Abstract: A method of forming one or more plugs in a circuit board layer is described which includes providing the circuit board layer, the circuit board layer having a first surface, a second surface, and defining a via containing a plug material in a volatile solvent, evaporating the volatile solvent, and curing the plug material. A product made according to the above method is also described.

Abstract: A circuit component assembly and a method for forming the assembly as an annular body in a laminate, preferably between a trough-hole or via and a surrounding conductive layer in a PCB are disclosed, the circuit component assembly including one or more resistors/conductors, inductors and dielectrics/capacitors or combinations thereof, outer and inner peripheries of the circuit component preferably having substantially constant radii permitting simple determination of operative electrical characteristics for the circuit component from (a) the inner and outer radii, (b) an effective thickness for the circuit component and (c) its electrical characteristics determined by the material formed in the annular recess, the circuit component body preferably being formed from a liquid precursor forming conductive interconnections for the circuit component assembly at its outer and inner perimeters.

Abstract: A circuit component assembly and a method for forming the assembly as an annular body in a laminate, preferably between a trough-hole or via and a surrounding conductive layer in a PCB are disclosed, the circuit component assembly including one or more resistors/conductors, inductors and dielectrics/capacitors or combinations thereof, outer and inner peripheries of the circuit component preferably having substantially constant radii permitting simple determination of operative electrical characteristics for the circuit component from (a) the inner and outer radii, (b) an effective thickness for the circuit component and (c) its electrical characteristics determined by the material formed in the annular recess, the circuit component body preferably being formed from a liquid precursor forming conductive interconnections for the circuit component assembly at its outer and inner perimeters.

Abstract: A resistor and method of forming the resistor as an annular resistor body between a conductive pad surrounding a through-hole in the PCB and a surrounding conductive layer, the annular resistor body being formed from a conductive material having a selected resistivity, the outer and inner perimeters of the annular resistor body preferably being substantially constant radii whereby the operative resistance of the annular resistor body may be simply determined from the radii of its outer and inner perimeters, an effective thickness of the annular resistor body and its resistivity, the annular resistor body more preferably being formed from a liquid precursor facilitating formation of conductive interconnections at its outer and inner perimeters.

Abstract: Rigid-flex printed circuit boards (PCBs) are fabricated by an improved and simplified process to form the PCBs from rigid-flex PCB subassemblies with both rigid and flex sections incorporating suitable insulator materials. The flex sections of the PCB subassemblies are protectively covered by insulating layers formed by deposition of a liquid precursor for the insulator material and curing of the liquid precursor to form the insulating layers.