Abstract: A cover for a socket that is to be soldered to a printed circuit board is described. The socket has connections to be soldered to the printed circuit board and connections to contact a die that will be carried by the socket. The socket includes a top surface to cover the die contacts of the socket and side walls surrounding the top surface and extending toward the socket to separate the top surface from the die contacts. The top surface has a plurality of inlet vents, and the side walls have a plurality of outlet vents.

Abstract: A cover for a socket that is to be soldered to a printed circuit board is described. The socket has connections to be soldered to the printed circuit board and connections to contact a die that will be carried by the socket. The socket includes a top surface to cover the die contacts of the socket and side walls surrounding the top surface and extending toward the socket to separate the top surface from the die contacts. The top surface has a plurality of inlet vents, and the side walls have a plurality of outlet vents.

Abstract: Apparatus for indicating a predetermined snap-off between a circuit board and a stencil in a solder paste printing process for printed circuit boards. The apparatus includes a triangular shaped plate having a lever member, where a portion of the lever member extends through a stencil hole for engaging the circuit board. The plate further includes two support members for resting on top of the stencil. The centroid of the weight of the plate is between the two support members and the lever member to urge the plate to pivot about the two support members. On the end opposite the two support members is an indicator cone for indicating the predetermined snap-off of the circuit board relative to the stencil. Advantageously a method for positioning the stencil and the circuit board at a predetermined snap-off during the solder paste printing process for printed circuit boards is also disclosed.