Abstract: Provided is a micro-electro-mechanical system and an electro-acoustic conversion device having the micro-electro-mechanical system. The micro-electro-mechanical system includes: first and second membranes arranged opposite to each other; support members arranged between the first and second membranes; and an opening provided on the first and/or second membranes. Each support member includes support walls, and opposite ends of each of the support walls are connected to the first and second membranes. The first and second membranes, and two adjacent support walls in one support member are enclosed to form a first chamber. The opening is configured to link the first chamber with the outside. By arranging a supporting member composed of support walls and providing an opening on the first and/or second membranes, the compliance of the first or second membrane is increased, and the inter-plate capacitance therebetween is reduced.

Abstract: A microelectromechanical system membrane includes spacers, counter electrodes, a first diaphragm and a second diaphragm. The spacers and the counter electrodes are at the same level and arranged alternatively on cross sections of the microelectromechanical system membrane. The first diaphragm and the second diaphragm are respectively located on opposite sides of the spacers and hermetically connected. The first diaphragm is provided with first projections spaced arranged in the first direction, and the second diaphragm is provided with second projections spaced arranged alternately in the first direction. The first projections include first front walls and first back walls disposed opposite in the first direction, and the second projections include second front walls and second back walls disposed opposite in the first direction. At least some of the first front and back walls, the second front and back walls are configured to be sub-corrugation structures.

Abstract: A microelectromechanical system includes counter electrodes, a first diaphragm and a second diaphragm. The first diaphragm is provided with multiple first corrugations, each first corrugation includes a first crest and a first trough, and the first crests and troughs are arranged alternately in a third direction. The second diaphragm is provided with multiple second corrugations, each second corrugation includes a second crest and a second trough, and the second crests and troughs are arranged alternately in the third direction. The first crests are respectively aligned with the second troughs to form cavities, and the counter electrodes are disposed in the cavities respectively. The first troughs are respectively aligned with the second crests, and at least some of the first troughs are configured to be in direct contact with corresponding second crests. The system has an improved robustness while the high acoustic compliance and sensitivity from the sealed dual-diaphragm are maintained.

Abstract: A microelectromechanical system includes a backplate and a diaphragm. The backplate includes spaced stator elements with voids formed therebetween. The stator element includes a first conductive element. The diaphragm includes a plurality of corrugations facing the voids respectively. Each corrugation includes a groove formed at a surface thereof away from the backplate. The corrugation includes a second conductive element. The diaphragm is moveable with respect to the backplate in response to a pressure exerted thereon to cause the corrugations to be moved into or out of the corresponding voids, thereby changing the capacitance formed between the first and second conductive elements. The corrugations are defined by grooves formed at surfaces away from the backplate, which facilitate to control the compliance of the diaphragm and reduce stiffness of the diaphragm. The corrugation can be formed with lower aspect ratios, which allows it to be formed using standard front side processes.

Abstract: A microelectromechanical system membrane includes spacers, counter electrodes, a first diaphragm and a second diaphragm. The spacers and the counter electrodes are at the same level and arranged alternatively on cross sections of the microelectromechanical system membrane. The first diaphragm and the second diaphragm are respectively located on opposite sides of the spacers and hermetically connected. The first diaphragm is provided with first projections spaced arranged in the first direction, and the second diaphragm is provided with second projections spaced arranged alternately in the first direction. The first projections include first front walls and first back walls disposed opposite in the first direction, and the second projections include second front walls and second back walls disposed opposite in the first direction. At least some of the first front and back walls, the second front and back walls are configured to be sub-corrugation structures.

Abstract: An MEMS device, including: a substrate having a back cavity; a diaphragm connected to the substrate and covers the back cavity, the diaphragm includes first and second membranes arranged oppositely, and accommodation space is formed therebetween; a counter electrode in the accommodation space and includes annular beams and first spokes, the annular beams are successively arranged at intervals, and the first spokes extend radially outward from an axis of the counter electrode, an end of the first spokes is connected to the substrate, and two adjacent first spokes and two adjacent annular beams jointly form a first through hole; and a support arranged corresponding to the first through hole, and opposite ends of the support are respectively connected to the first and second membranes. This configuration is more sensitive to sound pressure and is conducive to realizing low-noise microphone while optimizing sensitivity.

Abstract: A comb-drive device used in Micro Electro Mechanical System is provided, and the comb-drive device includes: a rotor comprising a rotor body and a plurality of rotor combs provided on the rotor body; and a stator comprising one or more stator bodies and a plurality of stator combs provided on the one or more stator bodies. The rotor is spaced from the stator by a distance, the rotor and the stator are arranged along a direction in which the rotor is movable, and the plurality of rotor combs and the plurality of stator combs are alternately arranged in a direction particular to the direction in which the rotor is movable; and the rotor body is made of an insulating material, and each of the plurality of rotor combs is made of a conductive material or coated with a conductive material. The present invention can increase sensitivity and capacitance efficiency of the comb-drive device.

