Patents by Inventor Scott M. MOKLER
Scott M. MOKLER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11923257Abstract: Hybrid microelectronic substrates, and related devices and methods, are disclosed herein. In some embodiments, a hybrid microelectronic substrate may include a low-density microelectronic substrate having a recess at a first surface, and a high-density microelectronic substrate disposed in the recess and coupled to a bottom of the recess via solder.Type: GrantFiled: August 19, 2021Date of Patent: March 5, 2024Assignee: Intel CorporationInventors: Robert Starkston, Robert L. Sankman, Scott M. Mokler, Richard Christopher Stamey, Amruthavalli Pallavi Alur
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Patent number: 11444033Abstract: A hybrid microelectronic substrate may be formed by the incorporation of a high density microelectronic patch substrate within a lower density microelectronic substrate. The hybrid microelectronic substrate may allow for direct flip chip attachment of a microelectronic device having high density interconnections to the high density microelectronic patch substrate portion of the hybrid microelectronic substrate, while allowing for lower density interconnection and electrical routes in areas where high density interconnections are not required.Type: GrantFiled: July 1, 2020Date of Patent: September 13, 2022Assignee: Intel CorporationInventors: Robert Starkston, Robert L. Sankman, Scott M. Mokler, Richard C. Stamey
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Publication number: 20210384094Abstract: Hybrid microelectronic substrates, and related devices and methods, are disclosed herein. In some embodiments, a hybrid microelectronic substrate may include a low-density microelectronic substrate having a recess at a first surface, and a high-density microelectronic substrate disposed in the recess and coupled to a bottom of the recess via solder.Type: ApplicationFiled: August 19, 2021Publication date: December 9, 2021Applicant: Intel CorporationInventors: Robert Starkston, Robert L. Sankman, Scott M. Mokler, Richard Christopher Stamey, Amruthavalli Pallavi Alur
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Patent number: 11114353Abstract: Hybrid microelectronic substrates, and related devices and methods, are disclosed herein. In some embodiments, a hybrid microelectronic substrate may include a low-density microelectronic substrate having a recess at a first surface, and a high-density microelectronic substrate disposed in the recess and coupled to a bottom of the recess via solder.Type: GrantFiled: March 30, 2016Date of Patent: September 7, 2021Assignee: Intel CorporationInventors: Robert Starkston, Robert L. Sankman, Scott M. Mokler, Richard Christopher Stamey, Amruthavalli Pallavi Alur
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Publication number: 20200335444Abstract: A hybrid microelectronic substrate may be formed by the incorporation of a high density microelectronic patch substrate within a lower density microelectronic substrate. The hybrid microelectronic substrate may allow for direct flip chip attachment of a microelectronic device having high density interconnections to the high density microelectronic patch substrate portion of the hybrid microelectronic substrate, while allowing for lower density interconnection and electrical routes in areas where high density interconnections are not required.Type: ApplicationFiled: July 1, 2020Publication date: October 22, 2020Applicant: Intel CorporationInventors: Robert Starkston, Robert L. Sankman, Scott M. Mokler, Richard C. Stamey
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Patent number: 10763215Abstract: A hybrid microelectronic substrate may be formed by the incorporation of a high density microelectronic patch substrate within a lower density microelectronic substrate. The hybrid microelectronic substrate may allow for direct flip chip attachment of a microelectronic device having high density interconnections to the high density microelectronic patch substrate portion of the hybrid microelectronic substrate, while allowing for lower density interconnection and electrical routes in areas where high density interconnections are not required.Type: GrantFiled: December 9, 2015Date of Patent: September 1, 2020Assignee: Intel CorporationInventors: Robert Starkston, Robert L. Sankman, Scott M. Mokler, Richard C. Stamey
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Patent number: 10716214Abstract: A hybrid microelectronic substrate may be formed by the incorporation of a high density microelectronic patch substrate within a lower density microelectronic substrate. The hybrid microelectronic substrate may allow for direct flip chip attachment of a microelectronic device having high density interconnections to the high density microelectronic patch substrate portion of the hybrid microelectronic substrate, while allowing for lower density interconnection and electrical routes in areas where high density interconnections are not required.Type: GrantFiled: December 3, 2015Date of Patent: July 14, 2020Assignee: Intel CorporationInventors: Robert Starkston, Richard C. Stamey, Robert L. Sankman, Scott M. Mokler
