Patents by Inventor Scott Kayser
Scott Kayser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11921054Abstract: A semiconductor wafer imaging system for imaging a semiconductor wafer includes shroud panels defining a black box, a camera positioned in the black box for imaging the semiconductor wafer, and an illumination panel for directing diffuse light to the semiconductor wafer. A portion of the diffuse light is reflected off the semiconductor wafer and the camera images the semiconductor wafer by detecting the reflected diffuse light.Type: GrantFiled: September 13, 2021Date of Patent: March 5, 2024Assignee: GlobalWafers Co., Ltd.Inventors: Benjamin Michael Meyer, Justin Scott Kayser, John F. Valley, James Dean Eoff, Vandan Tanna, William L. Luter
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Publication number: 20240035193Abstract: Cooling jacket devices of ingot puller apparatus used to prepare silicon ingots by the Czochralski method are disclosed. The cooling jacket device may include an inner shell that forms an inner chamber through which the ingot is pulled. The cooling jacket includes an outer shell. A plurality of tubes are disposed between the inner shell and outer shell. Each tube forms a cooling fluid passageway through which cooling fluid passes.Type: ApplicationFiled: August 1, 2022Publication date: February 1, 2024Inventors: Benjamin Michael Meyer, Justin Scott Kayser
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Patent number: 11815996Abstract: The subject technology provides for scanning blocks of a flash memory device for erased pages. A first codeword read from a page of a block in a flash memory device is received and provided to a first decoder for decoding. In response to receiving a first success indicator from the first decoder indicating that the first codeword was successfully decoded, first decoded data is provided from the first decoder to a second decoder for verification of the first decoded data. In response to receiving a first failure indicator from the second decoder indicating that the first decoded data was not verified, the page of the block is identified as being in an erased state based on the first success indicator received from the first decoder and the first failure indicator received from the second decoder.Type: GrantFiled: March 25, 2022Date of Patent: November 14, 2023Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.Inventors: Richard David Barndt, Seyhan Karakulak, Scott Kayser, Majid Nemati Anaraki, Anthony Dwayne Weathers
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Publication number: 20230031395Abstract: Cleave systems for cleaving a semiconductor structure are disclosed. The cleave systems may include a cleave arm that is moveable from a starting position to a raised position in which a cleave stress is applied to the semiconductor structure. Spring members store energy as the cleave arm is raised with the stored spring energy causing the structure to cleave into two pieces upon initiation of the cleave across the structure.Type: ApplicationFiled: September 29, 2022Publication date: February 2, 2023Inventor: Justin Scott Kayser
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Patent number: 11538698Abstract: Cleave systems for cleaving a semiconductor structure are disclosed. The cleave systems may include a cleave arm that is moveable from a starting position to a raised position in which a cleave stress is applied to the semiconductor structure. Spring members store energy as the cleave arm is raised with the stored spring energy causing the structure to cleave into two pieces upon initiation of the cleave across the structure.Type: GrantFiled: September 10, 2020Date of Patent: December 27, 2022Assignee: GlobalWafers Co., Ltd.Inventor: Justin Scott Kayser
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Publication number: 20220214941Abstract: The subject technology provides for scanning blocks of a flash memory device for erased pages. A first codeword read from a page of a block in a flash memory device is received and provided to a first decoder for decoding. In response to receiving a first success indicator from the first decoder indicating that the first codeword was successfully decoded, first decoded data is provided from the first decoder to a second decoder for verification of the first decoded data. In response to receiving a first failure indicator from the second decoder indicating that the first decoded data was not verified, the page of the block is identified as being in an erased state based on the first success indicator received from the first decoder and the first failure indicator received from the second decoder.Type: ApplicationFiled: March 25, 2022Publication date: July 7, 2022Applicant: Western Digital Technologies, Inc.Inventors: Richard David BARNDT, Seyhan KARAKULAK, Scott KAYSER, Majid NEMATI ANARAKI, Anthony Dwayne WEATHERS
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Patent number: 11327837Abstract: The subject technology provides for scanning blocks of a flash memory device for erased pages. A first codeword read from a page of a block in a flash memory device is received and provided to a first decoder for decoding. In response to receiving a first success indicator from the first decoder indicating that the first codeword was successfully decoded, first decoded data is provided from the first decoder to a second decoder for verification of the first decoded data. In response to receiving a first failure indicator from the second decoder indicating that the first decoded data was not verified, the page of the block is identified as being in an erased state based on the first success indicator received from the first decoder and the first failure indicator received from the second decoder.Type: GrantFiled: December 18, 2020Date of Patent: May 10, 2022Assignee: Western Digital Technologies, Inc.Inventors: Richard David Barndt, Seyhan Karakulak, Scott Kayser, Majid Nemati Anaraki, Anthony Dwayne Weathers
