Abstract: A feedthrough terminal assembly for active implantable medical devices includes a structural wire bond pad for a convenient attachment of wires from either the circuitry inside the implantable medical device or wires external to the device. Direct attachment of wire bond pads to terminal pins enables thermal or ultrasonic bonding of lead wires, while shielding the capacitor or other delicate components from the forces applied to the assembly during attachment of the wires.

Abstract: An electro-magnetic interference filter terminal assembly for active implantable medical devices includes a structural pad in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical device to the capacitor structure via thermal or ultrasonic bonding, soldering or the like while shielding the capacitor from forces applied to the assembly during attachment of the wires.

Abstract: A feedthrough terminal pin assembly includes an outer ferrule hermetically sealed through a braze joint to an insulator seated within the ferrule is described. The insulator is also hermetically brazed to at least one terminal pin. The terminal pin is provided with a braze retention structure such as an annular groove that prevents braze material from filleting past the groove. Similarly, either the ferrule or the insulator is provided with a retention structure such as an annular groove that prevents braze material spill out from the insulator/ferrule interface. In that manner, the braze retention structures keep braze material from accumulating in unwanted areas where it could adversely affect hermeticity as well as proper attachment of an EMI filter to the feedthrough assembly.

Abstract: A feedthrough terminal assembly for active implantable medical devices includes a structural wire bond pad for a convenient attachment of wires from either the circuitry inside the implantable medical device or wires external to the device. Direct attachment of wire bond pads to terminal pins enables thermal or ultrasonic bonding of lead wires, while shielding the capacitor or other delicate components from the forces applied to the assembly during attachment of the wires.

Abstract: A feedthrough terminal pin assembly comprises an outer ferrule hermetically sealed through a braze joint to an insulator seated within the ferrule is described. The insulator is also hermetically brazed to at least one terminal pin. The terminal pin is provided with a braze retention structure such as an annular groove that prevents braze material from filleting past the groove. Similarly, either the ferrule or the insulator is provided with a retention structure such as an annular groove that prevents braze material spill out from the insulator/ferrule interface. In that manner, the braze retention structures keep braze material from accumulating in unwanted areas where it could adversely affect hermeticity as well as proper attachment of an EMI filter to the feedthrough assembly.

Abstract: An electro-magnetic interference filter terminal assembly for active implantable medical devices includes a structural pad in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical device to the capacitor structure via thermal or ultrasonic bonding, soldering or the like while shielding the capacitor from forces applied to the assembly during attachment of the wires.

Abstract: A terminal assembly for active implantable medical devices includes a structural pad, in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical device.

Abstract: An electromagnetic interference filter terminal assembly for active implantable medical devices includes a structural pad in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical device to the capacitor structure via thermal or ultrasonic bonding, soldering or the like while shielding the capacitor from forces applied to the assembly during attachment of the wires.

Abstract: A terminal assembly for active implantable medical devices includes a structural pad, in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical device.

Abstract: An electromagnetic interference filter terminal assembly for active implantable medical devices includes a structural pad in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical device to the capacitor structure via thermal or ultrasonic bonding, soldering or the like while shielding the capacitor from forces applied to the assembly during attachment of the wires.