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Publication number: 20190057915Abstract: Hybrid microelectronic substrates, and related devices and methods, are disclosed herein. In some embodiments, a hybrid microelectronic substrate may include a low-density microelectronic substrate having a recess at a first surface, and a high-density microelectronic substrate disposed in the recess and coupled to a bottom of the recess via solder.Type: ApplicationFiled: March 30, 2016Publication date: February 21, 2019Applicant: Intel CorporationInventors: Robert Starkston, Robert L. Sankman, Scott M. Mokler, Richard Christopher Stamey, Amruthavalli Pallavi Alur
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Publication number: 20190057937Abstract: A hybrid microelectronic substrate may be formed by the incorporation of a high density microelectronic patch substrate within a lower density microelectronic substrate. The hybrid microelectronic substrate may allow for direct flip chip attachment of a microelectronic device having high density interconnections to the high density microelectronic patch substrate portion of the hybrid microelectronic substrate, while allowing for lower density interconnection and electrical routes in areas where high density interconnections are not required.Type: ApplicationFiled: December 9, 2015Publication date: February 21, 2019Applicant: Intel CorporationInventors: Robert Starkston, Robert L. Sankman, Scott M. Mokler, Richard C. Stamey
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Patent number: 10159152Abstract: Embodiments of the invention include a printed circuit board (PCB) assembly that includes advanced component in cavity (ACC) technology and methods of forming such PCB assemblies. In one embodiment, the PCB assembly may include a PCB that has a cavity formed on a first surface of the PCB. A plurality of contacts may be formed in the cavity. The cavity provides a location where components may be electrically coupled to the PCB. Additionally, a package that is mounted to the PCB may extend over the cavity. Since the package passes directly over the component, the components may be used to electrically couple the package to one or more of the contacts formed in the cavity. Accordingly, embodiments of the invention allow for the surface area used for components to be reduced, and also improves electrical performance of the PCB assembly by positioning the components proximate to the package.Type: GrantFiled: December 21, 2015Date of Patent: December 18, 2018Assignee: Intel CorporationInventors: Ladd D. Campbell, Scott M. Mokler, Juan Landeros, Jr., Michael J. Hill, Jin Zhao
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Publication number: 20180343744Abstract: A hybrid microelectronic substrate may be formed by the incorporation of a high density microelectronic patch substrate within a lower density microelectronic substrate. The hybrid microelectronic substrate may allow for direct flip chip attachment of a microelectronic device having high density interconnections to the high density microelectronic patch substrate portion of the hybrid microelectronic substrate, while allowing for lower density interconnection and electrical routes in areas where high density interconnections are not required.Type: ApplicationFiled: December 3, 2015Publication date: November 29, 2018Applicant: INTEL CORPORATIONInventors: Robert Starkston, Richard C. Stamey, Robert L. Sankman, Scott M. Mokler
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Publication number: 20170181286Abstract: Embodiments of the invention include a printed circuit board (PCB) assembly that includes advanced component in cavity (ACC) technology and methods of forming such PCB assemblies. In one embodiment, the PCB assembly may include a PCB that has a cavity formed on a first surface of the PCB. A plurality of contacts may be formed in the cavity. The cavity provides a location where components may be electrically coupled to the PCB. Additionally, a package that is mounted to the PCB may extend over the cavity. Since the package passes directly over the component, the components may be used to electrically couple the package to one or more of the contacts formed in the cavity. Accordingly, embodiments of the invention allow for the surface area used for components to be reduced, and also improves electrical performance of the PCB assembly by positioning the components proximate to the package.Type: ApplicationFiled: December 21, 2015Publication date: June 22, 2017Inventors: Ladd D. CAMPBELL, Scott M. MOKLER, Juan LANDEROS, Michael HILL, Jin ZHAO