Patents by Inventor Scott Ira Langenthal

Scott Ira Langenthal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for forming cone shaped solder for chip interconnection
    Patent number: 6559527
    Abstract: A method of forming non-spherically shaped solder interconnects, preferably conical, for attachment of electronic components in an electronic module. Preferably, the solder interconnects of the present invention are cone shaped and comprise of depositing a first solder followed by a second solder having a lower reflow temperature than the first solder. Warm placement of the electronic component at a somewhat elevated temperature than room temperature but less than the solder reflow temperature reduces the force required during placement of a semiconductor chip to a substrate. After warm placement, reflow of the module occurs at the lower reflow temperature of the second solder. The conical shape of the solder interconnects are formed by a heated coining die which may also coin a portion of the interconnects with flat surfaces for stand-offs.
    Type: Grant
    Filed: January 3, 2001
    Date of Patent: May 6, 2003
    Assignee: International Business Machines Corporation
    Inventors: Peter Jeffrey Brofman, Shaji Farooq, John U. Knickerbocker, Scott Ira Langenthal, Sudipta Kumar Ray, Kathleen Ann Stalter
  • Process for forming cone shaped solder for chip interconnection
    Patent number: 6184062
    Abstract: A method of forming non-spherically shaped solder interconnects, preferably conical, for attachment of electronic components in an electronic module. Preferably, the solder interconnects of the present invention are cone shaped and comprise of depositing a first solder followed by a second solder having a lower reflow temperature than the first solder. Warm placement of the electronic component at a somewhat elevated temperature than room temperature but less than the solder reflow temperature reduces the force required during placement of a semiconductor chip to a substrate. After warm placement, reflow of the module occurs at the lower reflow temperature of the second solder. The conical shape of the solder interconnects are formed by a heated coining die which may also coin a portion of the interconnects with flat surfaces for stand-offs.
    Type: Grant
    Filed: January 19, 1999
    Date of Patent: February 6, 2001
    Assignee: International Business Machines Corporation
    Inventors: Peter Jeffrey Brofman, Shaji Farooq, John U. Knickerbocker, Scott Ira Langenthal, Sudipta Kumar Ray, Kathleen Ann Stalter