Patents by Inventor Scott M. Mortensen

Scott M. Mortensen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Frame assembly for electrical bond
    Patent number: 7642975
    Abstract: A frame assembly for a composite panel includes a first frame having a first frame contact surface transverse to a first frame mount surface and a second frame having a second frame contact surface transverse to a second frame mount surface, the first frame mount surface receivable within the second frame mount surface to provide a conductive communication path therebetween.
    Type: Grant
    Filed: March 12, 2008
    Date of Patent: January 5, 2010
    Assignee: Sikorsky Aircraft Corporation
    Inventors: Ralph D. Brunks, Scott M. Mortensen
  • FRAME ASSEMBLY FOR ELECTRICAL BOND
    Publication number: 20090231218
    Abstract: A frame assembly for a composite panel includes a first frame having a first frame contact surface transverse to a first frame mount surface and a second frame having a second frame contact surface transverse to a second frame mount surface, the first frame mount surface receivable within the second frame mount surface to provide a conductive communication path therebetween.
    Type: Application
    Filed: March 12, 2008
    Publication date: September 17, 2009
    Inventors: Ralph D. Brunks, Scott M. Mortensen