Patents by Inventor Scott Ibbitson

Scott Ibbitson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Photosensitive composition
    Publication number: 20070105046
    Abstract: Photoresist compositions and methods suitable for depositing a thick photoresist layer in a single coating application are provided. Such photoresist layers are particularly suitable for use in chip scale packaging, for example, in the formation of metal bumps.
    Type: Application
    Filed: November 8, 2006
    Publication date: May 10, 2007
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Mark Winkle, Jill Steeper, Xiang-Qian Liu, Janet Okada-Coakley, Scott Ibbitson
  • Printed circuit board manufacture
    Publication number: 20050112369
    Abstract: Methods of enhancing the adhesion between a metal surface and an organic polymeric material, such as a dielectric material, in the manufacture of printed circuit boards are provided. Such methods use an adhesion promoting composition including polymeric particles disposed between the metal surface and the organic polymeric material. Also provided are printed circuit boards having enhanced adhesion between a metal surface and an organic polymeric material.
    Type: Application
    Filed: September 29, 2004
    Publication date: May 26, 2005
    Applicant: Rohm and Haas Electronic Materials, L.L.C.
    Inventors: Scott Ibbitson, Joseph Montano, Jason Reese, Robert Sloan