Abstract: A method and system of a configurable phased array transceiver are provided. A first beamforming unit is configured to provide a first beam. A second beamforming unit is configured to provide a second beam. A first bi-directional power controller is configured to combine or to split the first beam and the second beam. Each beamforming unit comprises a plurality of radio frequency (RF) front-ends, each front-end being configured to transmit and receive RF signals. Each beam is independently configurable to operate in a transmit (TX) or a receive (RX) mode.

Abstract: Polarimetric transceiver front-ends and polarimetric phased array transceivers include two receive paths configured to receive signals from an antenna, each including a respective variable phase shifter. A first transmit path is connected to the variable phase shifter of one of the two receive paths and is configured to send signals to the antenna. A transmit/receive switch is configured to select between the first transmit path and the two receive paths for signals. The transmit/receive switch has an element that adds a high impedance to the transmit path when the transmit/receive switch is in a receiving state.

Abstract: Polarimetric transceiver front-ends and polarimetric phased array transceivers include two receive paths configured to receive signals from an antenna, each including a respective variable phase shifter. A first transmit path is connected to the variable phase shifter of one of the two receive paths and is configured to send signals to the antenna. A transmit/receive switch is configured to select between the first transmit path and the two receive paths for signals. The transmit/receive switch has an element that adds a high impedance to the transmit path when the transmit/receive switch is in a receiving state.

Abstract: A method and system of a configurable phased array transceiver are provided. A first beamforming unit is configured to provide a first beam. A second beamforming unit is configured to provide a second beam. A first bi-directional power controller is configured to combine or to split the first beam and the second beam. Each beamforming unit comprises a plurality of radio frequency (RF) front-ends, each front-end being configured to transmit and receive RF signals. Each beam is independently configurable to operate in a transmit (TX) or a receive (RX) mode.

Abstract: Antenna devices, antenna systems and methods of their fabrication are disclosed. One such antenna device includes a semiconductor chip and a chip package. The semiconductor chip includes at least one antenna that is integrated into a dielectric layer of the semiconductor chip and is configured to transmit electromagnetic waves. In addition, the chip package includes at least one ground plane, where the semiconductor chip is mounted on the chip package such that the ground plane(s) is disposed at a predetermined distance from the antenna to implement a reflection of at least a portion of the electromagnetic waves.

Abstract: A method and system of a configurable phased array transceiver are provided. A first beamforming unit is configured to provide a first beam. A second beamforming unit is configured to provide a second beam. A first bi-directional power controller is configured to combine or to split the first beam and the second beam. Each beamforming unit comprises a plurality of radio frequency (RF) front-ends, each front-end being configured to transmit and receive RF signals. Each beam is independently configurable to operate in a transmit (TX) or a receive (RX) mode.

Abstract: A polarimetric transceiver front-end includes two receive paths configured to receive signals from an antenna, each receive path corresponding to a respective polarization. Each front-end includes a variable amplifier and a variable phase shifter; a first transmit path configured to send signals to the antenna, where the transmit path is connected to the variable phase shifter of one of the two receive paths and includes a variable amplifier; and a transmit/receive switch configured to select between the first transmit path and the two receive paths for signals, where the transmit/receive switch includes a quarter-wavelength transmission line that adds a high impedance to the transmit path when the transmit/receive switch is in a receiving state.

Abstract: According to an aspect of the present principles, methods are provided for fabricating an integrated structure. A method includes forming a very large scale integration (VLSI) structure including a semiconductor layer at a top of the VLSI structure. The method further includes mounting the VLSI structure to a support structure. The method additionally includes removing at least a portion of the semiconductor layer from the VLSI structure. The method also includes attaching an upper layer to the top of the VLSI structure. The upper layer is primarily composed of a material that has at least one of a higher resistivity or a higher transparency than the semiconductor layer. The upper layer includes at least one hole for at least one of a photonic device or an electronic device. The method further includes releasing said VLSI structure from the support structure.

Abstract: According to an aspect of the present principles, methods are provided for fabricating an integrated structure. A method includes forming a very large scale integration (VLSI) structure including a semiconductor layer at a top of the VLSI structure. The method further includes mounting the VLSI structure to a support structure. The method additionally includes removing at least a portion of the semiconductor layer from the VLSI structure. The method also includes attaching an upper layer to the top of the VLSI structure. The upper layer is primarily composed of a material that has at least one of a higher resistivity or a higher transparency than the semiconductor layer. The upper layer includes at least one hole for at least one of a photonic device or an electronic device. The method further includes releasing said VLSI structure from the support structure.