Abstract: A cantilever microphone includes: a substrate; a cantilever including a rotor frame and a plate covering the rotor frame, where the cantilever includes a first edge fixed to the substrate and a second end opposite to the first edge, a plurality of rotor comb fingers is attached to the plate at an edge of the plate adjacent to the second edge; and a stator fixed to the substrate or attached to a sub structure to allow some displacement from the substrate, where the stator includes a plurality of stator comb fingers, and the stator comb fingers are interdigitated with the rotor comb fingers. For the cantilever microphone, high mechanical sensitivity of the cantilever and high electrostatic sensitivity of the comb structure can be implemented, so as to increase the performance or signal-to-noise ratio of the cantilever microphone.

Abstract: An MEMS diaphragm and an MEMS sensor. The MEMS diaphragm includes: a main diaphragm including a main body sensing portion and beam portions, and the beam portions are connected to an outer edge of the main body sensing portion; an additional material layer provided on the beam portions or provided on both an edge of the main body sensing portion and on the beam portions. The intrinsic tensile stress of the additional material layer is greater than an intrinsic tensile stress of the main body sensing portion. An additional material layer is provided, which mechanically reinforces the diaphragm region experiencing high stress during a pressure pulse, and the intrinsic tensile stress of the additional material layer is greater than the main body sensing portion, thereby ensuring the compliance of the main diaphragm.

Abstract: Provided is a MEMS device. The MEMS device includes: substrate having back cavity passing through; diaphragm connected to the substrate and covers the back cavity, the diaphragm comprises first and second membranes, and accommodating space is formed between the first and second membranes; supports arranged in the accommodating space, and opposite ends of the support are connected to the first and second membranes; counter electrode arranged in the accommodating space, the first and second membranes each include conductive and second regions, ventilation slots are annularly spaced on the diaphragm along circumferential direction and penetrate through the first and second membranes, the electrode region extends from center of the first and second membranes toward but does not reach the ventilation slots. Through design of the first and second membranes and the electrode region, sensitivity of the microphone is increased.

Abstract: Provided is an MEMS device, including: a base, a rear cavity; a vibrating diaphragm, the vibrating diaphragm including an upper diaphragm and a lower diaphragm, and an accommodation space being formed between the upper and lower diaphragms; a counter electrode arranged in the accommodation space; and supporting members concentrically arranged and spaced apart. The supporting members are arranged between the upper and lower diaphragms and are spaced apart from the counter electrode, two opposite ends of each supporting member are connected to the upper and lower diaphragms, and at least one of the supporting members is provided with first cavities. An upper ventilation hole and a lower ventilation hole are respectively formed at a position of the upper diaphragm and a position of the lower diaphragm corresponding to one of the first cavities; and the upper ventilation hole, the first cavity and the lower ventilation hole communicate with each other.

Abstract: A cantilever microphone includes: a substrate; a cantilever including a rotor frame and a plate covering the rotor frame, where the cantilever includes a first edge fixed to the substrate and a second end opposite to the first edge, a plurality of rotor comb fingers is attached to the plate at an edge of the plate adjacent to the second edge; and a stator fixed to the substrate or attached to a sub structure to allow some displacement from the substrate, where the stator includes a plurality of stator comb fingers, and the stator comb fingers are interdigitated with the rotor comb fingers. For the cantilever microphone, high mechanical sensitivity of the cantilever and high electrostatic sensitivity of the comb structure can be implemented, so as to increase the performance or signal-to-noise ratio of the cantilever microphone.

Abstract: Provided is a MEMS device. The MEMS device includes: substrate having back cavity passing therethrough; diaphragm connected to the substrate and covers the back cavity, the diaphragm comprises first and second membranes, and accommodating space is formed between the first and second membranes; supports arranged in the accommodating space, and opposite ends of the support are connected to the first and second membranes; counter electrode arranged in the accommodating space, the first and second membranes each include conductive and second regions, the second region is formed by semiconductor material without doping conductive ions. Through design of the first and second membranes as the first region and the second region, respectively, the second region is formed by semiconductor material without doping conductive ions, and the first region is formed by doping conductive ions in the semiconductor material, so that the compliance performance is improved and not at risk of delamination.