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Publication number: 20220084857Abstract: A semiconductor wafer processing system for processing a semiconductor wafer includes a semiconductor wafer processing station for processing the semiconductor wafer and a semiconductor wafer imaging system that images the semiconductor wafer after the semiconductor wafer processing station processes the semiconductor wafer. The semiconductor wafer imaging system includes shroud panels defining a black box, a camera positioned in the black box for imaging the semiconductor wafer, and an illumination panel for directing diffuse light to the semiconductor wafer. A portion of the diffuse light is reflected off the semiconductor wafer and the camera images the semiconductor wafer by detecting the reflected diffuse light.Type: ApplicationFiled: September 13, 2021Publication date: March 17, 2022Inventors: Benjamin Michael Meyer, Justin Scott Kayser, John F. Valley, James Dean Eoff, Vandan Tanna, William L. Luter
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Publication number: 20220084892Abstract: A method of detecting defects on a semiconductor wafer includes directing diffuse light to the semiconductor wafer and reflecting the diffuse light off of the semiconductor wafer. The method further includes detecting the diffuse light with a camera to generate an image of the semiconductor wafer and analyzing the image to detect defects on the semiconductor wafer.Type: ApplicationFiled: September 13, 2021Publication date: March 17, 2022Inventors: Benjamin Michael Meyer, Justin Scott Kayser, John F. Valley, James Dean Eoff, Vandan Tanna, William L. Luter
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Publication number: 20220082510Abstract: A semiconductor wafer imaging system for imaging a semiconductor wafer includes shroud panels defining a black box, a camera positioned in the black box for imaging the semiconductor wafer, and an illumination panel for directing diffuse light to the semiconductor wafer. A portion of the diffuse light is reflected off the semiconductor wafer and the camera images the semiconductor wafer by detecting the reflected diffuse light.Type: ApplicationFiled: September 13, 2021Publication date: March 17, 2022Inventors: Benjamin Michael Meyer, Justin Scott Kayser, John F. Valley, James Dean Eoff, Vandan Tanna, William L. Luter
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Publication number: 20210337736Abstract: A pollen collection device for collecting pollen from crop plants grown in rows includes a housing assembly configured to be mounted on a base for being transported through a row of crop plants. The housing assembly receives at least a portion of the plants as the housing assembly is transported through the row of crop plants. An agitation assembly is attached to the housing assembly for agitating the plants as the housing assembly is transported through the row of crop plants to displace pollen from the plants. A pollen collection assembly is attached to the housing assembly for collecting the pollen displaced from the plants as the housing assembly is transported through the row of crop plants.Type: ApplicationFiled: May 3, 2021Publication date: November 4, 2021Inventors: Zachary Boyer, Plinio Tadeu Cristofoletti, JR., Justin Scott Kayser, Jeffrey Steven Morris, Payman Rassoolkhani, Felipe Camargo Rosa
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Publication number: 20210103496Abstract: The subject technology provides for scanning blocks of a flash memory device for erased pages. A first codeword read from a page of a block in a flash memory device is received and provided to a first decoder for decoding. In response to receiving a first success indicator from the first decoder indicating that the first codeword was successfully decoded, first decoded data is provided from the first decoder to a second decoder for verification of the first decoded data. In response to receiving a first failure indicator from the second decoder indicating that the first decoded data was not verified, the page of the block is identified as being in an erased state based on the first success indicator received from the first decoder and the first failure indicator received from the second decoder.Type: ApplicationFiled: December 18, 2020Publication date: April 8, 2021Inventors: Richard David BARNDT, Seyhan KARAKULAK, Scott KAYSER, Majid NEMATI ANARAKI, Anthony Dwayne WEATHERS
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Publication number: 20210098272Abstract: Cleave systems for cleaving a semiconductor structure are disclosed. The cleave systems may include a cleave arm that is moveable from a starting position to a raised positon in which a cleave stress is applied to the semiconductor structure. Spring members store energy as the cleave arm is raised with the stored spring energy causing the structure to cleave into two pieces upon initiation of the cleave across the structure.Type: ApplicationFiled: September 10, 2020Publication date: April 1, 2021Inventor: Justin Scott Kayser
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Patent number: 10910280Abstract: Cleave systems for separating bonded wafer structures, mountable cleave monitoring systems and methods for separating bonded wafer structures are disclosed. In some embodiments, the sound emitted from a bonded wafer structure is sensed during cleaving and a metric related to an attribute of the cleave is generated. The generated metric may be used for quality control and/or to adjust a cleave control parameter to improve the quality of the cleave of subsequently cleaved bonded wafer structures.Type: GrantFiled: March 8, 2019Date of Patent: February 2, 2021Assignee: GlobalWafers Co., Ltd.Inventors: Justin Scott Kayser, John Francis Valley, James Dean Eoff
