Abstract: A method and system for generating from a high-level placement specification the layout and schematic implementation data is disclosed. In addition packaging data and a software model may also be generated. In one embodiment an array of rows and columns is formed on an integrated circuit (IC) in which all elements in a row have the same height and all elements in a column have the same width. This array, which may be displayed in a textual or spreadsheet format, forms the high-level placement specification. A software program of this embodiment converts this high-level placement specification into layout and schematic files that can be used by a commercial CAD tool to produce a file for fabrication.

Abstract: A method and system for generating implementation files from a high level specification are described. In one example, a method for creating a package file for an integrated circuit is described. First, a grid is formed having a plurality of blocks. A height and a width are then determined for each block. At least one bump is placed on a block and a corresponding package pin is assigned to the at least one bump. Finally, the package file is output.

Abstract: A method and system for generating from a high-level placement specification the layout and schematic implementation data is disclosed. In addition packaging data and a software model may also be generated. In one embodiment an array of rows and columns is formed on an integrated circuit (IC) in which all elements in a row have the same height and all elements in a column have the same width. This array, which may be displayed in a textual or spreadsheet format, forms the high-level placement specification. A software program of this embodiment converts this high-level placement specification into layout and schematic files that can be used by a commercial CAD tool to produce a file for fabrication.

Abstract: An aspect of the invention relates to a method, apparatus, and computer-readable medium for processing schematic data for an integrated circuit having a boundary scan architecture. A path through cells of the schematic data to generate a hierarchy of cells associated with a boundary scan chain. Each ignore cell in the hierarchy is pruned. Each short cell in the hierarchy is replaced with a direct connection. A shadow net is added to each net of the hierarchy. Each of the cells in the hierarchy is flattened in a bottom-up fashion.

Abstract: A method and system for generating from a high-level placement specification the layout and schematic implementation data is disclosed. In addition packaging data and a software model may also be generated. In one embodiment an array of rows and columns is formed on an integrated circuit (IC) in which all elements in a row have the same height and all elements in a column have the same width. This array, which may be displayed in a textual or spreadsheet format, forms the high-level placement specification. A software program of this embodiment converts this high-level placement specification into layout and schematic files that can be used by a commercial CAD tool to produce a file for fabrication.

Abstract: Dynamic latches for writing to a synchronous RAM are controlled by a clock signal and a delay circuit so that the dynamic latches will not stay in a latched state for more than a selected time interval regardless of the clock signal. One delay circuit limits the length of a write enable signal. Another delay circuit responds to the write enable signal and after a delay returns the address and data latches to their transparent states.

Abstract: Dynamic latches for writing to a synchronous RAM are controlled by a clock signal and a delay circuit so that the dynamic latches will not stay in a latched state for more than a selected time interval regardless of the clock signal. One delay circuit limits the length of a write enable signal. Another delay circuit responds to the write enable signal and after a delay returns the address and data latches to their transparent states.