Abstract: Transmit/receive switches and methods for radio control include connecting a first reactive impedance in parallel with a power amplifier on a transmit path during reception to neutralize a reactive impedance of the power amplifier and to prevent received signals from entering the transmit path. The first reactive impedance is disconnected during transmission.

Abstract: A method and system of a configurable phased array transceiver are provided. A first beamforming unit is configured to provide a first beam. A second beamforming unit is configured to provide a second beam. A first bi-directional power controller is configured to combine or to split the first beam and the second beam. Each beamforming unit comprises a plurality of radio frequency (RF) front-ends, each front-end being configured to transmit and receive RF signals. Each beam is independently configurable to operate in a transmit (TX) or a receive (RX) mode.

Abstract: Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.

Abstract: Antenna devices, antenna systems and methods of their fabrication are disclosed. One such antenna device includes a semiconductor chip and a chip package. The semiconductor chip includes at least one antenna that is integrated into a dielectric layer of the semiconductor chip and is configured to transmit electromagnetic waves. In addition, the chip package includes at least one ground plane, where the semiconductor chip is mounted on the chip package such that the ground plane(s) is disposed at a predetermined distance from the antenna to implement a reflection of at least a portion of the electromagnetic waves.

Abstract: According to an aspect of the present principles, methods are provided for fabricating an integrated structure. A method includes forming a very large scale integration (VLSI) structure including a semiconductor layer at a top of the VLSI structure. The method further includes mounting the VLSI structure to a support structure. The method additionally includes removing at least a portion of the semiconductor layer from the VLSI structure. The method also includes attaching an upper layer to the top of the VLSI structure. The upper layer is primarily composed of a material that has at least one of a higher resistivity or a higher transparency than the semiconductor layer. The upper layer includes at least one hole for at least one of a photonic device or an electronic device. The method further includes releasing said VLSI structure from the support structure.

Abstract: Antenna devices, antenna systems and methods of their fabrication are disclosed. One such antenna device includes a semiconductor chip and a chip package. The semiconductor chip includes at least one antenna that is integrated into a dielectric layer of the semiconductor chip and is configured to transmit electromagnetic waves. In addition, the chip package includes at least one ground plane, where the semiconductor chip is mounted on the chip package such that the ground plane(s) is disposed at a predetermined distance from the antenna to implement a reflection of at least a portion of the electromagnetic waves.

Abstract: According to an aspect of the present principles, methods are provided for fabricating an integrated structure. A method includes forming a very large scale integration (VLSI) structure including a semiconductor layer at a top of the VLSI structure. The method further includes mounting the VLSI structure to a support structure. The method additionally includes removing at least a portion of the semiconductor layer from the VLSI structure. The method also includes attaching an upper layer to the top of the VLSI structure. The upper layer is primarily composed of a material that has at least one of a higher resistivity or a higher transparency than the semiconductor layer. The upper layer includes at least one hole for at least one of a photonic device or an electronic device. The method further includes releasing said VLSI structure from the support structure.

Abstract: Transmit/receive switches and methods for radio control include connecting a first reactive impedance in parallel with a power amplifier on a transmit path during reception to neutralize a reactive impedance of the power amplifier and to prevent received signals from entering the transmit path. The first reactive impedance is disconnected during transmission.

Abstract: According to an aspect of the present principles, methods are provided for fabricating an integrated structure. A method includes forming a very large scale integration (VLSI) structure including a semiconductor layer at a top of the VLSI structure. The method further includes mounting the VLSI structure to a support structure. The method additionally includes removing at least a portion of the semiconductor layer from the VLSI structure. The method also includes attaching an upper layer to the top of the VLSI structure. The upper layer is primarily composed of a material that has at least one of a higher resistivity or a higher transparency than the semiconductor layer. The upper layer includes at least one hole for at least one of a photonic device or an electronic device. The method further includes releasing said VLSI structure from the support structure.

Abstract: Antenna devices, antenna systems and methods of their fabrication are disclosed. One such antenna device includes a semiconductor chip and a chip package. The semiconductor chip includes at least one antenna that is integrated into a dielectric layer of the semiconductor chip and is configured to transmit electromagnetic waves. In addition, the chip package includes at least one ground plane, where the semiconductor chip is mounted on the chip package such that the ground plane(s) is disposed at a predetermined distance from the antenna to implement a reflection of at least a portion of the electromagnetic waves.

Abstract: Methods and systems for phase shifting include a hybrid quadrature coupler having an input, an output, and two termination loads. Each termination load includes multiple terminations, each termination having a varactor; and one or more transmission lines separating the terminations. A control module is configured to determine a phase shift and gain to apply to the input and to independently control a capacitance of each varactor such that the output of the hybrid quadrature coupler is shifted by the determined phase shift relative to the input with the determined gain.