Abstract: Provided is a MEMS device. The MEMS device includes: substrate having back cavity passing therethrough; diaphragm connected to the substrate and covers the back cavity, the diaphragm comprises first and second membranes, and accommodating space is formed between the first and second membranes; supports arranged in the accommodating space, and opposite ends of the support are connected to the first and second membranes; counter electrode arranged in the accommodating space, the first and second membranes each include conductive and second regions, the second region is formed by semiconductor material without doping conductive ions. Through design of the first and second membranes as the first region and the second region, respectively, the second region is formed by semiconductor material without doping conductive ions, and the first region is formed by doping conductive ions in the semiconductor material, so that the compliance performance is improved and not at risk of delamination.

Abstract: Provided is a MEMS device. The MEMS device includes: substrate having back cavity passing through; diaphragm connected to the substrate and covers the back cavity, the diaphragm comprises first and second membranes, and accommodating space is formed between the first and second membranes; supports arranged in the accommodating space, and opposite ends of the support are connected to the first and second membranes; counter electrode arranged in the accommodating space, the first and second membranes each include conductive and second regions, ventilation slots are annularly spaced on the diaphragm along circumferential direction and penetrate through the first and second membranes, the electrode region extends from center of the first and second membranes toward but does not reach the ventilation slots. Through design of the first and second membranes and the electrode region, sensitivity of the microphone is increased.

Abstract: Provided is an MEMS device, including: a base, a rear cavity; a vibrating diaphragm, the vibrating diaphragm including an upper diaphragm and a lower diaphragm, and an accommodation space being formed between the upper and lower diaphragms; a counter electrode arranged in the accommodation space; and supporting members concentrically arranged and spaced apart. The supporting members are arranged between the upper and lower diaphragms and are spaced apart from the counter electrode, two opposite ends of each supporting member are connected to the upper and lower diaphragms, and at least one of the supporting members is provided with first cavities. An upper ventilation hole and a lower ventilation hole are respectively formed at a position of the upper diaphragm and a position of the lower diaphragm corresponding to one of the first cavities; and the upper ventilation hole, the first cavity and the lower ventilation hole communicate with each other.

Abstract: Provided is a MEMS device and an electro-acoustic transducer. The MEMS device includes: a substrate having a cavity passing through the substrate; a diaphragm connected to the substrate and covers the cavity. The diaphragm includes oppositely arranged first and second membranes. The first membrane is on one side of the second membrane facing away from the cavity and includes a first protrusion extending away from the second membrane, the first protrusion has a first groove opening towards the second membrane. The second membrane includes a second protrusion extending away from the first membrane and opposite to the first protrusion, the second protrusion has a second groove opening towards the first membrane. By providing first and second protrusions on first and second diaphragms to form a corrugated diaphragm, the internal stress and stiffness of the diaphragm decreases, which effectively increases the mechanical sensitivity of the MEMS device.

Abstract: A microelectromechanical system includes an enclosure defining a cavity and an opening communicating with the cavity; a membrane mounted at the opening; a cantilever located within the cavity, the at least one cantilever comprising a first end, a second end and a fulcrum located between the first end and the second end; a plunger positioned between the membrane and the cantilever and configured to transfer displacement of the membrane to the first end of the cantilever; and a sensing member connected to the second end of the cantilever. The distance between the first end and the fulcrum is less than that between the second end and the fulcrum. The microelectromechanical system has the advantages of high SNR, small package size and high sensitivity. The membrane has a stiffness order of magnitude higher than a conventional membrane, which avoids mechanical collapse and large DC deformation under 1 atm.

Abstract: Provided is a micro-electro-mechanical system and an electro-acoustic conversion device having the micro-electro-mechanical system. The micro-electro-mechanical system includes: first and second membranes arranged opposite to each other; support members arranged between the first and second membranes; and an opening provided on the first and/or second membranes. Each support member includes support walls, and opposite ends of each of the support walls are connected to the first and second membranes. The first and second membranes, and two adjacent support walls in one support member are enclosed to form a first chamber. The opening is configured to link the first chamber with the outside. By arranging a supporting member composed of support walls and providing an opening on the first and/or second membranes, the compliance of the first or second membrane is increased, and the inter-plate capacitance therebetween is reduced.

Abstract: A microphone back panel and a microphone are provided. The microphone back panel is used for a microphone, the microphone includes a diaphragm, and the microphone back panel includes a main body. A side of the main body is provided with a thinned area not in contact with the diaphragm, and a hole is formed in the main body. The main body is provided with a thinned area, thereby increasing flexibility of the microphone back panel. When the microphone back panel is bent, the increased flexibility can reduce the stress load on the microphone back panel, thereby reducing possibility of damage to the microphone back panel. In addition, the main body is provided with a hole, thereby further increasing flexibility of the microphone back panel, and reducing stress load on the microphone back panel and reducing possibility of damage to the microphone back panel.