Patents by Inventor Scott M. Pook

Scott M. Pook has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220037358
    Abstract: Some embodiments include a conductive structure of an integrated circuit. The conductive structure includes an upper primary portion, with the upper primary portion having a first conductive constituent configured as a container. The container has a bottom, and a pair of sidewalls extending upwardly from the bottom. An interior region of the container is over the bottom and between the sidewalls. The upper primary portion includes a second conductive constituent configured as a mass filling the interior region of the container. The second conductive constituent is a different composition than the first conductive constituent. One or more conductive projections join to the upper primary portion and extend downwardly from the upper primary portion. Some embodiments include assemblies comprising memory cells over conductive structures. Some embodiments include methods of forming conductive structures.
    Type: Application
    Filed: October 15, 2021
    Publication date: February 3, 2022
    Applicant: Micron Technology, Inc.
    Inventors: Nancy M. Lomeli, Tom George, Jordan D. Greenlee, Scott M. Pook, John Mark Meldrim
  • Patent number: 11177276
    Abstract: Some embodiments include a conductive structure of an integrated circuit. The conductive structure includes an upper primary portion, with the upper primary portion having a first conductive constituent configured as a container. The container has a bottom, and a pair of sidewalls extending upwardly from the bottom. An interior region of the container is over the bottom and between the sidewalls. The upper primary portion includes a second conductive constituent configured as a mass filling the interior region of the container. The second conductive constituent is a different composition than the first conductive constituent. One or more conductive projections join to the upper primary portion and extend downwardly from the upper primary portion. Some embodiments include assemblies comprising memory cells over conductive structures. Some embodiments include methods of forming conductive structures.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: November 16, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Nancy M. Lomeli, Tom George, Jordan D. Greenlee, Scott M. Pook, John Mark Meldrim
  • Publication number: 20200075620
    Abstract: Some embodiments include a conductive structure of an integrated circuit. The conductive structure includes an upper primary portion, with the upper primary portion having a first conductive constituent configured as a container. The container has a bottom, and a pair of sidewalls extending upwardly from the bottom. An interior region of the container is over the bottom and between the sidewalls. The upper primary portion includes a second conductive constituent configured as a mass filling the interior region of the container. The second conductive constituent is a different composition than the first conductive constituent. One or more conductive projections join to the upper primary portion and extend downwardly from the upper primary portion. Some embodiments include assemblies comprising memory cells over conductive structures. Some embodiments include methods of forming conductive structures.
    Type: Application
    Filed: August 16, 2019
    Publication date: March 5, 2020
    Applicant: Micron Technology, Inc.
    Inventors: Nancy M. Lomeli, Tom George, Jordan D. Greenlee, Scott M. Pook, John Mark Meldrim
  • Patent number: 10424596
    Abstract: Some embodiments include a conductive structure of an integrated circuit. The conductive structure includes an upper primary portion, with the upper primary portion having a first conductive constituent configured as a container. The container has a bottom, and a pair of sidewalls extending upwardly from the bottom. An interior region of the container is over the bottom and between the sidewalls. The upper primary portion includes a second conductive constituent configured as a mass filling the interior region of the container. The second conductive constituent is a different composition than the first conductive constituent. One or more conductive projections join to the upper primary portion and extend downwardly from the upper primary portion. Some embodiments include assemblies comprising memory cells over conductive structures. Some embodiments include methods of forming conductive structures.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: September 24, 2019
    Assignee: Micron Technology, Inc.
    Inventors: Nancy M. Lomeli, Tom George, Jordan D. Greenlee, Scott M. Pook, John Mark Meldrim
  • Publication number: 20190198518
    Abstract: Some embodiments include a conductive structure of an integrated circuit. The conductive structure includes an upper primary portion, with the upper primary portion having a first conductive constituent configured as a container. The container has a bottom, and a pair of sidewalls extending upwardly from the bottom. An interior region of the container is over the bottom and between the sidewalls. The upper primary portion includes a second conductive constituent configured as a mass filling the interior region of the container. The second conductive constituent is a different composition than the first conductive constituent. One or more conductive projections join to the upper primary portion and extend downwardly from the upper primary portion. Some embodiments include assemblies comprising memory cells over conductive structures. Some embodiments include methods of forming conductive structures.
    Type: Application
    Filed: December 22, 2017
    Publication date: June 27, 2019
    Inventors: Nancy M. Lomeli, Tom George, Jordan D. Greenlee, Scott M. Pook, John Mark Meldrim
  • Patent number: 10269824
    Abstract: Conductive channel technology is disclosed. In one example, a memory component can include a source line, a conductive channel having first and second conductive layers electrically coupled to the source line and memory cells adjacent to the conductive channel. In one aspect, channel conductivity and reliability is improved over a single layer conductive channel formation scheme by preventing unwanted oxide formation, increasing the interface contact area, and by modulating material grain size and boundaries via multiple thin channel integration scheme. Associated systems and methods are also disclosed.
    Type: Grant
    Filed: April 1, 2017
    Date of Patent: April 23, 2019
    Assignee: Intel Corporation
    Inventors: Changhan Kim, Scott M. Pook
  • Publication number: 20180286874
    Abstract: Conductive channel technology is disclosed. In one example, a memory component can include a source line, a conductive channel having first and second conductive layers electrically coupled to the source line and memory cells adjacent to the conductive channel. In one aspect, channel conductivity and reliability is improved over a single layer conductive channel formation scheme by preventing unwanted oxide formation, increasing the interface contact area, and by modulating material grain size and boundaries via multiple thin channel integration scheme. Associated systems and methods are also disclosed.
    Type: Application
    Filed: April 1, 2017
    Publication date: October 4, 2018
    Applicant: Intel Corporation
    Inventors: Changhan Kim, Scott M. Pook