Abstract: A surface mount device is disclosed. The surface mount device can include an electronic component operable in an electronic circuit. The surface mount device can also include a heat transfer component thermally coupled to the electronic component. The heat transfer component can have a heat transfer surface configured to interface with a heat sink. In addition, the surface mount device can include a resiliently flexible lead to electrically couple the electronic component to a circuit board. The resiliently flexible lead can be configured to resiliently deflect to facilitate a variable distance of the heat transfer surface from the circuit board, to enable the heat transfer surface and a planar heat transfer surface of another similarly configured surface mount device to be substantially aligned for interfacing with the heat sink.

Abstract: A surface mount device is disclosed. The surface mount device can include an electronic component operable in an electronic circuit. The surface mount device can also include a heat transfer component thermally coupled to the electronic component. The heat transfer component can have a heat transfer surface configured to interface with a heat sink. In addition, the surface mount device can include a resiliently flexible lead to electrically couple the electronic component to a circuit board. The resiliently flexible lead can be configured to resiliently deflect to facilitate a variable distance of the heat transfer surface from the circuit board, to enable the heat transfer surface and a planar heat transfer surface of another similarly configured surface mount device to be substantially aligned for interfacing with the heat sink.

Abstract: In accordance with the teachings of the present invention, a method and apparatus for increasing the efficiency of electrical systems are provided. In a particular embodiment, the apparatus comprises a first electrical component including a self-biasing resistor and at least one input terminal coupled to a power supply, and a second electrical component including at least one input terminal coupled to an output terminal of the first electrical component, and an electrical short circuit connected across the self-biasing resistor in the first electrical component such that current from the power supply bypasses the self-biasing resistor.

Abstract: A power amplifier includes amplifier stages. An amplifier stage includes a transistor, and at least one amplifier stage comprises a driver stage. The amplifier stages include a first amplifier stage having a first transistor and associated with a first output power, and a second amplifier stage having a second transistor and associated with a second output power. A current sharing coupling couples the first amplifier stage and the second amplifier stage. The first amplifier stage and the second amplifier stage share a current through the current sharing coupling. The current sharing coupling facilitates scaling of the first output power and the second output power.

Abstract: According to one embodiment of the present invention, an amplifier includes an amplifying transistor coupled to a ground and operable to amplify a received signal. One or more bias components provide a bias resistance for the amplifying transistor. The one or more bias components include a control modulator coupled in series between the amplifying transistor and the ground. The control modulator receives a control signal and modulates the amplifying transistor in response to the control signal.