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Patent number: 10884854Abstract: The subject technology provides for scanning blocks of a flash memory device for erased pages. A first codeword read from a page of a block in a flash memory device is received and provided to a first decoder for decoding. In response to receiving a first success indicator from the first decoder indicating that the first codeword was successfully decoded, first decoded data is provided from the first decoder to a second decoder for verification of the first decoded data. In response to receiving a first failure indicator from the second decoder indicating that the first decoded data was not verified, the page of the block is identified as being in an erased state based on the first success indicator received from the first decoder and the first failure indicator received from the second decoder.Type: GrantFiled: June 27, 2019Date of Patent: January 5, 2021Assignee: Western Digital Technologies, Inc.Inventors: Richard David Barndt, Seyhan Karakulak, Scott Kayser, Majid Nemati Anaraki, Anthony Dwayne Weathers
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Patent number: 10679908Abstract: Cleave systems for separating bonded wafer structures, mountable cleave monitoring systems and methods for separating bonded wafer structures are disclosed. In some embodiments, the sound emitted from a bonded wafer structure is sensed during cleaving and a metric related to an attribute of the cleave is generated. The generated metric may be used for quality control and/or to adjust a cleave control parameter to improve the quality of the cleave of subsequently cleaved bonded wafer structures.Type: GrantFiled: January 9, 2018Date of Patent: June 9, 2020Assignee: GLOBALWAFERS CO., LTD.Inventors: Justin Scott Kayser, John Francis Valley, James Dean Eoff
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Publication number: 20190324853Abstract: The subject technology provides for scanning blocks of a flash memory device for erased pages. A first codeword read from a page of a block in a flash memory device is received and provided to a first decoder for decoding. In response to receiving a first success indicator from the first decoder indicating that the first codeword was successfully decoded, first decoded data is provided from the first decoder to a second decoder for verification of the first decoded data. In response to receiving a first failure indicator from the second decoder indicating that the first decoded data was not verified, the page of the block is identified as being in an erased state based on the first success indicator received from the first decoder and the first failure indicator received from the second decoder.Type: ApplicationFiled: June 27, 2019Publication date: October 24, 2019Inventors: Richard David BARNDT, Seyhan KARAKULAK, Scott KAYSER, Majid NEMATI ANARAKI, Anthony Dwayne WEATHERS
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Patent number: 10387246Abstract: The subject technology provides for scanning blocks of a flash memory device for erased pages. A first codeword read from a page of a block in a flash memory device is received and provided to a first decoder for decoding. In response to receiving a first success indicator from the first decoder indicating that the first codeword was successfully decoded, first decoded data is provided from the first decoder to a second decoder for verification of the first decoded data. In response to receiving a first failure indicator from the second decoder indicating that the first decoded data was not verified, the page of the block is identified as being in an erased state based on the first success indicator received from the first decoder and the first failure indicator received from the second decoder.Type: GrantFiled: July 27, 2017Date of Patent: August 20, 2019Assignee: Western Digital Technologies, Inc.Inventors: Richard David Barndt, Seyhan Karakulak, Scott Kayser, Majid Nemati Anaraki, Anthony Dwayne Weathers
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Publication number: 20190206745Abstract: Cleave systems for separating bonded wafer structures, mountable cleave monitoring systems and methods for separating bonded wafer structures are disclosed. In some embodiments, the sound emitted from a bonded wafer structure is sensed during cleaving and a metric related to an attribute of the cleave is generated. The generated metric may be used for quality control and/or to adjust a cleave control parameter to improve the quality of the cleave of subsequently cleaved bonded wafer structures.Type: ApplicationFiled: March 8, 2019Publication date: July 4, 2019Inventors: Justin Scott Kayser, John Francis Valley, James Dean Eoff
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Publication number: 20180373591Abstract: The subject technology provides for scanning blocks of a flash memory device for erased pages. A first codeword read from a page of a block in a flash memory device is received and provided to a first decoder for decoding. In response to receiving a first success indicator from the first decoder indicating that the first codeword was successfully decoded, first decoded data is provided from the first decoder to a second decoder for verification of the first decoded data. In response to receiving a first failure indicator from the second decoder indicating that the first decoded data was not verified, the page of the block is identified as being in an erased state based on the first success indicator received from the first decoder and the first failure indicator received from the second decoder.Type: ApplicationFiled: July 27, 2017Publication date: December 27, 2018Inventors: Richard David BARNDT, Seyhan Karakulak, Scott Kayser, Majid Nemati Anaraki, Anthony Dwayne Weathers