Abstract: Memory devices, systems including memory devices, and methods of operating memory devices are described, in which clock trees can be separately optimized to provide a coarse alignment between a clock signal and a command/address signal (and/or a chip select signal or other control signal), and/or in which individual memory devices can be isolated for fine-tuning of device-specific alignment between a clock signal and a command/address signal (and/or a chip select signal or other control signal). Moreover, individual memory devices can be isolated for fine-tuning of device-specific equalization of a command/address signal (and/or a chip select signal or other control signal).

Abstract: An embodiment of the invention is a method for performing thermal feasibility analysis for an enclosure containing electronics. The method includes obtaining design parameters related to the enclosure. A thermal feasibility analysis is performed for a plurality of enclosure designs in response to the design parameters. The enclosure designs vary in enclosure material, mounting location of the electronics and presence of a heat sink. The results of the thermal feasibility analysis are displayed for the plurality of enclosure designs.