined peripheral surface of the frame when the other foot pedal is stepped downwardly by a user and when the lever is moved along the inclined peripheral surface of the frame.